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Version 1.00 |
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Version 1.1.0 |
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11 |
1.5 Conventions 15 |
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1.5 Background 16 |
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1.6 Background 16 |
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1.6 Overview 18 |
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1.7 Overview 18 |
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1.6.1 Mechanical Form Factor Overview 18 |
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1.7.1 Mechanical Form Factor Overview 18 |
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1.6.2 Electrical Overview 20 |
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1.7.2 Electrical Overview 20 |
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1.6.2.1 Primary Connector 20 |
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16 |
1.7.2.1 Primary Connector 20 |
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1.6.2.2 Secondary Connector 21 |
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17 |
1.7.2.2 Secondary Connector 21 |
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1.7 Non-NIC Use Cases 21 |
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1.8 Non-NIC Use Cases 21 |
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2 Mechanical Card Form Factor 22 |
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2 Mechanical Card Form Factor 23 |
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2.1 Form Factor Options 22 |
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2.1 Form Factor Options 23 |
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2.1.1 SFF Faceplate Configurations 24 |
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21 |
2.1.1 SFF Faceplate Configurations 25 |
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2.1.2 LFF Faceplate Configurations 28 |
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2.1.2 LFF Faceplate Configurations 29 |
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2.2 Line Side I/O Implementations 32 |
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23 |
2.2 Line Side I/O Implementations 33 |
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2.3 Top Level Assembly (SFF and LFF) 33 |
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24 |
2.3 Top Level Assembly (SFF and LFF) 34 |
24 |
2.4 Faceplate Subassembly (SFF and LFF) 34 |
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25 |
2.4 Faceplate Subassembly (SFF and LFF) 35 |
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2.4.1 Faceplate Subassembly – Exploded View 34 |
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26 |
2.4.1 Faceplate Subassembly – Exploded View 35 |
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2.4.2 Faceplate Subassembly – Bill of Materials (BOM) 34 |
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27 |
2.4.2 Faceplate Subassembly – Bill of Materials (BOM) 35 |
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2.4.3 SFF Generic I/O Faceplate 37 |
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28 |
2.4.3 SFF Generic I/O Faceplate 38 |
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2.4.4 LFF Generic I/O Faceplate 38 |
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29 |
2.4.4 LFF Generic I/O Faceplate 39 |
29 |
2.4.5 Ejector Lever (SFF) 39 |
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30 |
2.4.5 Ejector Lever (SFF) 40 |
30 |
2.4.6 Ejector Levers (LFF) 40 |
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31 |
2.4.6 Ejector Levers (LFF) 41 |
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2.4.7 Ejector Lock (SFF and LFF) 41 |
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32 |
2.4.7 Ejector Lock (SFF and LFF) 42 |
32 |
2.4.8 Clinch Nut (SFF and LFF) 42 |
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33 |
2.4.8 Clinch Nut (SFF and LFF) 43 |
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2.5 Card Keep Out Zones 43 |
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34 |
2.5 Card Keep Out Zones 44 |
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2.5.1 SFF Keep Out Zones 43 |
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35 |
2.5.1 SFF Keep Out Zones 44 |
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2.5.2 LFF Keep Out Zones 46 |
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36 |
2.5.2 LFF Keep Out Zones 49 |
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2.6 Baseboard Keep Out Zones 49 |
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37 |
2.6 Baseboard Keep Out Zones 54 |
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2.7 Insulation Requirements 50 |
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2.7 Insulation Requirements 55 |
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2.7.1 SFF Insulator 50 |
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39 |
2.7.1 SFF Insulator 55 |
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2.7.2 LFF Insulator 52 |
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40 |
2.7.2 LFF Insulator 57 |
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2.8 Critical-to-Function (CTF) Dimensions (SFF and LFF) 55 |
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2.8 Critical-to-Function (CTF) Dimensions (SFF and LFF) 60 |
41 |
2.8.1 CTF Tolerances 55 |
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42 |
2.8.1 CTF Tolerances 60 |
42 |
2.8.2 SFF Pull Tab CTF Dimensions 55 |
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43 |
2.8.2 SFF Pull Tab CTF Dimensions 60 |
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2.8.3 SFF Ejector Latch CTF Dimensions 57 |
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44 |
2.8.3 SFF Ejector Latch CTF Dimensions 64 |
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2.8.4 SFF Internal Lock CTF Dimensions 58 |
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2.8.4 SFF Internal Lock CTF Dimensions 67 |
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2.8.5 SFF Baseboard CTF Dimensions 59 |
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46 |
2.8.5 SFF Baseboard CTF Dimensions 70 |
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2.8.6 LFF Ejector Latch CTF Dimensions 62 |
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47 |
2.8.6 LFF Ejector Latch CTF Dimensions 73 |
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2.8.7 LFF Baseboard CTF Dimensions 63 |
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48 |
2.8.7 LFF Baseboard CTF Dimensions 76 |
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2.9 Labeling Requirements 66 |
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49 |
2.9 Labeling Requirements 79 |
49 |
2.9.1 General Guidelines for Label Contents 66 |
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50 |
2.9.1 General Guidelines for Label Contents 79 |
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2.9.2 MAC Address Labeling Requirements 67 |
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51 |
2.9.2 MAC Address Labeling Requirements 80 |
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2.9.2.1 MAC Address Label Example 1 – Quad Port with Single Host, Single Managed Controller 68 |
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52 |
2.9.2.1 MAC Address Label Example 1 – Quad Port with Single Host, Single Managed Controller 81 |
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2.9.2.2 MAC Address Label Example 2 – Octal Port with Single Host, Dual Managed Controllers 68 |
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53 |
2.9.2.2 MAC Address Label Example 2 – Octal Port with Single Host, Dual Managed Controllers 81 |
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2.9.2.3 MAC Address Label Example 3 – Quad Port with Dual Hosts, Dual Managed Controllers 69 |
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54 |
2.9.2.3 MAC Address Label Example 3 – Quad Port with Dual Hosts, Dual Managed Controllers 82 |
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2.9.2.4 MAC Address Label Example 4 – Singe Port with Quad Host, Single Managed Controller 69 |
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2.9.2.4 MAC Address Label Example 4 – Singe Port with Quad Host, Single Managed Controller 82 |
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2.10 Mechanical CAD Package Examples 71 |
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56 |
2.10 Mechanical CAD Package Examples 84 |
56 |
3 Electrical Interface Definition – Card Edge and Baseboard 72 |
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57 |
3 Electrical Interface Definition – Card Edge and Baseboard 85 |
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3.1 Card Edge Gold Finger Requirements 72 |
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58 |
3.1 Card Edge Gold Finger Requirements 85 |
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3.1.1 Gold Finger Mating Sequence 74 |
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59 |
3.1.1 Gold Finger Mating Sequence 87 |
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3.2 Baseboard Connector Requirements 78 |
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60 |
3.2 Baseboard Connector Requirements 91 |
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3.2.1 Right Angle Connector 78 |
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61 |
3.2.1 Right Angle Connector 91 |
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3.2.2 Right Angle Offset 79 |
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62 |
3.2.2 Right Angle Offset 92 |
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3.2.3 Straddle Mount Connector 79 |
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63 |
3.2.3 Straddle Mount Connector 92 |
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3.2.4 Straddle Mount Offset and PCB Thickness Options 81 |
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64 |
3.2.4 Straddle Mount Offset and PCB Thickness Options 94 |
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3.2.5 LFF Connector Locations 82 |
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65 |
3.2.5 LFF Connector Locations 95 |
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3.3 Pin Definition 82 |
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66 |
3.3 Pin Definition 95 |
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3.3.1 Primary Connector 83 |
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67 |
3.3.1 Primary Connector 96 |
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3.3.2 Secondary Connector 85 |
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68 |
3.3.2 Secondary Connector 98 |
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3.4 Signal Descriptions 86 |
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69 |
3.4 Signal Descriptions 99 |
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3.4.1 PCIe Interface Pins 86 |
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70 |
3.4.1 PCIe Interface Pins 99 |
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3.4.2 PCIe Present and Bifurcation Control Pins 92 |
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71 |
3.4.2 PCIe Present and Bifurcation Control Pins 105 |
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3.4.3 SMBus Interface Pins 95 |
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3.4.3 SMBus Interface Pins 108 |
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3.4.4 NC-SI over RBT Interface Pins 96 |
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3.4.4 NC-SI over RBT Interface Pins 109 |
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3.4.5 Scan Chain Pins 104 |
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3.4.5 Scan Chain Pins 117 |
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3.4.6 Power Supply Pins 111 |
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3.4.6 Power Supply Pins 126 |
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3.4.7 USB 2.0 (A68/A69) – Primary Connector Only 117 |
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76 |
3.4.7 USB 2.0 (A68/A69) – Primary Connector Only 131 |
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3.4.8 UART (A68/A69) – Secondary Connector Only 119 |
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3.4.8 UART (A68/A69) – Secondary Connector Only 133 |
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3.4.9 RFU[1:4] Pins 121 |
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3.4.9 RFU[1:4] Pins 135 |
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3.5 PCIe Bifurcation Mechanism 122 |
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79 |
3.5 PCIe Bifurcation Mechanism 136 |
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3.5.1 PCIe OCP NIC 3.0 Card to Baseboard Bifurcation Configuration (PRSNTA#, PRSNTB[3:0]#) 122 |
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3.5.1 PCIe OCP NIC 3.0 Card to Baseboard Bifurcation Configuration (PRSNTA#, PRSNTB[3:0]#) 136 |
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3.5.2 PCIe Baseboard to OCP NIC 3.0 Card Bifurcation Configuration (BIF[2:0]#) 122 |
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81 |
3.5.2 PCIe Baseboard to OCP NIC 3.0 Card Bifurcation Configuration (BIF[2:0]#) 136 |
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3.5.3 PCIe Bifurcation Decoder 123 |
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82 |
3.5.3 PCIe Bifurcation Decoder 137 |
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3.5.4 Bifurcation Detection Flow 125 |
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3.5.4 Bifurcation Detection Flow 139 |
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3.5.5 PCIe Bifurcation Examples 126 |
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84 |
3.5.5 PCIe Bifurcation Examples 140 |
84 |
3.5.5.1 Single Host (1 x16) Baseboard with a 1 x16 OCP NIC 3.0 Card (Single Controller) 126 |
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85 |
3.5.5.1 Single Host (1 x16) Baseboard with a 1 x16 OCP NIC 3.0 Card (Single Controller) 140 |
85 |
3.5.5.2 Single Host (2 x8) Baseboard with a 2 x8 OCP NIC 3.0 Card (Dual Controllers) 127 |
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86 |
3.5.5.2 Single Host (2 x8) Baseboard with a 2 x8 OCP NIC 3.0 Card (Dual Controllers) 141 |
86 |
3.5.5.3 Quad Host (4 x4) Baseboard with a 4 x4 OCP NIC 3.0 Card (Single Controller) 128 |
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87 |
3.5.5.3 Quad Host (4 x4) Baseboard with a 4 x4 OCP NIC 3.0 Card (Single Controller) 142 |
87 |
3.5.5.4 Quad Host (4 x4) Baseboard with a 4 x4 OCP NIC 3.0 Card (Quad Controllers) 129 |
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88 |
3.5.5.4 Quad Host (4 x4) Baseboard with a 4 x4 OCP NIC 3.0 Card (Quad Controllers) 143 |
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3.5.5.5 Single Host (1 x16, no Bifurcation) Baseboard with a 2 x8 OCP NIC 3.0 Card (Dual Controller) 130 |
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89 |
3.5.5.5 Single Host (1 x16, no Bifurcation) Baseboard with a 2 x8 OCP NIC 3.0 Card (Dual Controller) 144 |
89 |
3.6 PCIe REFCLK and PERST# Mapping 131 |
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90 |
3.6 PCIe REFCLK and PERST# Mapping 145 |
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3.6.1 SFF PCIe REFCLK and PERST# Mapping 132 |
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91 |
3.6.1 SFF PCIe REFCLK and PERST# Mapping 146 |
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3.6.2 LFF PCIe REFCLK and PERST# Mapping 135 |
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92 |
3.6.2 LFF PCIe REFCLK and PERST# Mapping 149 |
92 |
3.6.3 REFCLK and PERST# Mapping Expansion 137 |
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93 |
3.6.3 REFCLK and PERST# Mapping Expansion 151 |
93 |
3.7 Port Numbering and LED Implementations 138 |
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94 |
3.7 Port Numbering and LED Implementations 152 |
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3.7.1 OCP NIC 3.0 Port Naming and Port Numbering 138 |
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95 |
3.7.1 OCP NIC 3.0 Port Naming and Port Numbering 152 |
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3.7.2 OCP NIC 3.0 Card LED Configuration 138 |
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96 |
3.7.2 OCP NIC 3.0 Card LED Configuration 152 |
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3.7.3 OCP NIC 3.0 Card LED Ordering 140 |
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97 |
3.7.3 OCP NIC 3.0 Card LED Ordering 154 |
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3.7.4 Baseboard LEDs Configuration over the Scan Chain 141 |
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98 |
3.7.4 Baseboard LEDs Configuration over the Scan Chain 155 |
98 |
3.8 Power State Machine 143 |
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99 |
3.8 Power State Machine 157 |
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3.8.1 NIC Power Off 144 |
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100 |
3.8.1 NIC Power Off 160 |
100 |
3.8.2 ID Mode 144 |
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101 |
3.8.2 ID Mode 160 |
101 |
3.8.3 Aux Power Mode (S5) 144 |
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102 |
3.8.3 Aux Power Mode 161 |
102 |
3.8.4 Main Power Mode (S0) 145 |
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103 |
3.8.4 Main Power Mode 161 |
103 |
3.8.5 Programming Mode 145 |
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104 |
3.8.5 Programming Mode 161 |
104 |
3.9 Power Supply Rail Requirements and Slot Power Envelopes 146 |
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105 |
3.9 Power Supply Rail Requirements and Slot Power Envelopes 163 |
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3.10 Hot Swap Considerations for +12V_EDGE and +3.3V_EDGE Rails 147 |
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106 |
3.10 Hot Swap Considerations for +12V_EDGE and +3.3V_EDGE Rails 164 |
106 |
3.11 Power Sequence Timing Requirements 148 |
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107 |
3.11 Power Sequence Timing Requirements 166 |
107 |
3.12 Digital I/O Specifications 152 |
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108 |
3.12 Digital I/O Specifications 176 |
108 |
4 Management and Pre-OS Requirements 153 |
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109 |
4 Management and Pre-OS Requirements 177 |
109 |
4.1 Sideband Management Interface and Transport 153 |
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110 |
4.1 Sideband Management Interface and Transport 177 |
110 |
4.2 NC-SI Traffic 154 |
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111 |
4.2 NC-SI Traffic 178 |
111 |
4.3 Management Controller (MC) MAC Address Provisioning 154 |
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112 |
4.3 Management Controller (MC) MAC Address Provisioning 178 |
112 |
4.4 ASIC Die Temperature Reporting 156 |
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113 |
4.4 ASIC Die Temperature Reporting 180 |
113 |
4.5 Power Consumption Reporting 158 |
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114 |
4.5 Power Consumption Reporting 183 |
114 |
4.6 Pluggable Transceiver Module Status and Temperature Reporting 159 |
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115 |
4.6 Pluggable Transceiver Module Status and Temperature Reporting 184 |
115 |
4.7 Management and Pre-OS Firmware Inventory and Update 159 |
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116 |
4.7 Management and Pre-OS Firmware Inventory and Update 184 |
116 |
4.7.1 Secure Firmware 160 |
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117 |
4.7.1 Secure Firmware 184 |
117 |
4.7.2 Firmware Inventory 160 |
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118 |
4.7.2 Firmware Inventory 185 |
118 |
4.7.3 Firmware Inventory and Update in Multi-Host Environments 160 |
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119 |
4.7.3 Firmware Inventory and Update in Multi-Host Environments 185 |
119 |
4.8 NC-SI Package Addressing and Hardware Arbitration Requirements 161 |
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120 |
4.8 NC-SI Package Addressing and Hardware Arbitration Requirements 186 |
120 |
4.8.1 NC-SI over RBT Package Addressing 161 |
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121 |
4.8.1 NC-SI over RBT Package Addressing 186 |
121 |
4.8.2 Arbitration Ring Connections 161 |
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122 |
4.8.2 Arbitration Ring Connections 186 |
122 |
4.9 SMBus 2.0 Addressing Requirements 161 |
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123 |
4.9 SMBus 2.0 Addressing Requirements 186 |
123 |
4.9.1 SMBus Address Map 162 |
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124 |
4.9.1 SMBus Address Map 187 |
124 |
4.10 FRU EEPROM 162 |
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125 |
4.10 FRU EEPROM 187 |
125 |
4.10.1 FRU EEPROM Addressing and Size 162 |
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126 |
4.10.1 FRU EEPROM Addressing and Size 187 |
126 |
4.10.2 FRU EEPROM Write Protection 164 |
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127 |
4.10.2 FRU EEPROM Write Protection 189 |
127 |
4.10.3 FRU EEPROM Content Requirements 164 |
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128 |
4.10.3 FRU EEPROM Content Requirements 189 |
128 |
4.10.4 FRU Template 170 |
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129 |
4.10.4 FRU Template 196 |
129 |
5 Routing Guidelines and Signal Integrity Considerations 171 |
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130 |
5 Routing Guidelines and Signal Integrity Considerations 197 |
130 |
5.1 NC-SI over RBT 171 |
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131 |
5.1 NC-SI over RBT 197 |
131 |
5.1.1 SFF Baseboard Requirements 172 |
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132 |
5.1.1 SFF Baseboard Requirements 198 |
132 |
5.1.2 LFF Baseboard Requirements 173 |
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133 |
5.1.2 LFF Baseboard Requirements 199 |
133 |
5.1.3 SFF OCP NIC 3.0 Card Requirements 173 |
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134 |
5.1.3 SFF OCP NIC 3.0 Card Requirements 199 |
134 |
5.1.4 LFF OCP NIC 3.0 Card Requirements 174 |
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135 |
5.1.4 LFF OCP NIC 3.0 Card Requirements 200 |
135 |
5.2 SMBus 2.0 174 |
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136 |
5.2 SMBus 2.0 200 |
136 |
5.3 PCIe 175 |
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137 |
5.3 PCIe 201 |
137 |
5.3.1 Channel Requirements 175 |
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138 |
5.3.1 Channel Requirements 201 |
138 |
5.3.1.1 REFCLK requirements 175 |
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139 |
5.3.1.1 REFCLK requirements 201 |
139 |
5.3.1.2 Add-in Card Electrical Budgets 175 |
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140 |
5.3.1.2 Add-in Card Electrical Budgets 201 |
140 |
5.3.1.3 Baseboard Channel Budget 175 |
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141 |
5.3.1.3 Baseboard Channel Budget 202 |
141 |
5.3.1.4 SFF-TA-1002 Connector Channel Budget 175 |
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142 |
5.3.1.4 SFF-TA-1002 Connector Channel Budget 202 |
142 |
5.3.1.5 Differential Impedance (Informative) 175 |
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143 |
5.3.1.5 Differential Impedance (Informative) 202 |
143 |
5.3.2 Test Fixtures 176 |
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144 |
5.3.2 Test Fixtures 202 |
144 |
5.3.2.1 Compliance Load Board (CLB) 176 |
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145 |
5.3.2.1 Compliance Load Board (CLB) 203 |
145 |
5.3.2.2 Compliance Baseboard (CBB) 177 |
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146 |
5.3.2.2 Compliance Baseboard (CBB) 204 |
146 |
5.3.3 Test Methodology 177 |
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147 |
5.3.3 Test Methodology 204 |
147 |
5.3.3.1 Test Setup 177 |
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148 |
5.3.3.1 Test Setup 204 |
148 |
6 Thermal and Environmental 178 |
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149 |
6 Thermal and Environmental 206 |
149 |
6.1 Airflow Direction 178 |
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150 |
6.1 Airflow Direction 206 |
150 |
6.1.1 Hot Aisle Cooling 178 |
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151 |
6.1.1 Hot Aisle Cooling 206 |
151 |
6.1.2 Cold Aisle Cooling 179 |
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152 |
6.1.2 Cold Aisle Cooling 207 |
152 |
6.2 Thermal Design Guidelines 180 |
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153 |
6.2 Thermal Design Guidelines 208 |
153 |
6.2.1 SFF Card ASIC Cooling – Hot Aisle 180 |
|
154 |
6.2.1 SFF Card ASIC Cooling – Hot Aisle 208 |
154 |
6.2.2 LFF Card ASIC Cooling – Hot Aisle 184 |
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155 |
6.2.2 LFF Card ASIC Cooling – Hot Aisle 212 |
155 |
6.2.3 SFF Card ASIC Cooling – Cold Aisle 186 |
|
156 |
6.2.3 SFF Card ASIC Cooling – Cold Aisle 214 |
156 |
6.2.4 LFF Card ASIC Cooling – Cold Aisle 189 |
|
157 |
6.2.4 LFF Card ASIC Cooling – Cold Aisle 217 |
157 |
6.3 Thermal Simulation (CFD) Modeling 191 |
|
158 |
6.3 Thermal Simulation (CFD) Modeling 219 |
158 |
6.4 Thermal Test Fixture 191 |
|
159 |
6.4 Thermal Test Fixture 219 |
159 |
6.4.1 Test Fixture for SFF Card 192 |
|
160 |
6.4.1 Test Fixture for SFF Card 220 |
160 |
6.4.2 Test Fixture for LFF Card 194 |
|
161 |
6.4.2 Test Fixture for LFF Card 222 |
161 |
6.4.3 Test Fixture Airflow Direction 196 |
|
162 |
6.4.3 Test Fixture Airflow Direction 224 |
162 |
6.4.4 Thermal Test Fixture Candlestick Sensors 196 |
|
163 |
6.4.4 Thermal Test Fixture Candlestick Sensors 224 |
163 |
6.5 Card Sensor Requirements 198 |
|
164 |
6.5 Card Sensor Requirements 227 |
164 |
6.6 Card Cooling Tiers 198 |
|
165 |
6.6 Card Cooling Tiers 227 |
165 |
6.7 Non-Operational Shock & Vibration Testing 200 |
|
166 |
6.7 Non-Operational Shock & Vibration Testing 229 |
166 |
6.7.1 Shock & Vibe Test Fixture 200 |
|
167 |
6.7.1 Shock & Vibe Test Fixture 229 |
167 |
6.7.2 Test Procedure 201 |
|
168 |
6.7.2 Test Procedure 230 |
168 |
6.8 Dye and Pull Test Method 203 |
|
169 |
6.8 Dye and Pull Test Method 232 |
169 |
6.9 Gold Finger Plating Requirements 205 |
|
170 |
6.9 Gold Finger Plating Requirements 234 |
170 |
6.9.1 Host Side Gold Finger Plating Requirements 205 |
|
171 |
6.9.1 Host Side Gold Finger Plating Requirements 234 |
171 |
6.9.2 Line Side Gold Finger Durability Requirements 205 |
|
172 |
6.9.2 Line Side Gold Finger Durability Requirements 234 |
172 |
7 Regulatory 206 |
|
173 |
7 Regulatory 235 |
173 |
7.1 Required Compliance 206 |
|
174 |
7.1 Required Compliance 235 |
174 |
7.1.1 Required Environmental Compliance 206 |
|
175 |
7.1.1 Required Environmental Compliance 235 |
175 |
7.1.2 Required EMC Compliance 206 |
|
176 |
7.1.2 Required EMC Compliance 235 |
176 |
7.1.3 Required Product Safety Compliance 207 |
|
177 |
7.1.3 Required Product Safety Compliance 236 |
177 |
7.1.4 Required Immunity (ESD) Compliance 207 |
|
178 |
7.1.4 Required Immunity (ESD) Compliance 236 |
178 |
7.2 Recommended Compliance 208 |
|
179 |
7.2 Recommended Compliance 237 |
179 |
7.2.1 Recommended Environmental Compliance 208 |
|
180 |
7.2.1 Recommended Environmental Compliance 237 |
180 |
7.2.2 Recommended EMC Compliance 208 |
|
181 |
7.2.2 Recommended EMC Compliance 237 |
181 |
8 Revision History 209 |
|
182 |
8 Revision History 238 |
182 |
8.1 Document Revision History 209 |
|
183 |
8.1 Document Revision History 238 |
183 |
8.2 FRU Content Revision History 215 |
|
184 |
8.2 FRU Content Revision History 246 |
|
188 |
Figure 4: Primary Connector (4C+) and Secondary Connector (4C) (LFF) OCP NIC 3.0 Cards 22 |
<> |
189 |
Figure 4: Primary Connector (4C+) and Secondary Connector (4C) (LFF) OCP NIC 3.0 Cards 23 |
189 |
Figure 5: Primary Connector (4C+) Only (LFF) OCP NIC 3.0 Cards 23 |
|
190 |
Figure 5: Primary Connector (4C+) Only (LFF) OCP NIC 3.0 Cards 24 |
190 |
Figure 6: Primary Connector (4C+) with 4C and 2C (SFF) OCP NIC 3.0 Cards 23 |
|
191 |
Figure 6: Primary Connector (4C+) with 4C and 2C (SFF) OCP NIC 3.0 Cards 24 |
191 |
Figure 7: SFF NIC Configuration Views 25 |
|
192 |
Figure 7: SFF NIC Configuration Views 26 |
192 |
Figure 8: SFF NIC Line Side 3D Views 26 |
|
193 |
Figure 8: SFF NIC Line Side 3D Views 27 |
193 |
Figure 9: SFF NIC Chassis Mounted 3D Views 27 |
|
194 |
Figure 9: SFF NIC Chassis Mounted 3D Views 28 |
194 |
Figure 10: LFF NIC Configuration Views 29 |
|
195 |
Figure 10: LFF NIC Configuration Views 30 |
195 |
Figure 11: LFF NIC Line Side 3D Views 30 |
|
196 |
Figure 11: LFF NIC Line Side 3D Views 31 |
196 |
Figure 12: LFF NIC Chassis Mounted 3D Views 31 |
|
197 |
Figure 12: LFF NIC Chassis Mounted 3D Views 32 |
197 |
Figure 13: PBA Exploded Views (SFF and LFF) 33 |
|
198 |
Figure 13: PBA Exploded Views (SFF and LFF) 34 |
198 |
Figure 14: Faceplate Assembly Exploded Views (SFF and LFF) 34 |
|
199 |
Figure 14: Faceplate Assembly Exploded Views (SFF and LFF) 35 |
199 |
Figure 15: SFF Generic I/O Faceplate with Pulltab Version (2D View) 37 |
|
200 |
Figure 15: SFF Generic I/O Faceplate with Pulltab Version (2D View) 38 |
200 |
Figure 16: SFF Generic I/O Faceplate – Ejector Version (2D View) 37 |
|
201 |
Figure 16: SFF Generic I/O Faceplate – Ejector Version (2D View) 38 |
201 |
Figure 17: SFF Generic I/O Faceplate – Internal Lock Version (2D View) 38 |
|
202 |
Figure 17: SFF Generic I/O Faceplate – Internal Lock Version (2D View) 39 |
202 |
Figure 18: LFF Generic I/O Faceplate – Ejector Version (2D View) 38 |
|
203 |
Figure 18: LFF Generic I/O Faceplate – Ejector Version (2D View) 39 |
203 |
Figure 19: SFF I/O Faceplate – Ejector Lever (2D View) 39 |
|
204 |
Figure 19: SFF I/O Faceplate – Ejector Lever (2D View) 40 |
204 |
Figure 20: LFF I/O Faceplate – Ejector Lever (2D View) 40 |
|
205 |
Figure 20: LFF I/O Faceplate – Ejector Lever (2D View) 41 |
205 |
Figure 21: Ejector Lock 41 |
|
206 |
Figure 21: Ejector Lock 42 |
206 |
Figure 22: Clinch Nut Option A 42 |
|
207 |
Figure 22: Clinch Nut Option A 43 |
207 |
Figure 23: Clinch Nut Option B 42 |
|
208 |
Figure 23: Clinch Nut Option B 43 |
208 |
Figure 24: SFF Keep Out Zone – Top View 43 |
|
209 |
Figure 24: SFF Keep Out Zone – Top View 44 |
209 |
Figure 25: SFF Keep Out Zone – Top View – Detail A 44 |
|
210 |
Figure 25: SFF Keep Out Zone – Top View – Detail A 47 |
210 |
Figure 26: SFF Keep Out Zone – Bottom View 44 |
|
211 |
Figure 26: SFF Keep Out Zone – Bottom View 47 |
211 |
Figure 27: SFF Keep Out Zone – Side View 45 |
|
212 |
Figure 27: SFF Keep Out Zone – Side View 48 |
212 |
Figure 28: SFF Keep Out Zone – Side View – Detail D 45 |
|
213 |
Figure 28: SFF Keep Out Zone – Side View – Detail D 48 |
213 |
Figure 29: LFF Keep Out Zone – Top View 46 |
|
214 |
Figure 29: LFF Keep Out Zone – Top View 49 |
214 |
Figure 30: LFF Keep Out Zone – Top View – Detail A 47 |
|
215 |
Figure 30: LFF Keep Out Zone – Top View – Detail A 52 |
215 |
Figure 31: LFF Keep Out Zone – Bottom View 48 |
|
216 |
Figure 31: LFF Keep Out Zone – Bottom View 53 |
216 |
Figure 32: LFF Keep Out Zone – Side View 48 |
|
217 |
Figure 32: LFF Keep Out Zone – Side View 53 |
217 |
Figure 33: LFF Keep Out Zone – Side View – Detail D 49 |
|
218 |
Figure 33: LFF Keep Out Zone – Side View – Detail D 54 |
218 |
Figure 34: SFF Bottom Side Insulator (3D View) 50 |
|
219 |
Figure 34: SFF Bottom Side Insulator (3D View) 55 |
219 |
Figure 35: SFF Bottom Side Insulator (Top and Side View) 51 |
|
220 |
Figure 35: SFF Bottom Side Insulator (Top and Side View) 56 |
220 |
Figure 36: SFF Bottom Side Insulator (alternate) (Top and Side View) 52 |
|
221 |
Figure 36: SFF Bottom Side Insulator (alternate) (Top and Side View) 57 |
221 |
Figure 37: LFF Bottom Side Insulator (3D View) 52 |
|
222 |
Figure 37: LFF Bottom Side Insulator (3D View) 57 |
222 |
Figure 38: LFF Bottom Side Insulator (Top and Side View) 53 |
|
223 |
Figure 38: LFF Bottom Side Insulator (Top and Side View) 58 |
223 |
Figure 39: LFF Bottom Side Insulator (alternate) (Top and Side View) 54 |
|
224 |
Figure 39: LFF Bottom Side Insulator (alternate) (Top and Side View) 59 |
224 |
Figure 40: SFF OCP NIC 3.0 Card with Pull Tab CTF Dimensions (Top View) 55 |
|
225 |
Figure 40: SFF OCP NIC 3.0 Card with Pull Tab CTF Dimensions (Top View) 60 |
225 |
Figure 41: SFF OCP NIC 3.0 Card with Pull Tab CTF Dimensions (Front View) 56 |
|
226 |
Figure 41: SFF OCP NIC 3.0 Card with Pull Tab CTF Dimensions (Front View) 62 |
226 |
Figure 42: SFF OCP NIC 3.0 Card with Pull Tab CTF Dimensions (Side View) 56 |
|
227 |
Figure 42: SFF OCP NIC 3.0 Card with Pull Tab CTF Dimensions (Side View) 62 |
227 |
Figure 43: SFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Top View) 57 |
|
228 |
Figure 43: SFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Top View) 64 |
228 |
Figure 44: SFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Front View) 57 |
|
229 |
Figure 44: SFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Front View) 66 |
229 |
Figure 45: SFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Side View) 58 |
|
230 |
Figure 45: SFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Side View) 67 |
230 |
Figure 46: SFF OCP NIC 3.0 Card with Internal Lock CTF Dimensions (Top View) 58 |
|
231 |
Figure 46: SFF OCP NIC 3.0 Card with Internal Lock CTF Dimensions (Top View) 67 |
231 |
Figure 47: SFF OCP NIC 3.0 Card with Internal Lock CTF Dimensions (Front View) 59 |
|
232 |
Figure 47: SFF OCP NIC 3.0 Card with Internal Lock CTF Dimensions (Front View) 70 |
232 |
Figure 48: SFF OCP NIC 3.0 Card with Internal Lock CTF Dimensions (Side View) 59 |
|
233 |
Figure 48: SFF OCP NIC 3.0 Card with Internal Lock CTF Dimensions (Side View) 70 |
233 |
Figure 49: SFF Baseboard Chassis CTF Dimensions (Rear View) 59 |
|
234 |
Figure 49: SFF Baseboard Chassis CTF Dimensions (Rear View) 70 |
234 |
Figure 50: SFF Baseboard Chassis to Card Thumb Screw CTF Dimensions (Side View) 60 |
|
235 |
Figure 50: SFF Baseboard Chassis to Card Thumb Screw CTF Dimensions (Side View) 71 |
235 |
Figure 51: SFF Baseboard Chassis to Ejector lever Card CTF Dimensions (Side View) 60 |
|
236 |
Figure 51: SFF Baseboard Chassis to Ejector lever Card CTF Dimensions (Side View) 71 |
236 |
Figure 52: SFF Baseboard Chassis CTF Dimensions (Rear Rail Guide View) 60 |
|
237 |
Figure 52: SFF Baseboard Chassis CTF Dimensions (Rear Rail Guide View) 71 |
237 |
Figure 53: SFF Baseboard Chassis CTF Dimensions (Rail Guide Detail) – Detail C 61 |
|
238 |
Figure 53: SFF Baseboard Chassis CTF Dimensions (Rail Guide Detail) – Detail C 72 |
238 |
Figure 54: LFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Top View) 62 |
|
239 |
Figure 54: LFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Top View) 73 |
239 |
Figure 55: LFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Front View) 62 |
|
240 |
Figure 55: LFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Front View) 75 |
240 |
Figure 56: LFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Side View) 63 |
|
241 |
Figure 56: LFF OCP NIC 3.0 Card with Ejector CTF Dimensions (Side View) 76 |
241 |
Figure 57: LFF Baseboard Chassis CTF Dimensions (Rear View) 63 |
|
242 |
Figure 57: LFF Baseboard Chassis CTF Dimensions (Rear View) 76 |
242 |
Figure 58: LFF Baseboard Chassis CTF Dimensions (Side View) 64 |
|
243 |
Figure 58: LFF Baseboard Chassis CTF Dimensions (Side View) 77 |
243 |
Figure 59: LFF Baseboard Chassis CTF Dimensions (Rail Guide View) 64 |
|
244 |
Figure 59: LFF Baseboard Chassis CTF Dimensions (Rail Guide View) 77 |
244 |
Figure 60: LFF Baseboard Chassis CTF Dimensions (Rail Guide – Detail C) 64 |
|
245 |
Figure 60: LFF Baseboard Chassis CTF Dimensions (Rail Guide – Detail C) 77 |
245 |
Figure 61: SFF Label Area Example 66 |
|
246 |
Figure 61: SFF Label Area Example 79 |
246 |
Figure 62: MAC Address Label Example 1 – Quad Port with Single Host, Single Managed Controller 68 |
|
247 |
Figure 62: MAC Address Label Example 1 – Quad Port with Single Host, Single Managed Controller 81 |
247 |
Figure 63: MAC Address Label Example 2 – Octal Port with Single Host, Dual Managed Controller 69 |
|
248 |
Figure 63: MAC Address Label Example 2 – Octal Port with Single Host, Dual Managed Controller 82 |
248 |
Figure 64: MAC Address Label Example 3 – Quad Port with Dual Hosts, Dual Managed Controllers 69 |
|
249 |
Figure 64: MAC Address Label Example 3 – Quad Port with Dual Hosts, Dual Managed Controllers 82 |
249 |
Figure 65: MAC Address Label Example 4 – Single Port with Quad Host, Single Managed Controller 70 |
|
250 |
Figure 65: MAC Address Label Example 4 – Single Port with Quad Host, Single Managed Controller 83 |
250 |
Figure 66: MAC Address Label Example 5 – Octal Port with Single Host, Octal Managed Controller 70 |
|
251 |
Figure 66: MAC Address Label Example 5 – Octal Port with Single Host, Octal Managed Controller 83 |
251 |
Figure 67: SFF Primary Connector Gold Finger Dimensions – x16 – Top Side (“B” Pins) 72 |
|
252 |
Figure 67: SFF Primary Connector Gold Finger Dimensions – x16 – Top Side (“B” Pins) 85 |
252 |
Figure 68: SFF Primary Connector Card Profile Dimensions 73 |
|
253 |
Figure 68: SFF Primary Connector Card Profile Dimensions 86 |
253 |
Figure 69: SFF Primary Conector Gold Finger - Detail D 73 |
|
254 |
Figure 69: SFF Primary Conector Gold Finger - Detail D 86 |
254 |
Figure 70: LFF Gold Finger Dimensions – x32 – Top Side (“B” Pins) 74 |
|
255 |
Figure 70: LFF Gold Finger Dimensions – x32 – Top Side (“B” Pins) 87 |
255 |
Figure 71: LFF Gold Finger Dimensions – x32 – Bottom Side (“A” Pins) 74 |
|
256 |
Figure 71: LFF Gold Finger Dimensions – x32 – Bottom Side (“A” Pins) 87 |
256 |
Figure 72: 168-pin Base Board Primary Connector – Right Angle 78 |
|
257 |
Figure 72: 168-pin Base Board Primary Connector – Right Angle 91 |
257 |
Figure 73: 140-pin Base Board Secondary Connector – Right Angle 79 |
|
258 |
Figure 73: 140-pin Base Board Secondary Connector – Right Angle 92 |
258 |
Figure 74: OCP NIC 3.0 Card and Host Offset for Right Angle Connectors 79 |
|
259 |
Figure 74: OCP NIC 3.0 Card and Host Offset for Right Angle Connectors 92 |
259 |
Figure 75: 168-pin Base Board Primary Connector – Straddle Mount 80 |
|
260 |
Figure 75: 168-pin Base Board Primary Connector – Straddle Mount 93 |
260 |
Figure 76: 140-pin Base Board Secondary Connector – Straddle Mount 80 |
|
261 |
Figure 76: 140-pin Base Board Secondary Connector – Straddle Mount 93 |
261 |
Figure 77: OCP NIC 3.0 Card and Baseboard PCB Thickness Options for Straddle Mount Connectors 81 |
|
262 |
Figure 77: OCP NIC 3.0 Card and Baseboard PCB Thickness Options for Straddle Mount Connectors 94 |
262 |
Figure 78: 0 mm Offset (Coplanar) for 0.062” Thick Baseboards 81 |
|
263 |
Figure 78: 0 mm Offset (Coplanar) for 0.062” Thick Baseboards 94 |
263 |
Figure 79: 0.3 mm Offset for 0.076” Thick Baseboards 82 |
|
264 |
Figure 79: 0.3 mm Offset for 0.076” Thick Baseboards 95 |
264 |
Figure 80: Primary and Secondary Connector Locations for LFF Support with Right Angle Connectors 82 |
|
265 |
Figure 80: Primary and Secondary Connector Locations for LFF Support with Right Angle Connectors 95 |
265 |
Figure 81: Primary and Secondary Connector Locations for LFF Support with Straddle Mount Connectors 82 |
|
266 |
Figure 81: Primary and Secondary Connector Locations for LFF Support with Straddle Mount Connectors 95 |
266 |
Figure 82: PCIe Present and Bifurcation Control Pins (Baseboard Controlled BIF[0:2]#) 94 |
|
267 |
Figure 82: PCIe Present and Bifurcation Control Pins (Baseboard Controlled BIF[2:0]#) 107 |
267 |
Figure 83: PCIe Present and Bifurcation Control Pins (Static BIF[0:2]#) 94 |
|
268 |
Figure 83: PCIe Present and Bifurcation Control Pins (Static BIF[2:0]#) 107 |
268 |
Figure 84: Example SMBus Connections 96 |
|
269 |
Figure 84: Example SMBus Connections 109 |
269 |
Figure 85: NC-SI over RBT Connection Example – Single Primary Connector 102 |
|
270 |
Figure 85: NC-SI over RBT Connection Example – Single Primary Connector 115 |
270 |
Figure 86: NC-SI over RBT Connection Example – Dual Primary Connectors 103 |
|
271 |
Figure 86: NC-SI over RBT Connection Example – Dual Primary Connectors 116 |
271 |
Figure 87: Example Scan Chain Timing Diagram 106 |
|
272 |
Figure 87: Scan Chain Timing Diagram Example 1 119 |
|
|
|
273 |
Figure 88: Scan Chain Timing Diagram Example 2 119 |
272 |
Figure 88: Scan Chain Connection Example 111 |
|
274 |
Figure 89: Scan Chain Connection Example 125 |
273 |
Figure 89: Example Power Supply Topology 116 |
|
275 |
Figure 90: Example Power Supply Topology 130 |
274 |
Figure 90: USB 2.0 Connection Example – Basic Connectivity 118 |
|
276 |
Figure 91: USB 2.0 Connection Example – Basic Connectivity 132 |
275 |
Figure 91: USB 2.0 Connection Example – USB-Serial / USB-JTAG Connectivity 118 |
|
277 |
Figure 92: USB 2.0 Connection Example – USB-Serial / USB-JTAG Connectivity 132 |
276 |
Figure 92: UART Connection Example 120 |
|
278 |
Figure 93: UART Connection Example 134 |
277 |
Figure 93: Single Host (1 x16) and 1 x16 OCP NIC 3.0 Card (Single Controller) 126 |
|
279 |
Figure 94: Single Host (1 x16) and 1 x16 OCP NIC 3.0 Card (Single Controller) 140 |
278 |
Figure 94: Single Host (2 x8) and 2 x8 OCP NIC 3.0 Card (Dual Controllers) 127 |
|
280 |
Figure 95: Single Host (2 x8) and 2 x8 OCP NIC 3.0 Card (Dual Controllers) 141 |
279 |
Figure 95: Quad Hosts (4 x4) and 4 x4 OCP NIC 3.0 Card (Single Controller) 128 |
|
281 |
Figure 96: Quad Hosts (4 x4) and 4 x4 OCP NIC 3.0 Card (Single Controller) 142 |
280 |
Figure 96: Quad Hosts (4 x4) and 4 x4 OCP NIC 3.0 Card (Quad Controllers) 129 |
|
282 |
Figure 97: Quad Hosts (4 x4) and 4 x4 OCP NIC 3.0 Card (Quad Controllers) 143 |
281 |
Figure 97: Single Host with no Bifurcation (1 x16) and 2 x8 OCP NIC 3.0 Card (Dual Controllers) 130 |
|
283 |
Figure 98: Single Host with no Bifurcation (1 x16) and 2 x8 OCP NIC 3.0 Card (Dual Controllers) 144 |
282 |
Figure 98: SFF PCIe REFCLK Mapping – Single Host – 1, 2 and 4 links 132 |
|
284 |
Figure 99: SFF PCIe REFCLK Mapping – Single Host – 1, 2 and 4 links 146 |
283 |
Figure 99: SFF PCIe REFCLK Mapping – Dual Host – 2 and 4 links 133 |
|
285 |
Figure 100: SFF PCIe REFCLK Mapping – Dual Host – 2 and 4 links 147 |
284 |
Figure 100: SFF PCIe REFCLK Mapping – Quad Host – 4 Links 134 |
|
286 |
Figure 101: SFF PCIe REFCLK Mapping – Quad Host – 4 Links 148 |
285 |
Figure 101: LFF PCIe REFCLK Mapping – Single Host – 1, 2 and 4 links 135 |
|
287 |
Figure 102: LFF PCIe REFCLK Mapping – Single Host – 1, 2 and 4 links 149 |
286 |
Figure 102: LFF PCIe REFCLK Mapping – Dual Host – 2 and 4 links 136 |
|
288 |
Figure 103: LFF PCIe REFCLK Mapping – Dual Host – 2 and 4 links 150 |
287 |
Figure 103: LFF PCIe REFCLK Mapping – Quad Host – 4 Links 137 |
|
289 |
Figure 104: LFF PCIe REFCLK Mapping – Quad Host – 4 Links 151 |
288 |
Figure 104: Port and LED Ordering – Example SFF Link/Activity and Speed LED Placement 141 |
|
290 |
Figure 105: Port and LED Ordering – Example SFF Link/Activity and Speed LED Placement 155 |
289 |
Figure 105: Baseboard Power States 143 |
|
291 |
Figure 106: Baseboard Power States 157 |
290 |
Figure 106: Power-Up Sequencing – Normal Operation 148 |
|
292 |
Figure 107: Power-Up Sequencing – Normal Operation 166 |
291 |
Figure 107: Power-Down Sequencing – Normal Operation 149 |
|
293 |
Figure 108: Power-Down Sequencing – Normal Operation 169 |
292 |
Figure 108: Programming Mode Sequencing 150 |
|
294 |
Figure 109: Programming Mode Sequencing 172 |
293 |
Figure 109: FRU EEPROM Writes with Double Byte Addressing 163 |
|
295 |
Figure 110: FRU EEPROM Writes with Double Byte Addressing 188 |
294 |
Figure 110: FRU EEPROM Reads with Double Byte Addressing 163 |
|
296 |
Figure 111: FRU EEPROM Reads with Double Byte Addressing 188 |
295 |
Figure 111: FRU Update Flow 164 |
|
297 |
Figure 112: FRU Update Flow 189 |
296 |
Figure 112: NC-SI over RBT Timing Budget Topology 172 |
|
298 |
Figure 113: NC-SI over RBT Timing Budget Topology 198 |
297 |
Figure 113: NC-SI over RBT Propagation Delay Matching for Two Target ASICs – No Clock Buffer 174 |
|
299 |
Figure 114: NC-SI over RBT Propagation Delay Matching for Two Target ASICs – No Clock Buffer 200 |
298 |
Figure 114: NC-SI over RBT Propagation Delay Matching for Two Target ASICs – Clock Buffer 174 |
|
300 |
Figure 115: NC-SI over RBT Propagation Delay Matching for Two Target ASICs – Clock Buffer 200 |
299 |
Figure 115: PCIe Load Board Test Fixture for OCP NIC 3.0 SFF 176 |
|
301 |
Figure 116: PCIe Load Board Test Fixture for OCP NIC 3.0 SFF 203 |
300 |
Figure 116: PCIe Base Board Test Fixture for OCP NIC 3.0 SFF 177 |
|
302 |
Figure 117: PCIe Base Board Test Fixture for OCP NIC 3.0 SFF 204 |
301 |
Figure 117: Airflow Direction for Hot Aisle Cooling (SFF and LFF) 178 |
|
303 |
Figure 118: Airflow Direction for Hot Aisle Cooling (SFF and LFF) 206 |
302 |
Figure 118: Airflow Direction for Cold Aisle Cooling (SFF and LFF) 179 |
|
304 |
Figure 119: Airflow Direction for Cold Aisle Cooling (SFF and LFF) 207 |
303 |
Figure 119: ASIC Supportable Power for Hot Aisle Cooling – SFF 180 |
|
305 |
Figure 120: ASIC Supportable Power for Hot Aisle Cooling – SFF 208 |
304 |
Figure 120: OCP NIC 3.0 SFF Reference Design and CFD Geometry 181 |
|
306 |
Figure 121: OCP NIC 3.0 SFF Reference Design and CFD Geometry 209 |
305 |
Figure 121: Server System Airflow Capability – SFF Card Hot Aisle Cooling 182 |
|
307 |
Figure 122: Server System Airflow Capability – SFF Card Hot Aisle Cooling 210 |
306 |
Figure 122: Server System Airflow Capability – SFF Card Hot Aisle Cooling in standby (S5) mode 183 |
|
308 |
Figure 123: Server System Airflow Capability – SFF Card Hot Aisle Cooling in Aux Power Mode 211 |
307 |
Figure 123: ASIC Supportable Power for Hot Aisle Cooling – LFF Card 184 |
|
309 |
Figure 124: ASIC Supportable Power for Hot Aisle Cooling – LFF Card 212 |
308 |
Figure 124: OCP NIC 3.0 LFF Reference Design and CFD Geometry 184 |
|
310 |
Figure 125: OCP NIC 3.0 LFF Reference Design and CFD Geometry 212 |
309 |
Figure 125: Server System Airflow Capability – LFF Card Hot Aisle Cooling 186 |
|
311 |
Figure 126: Server System Airflow Capability – LFF Card Hot Aisle Cooling 214 |
310 |
Figure 126: ASIC Supportable Power for Cold Aisle Cooling – SFF Card 187 |
|
312 |
Figure 127: ASIC Supportable Power for Cold Aisle Cooling – SFF Card 215 |
311 |
Figure 127: Server System Airflow Capability – SFF Cold Aisle Cooling 188 |
|
313 |
Figure 128: Server System Airflow Capability – SFF Cold Aisle Cooling 216 |
312 |
Figure 128: ASIC Supportable Power Comparison – SFF Card 188 |
|
314 |
Figure 129: ASIC Supportable Power Comparison – SFF Card 216 |
313 |
Figure 129: ASIC Supportable Power for Cold Aisle Cooling – LFF Card 189 |
|
315 |
Figure 130: ASIC Supportable Power for Cold Aisle Cooling – LFF Card 217 |
314 |
Figure 130: Server System Airflow Capability – LFF Cold Aisle Cooling 190 |
|
316 |
Figure 131: Server System Airflow Capability – LFF Cold Aisle Cooling 218 |
315 |
Figure 131: ASIC Supportable Power Comparison – LFF Card 190 |
|
317 |
Figure 132: ASIC Supportable Power Comparison – LFF Card 218 |
316 |
Figure 132: SFF Thermal Test Fixture Preliminary Design 192 |
|
318 |
Figure 133: SFF Thermal Test Fixture Preliminary Design 220 |
317 |
Figure 133: SFF Thermal Test Fixture Preliminary Design – Cover Removed 193 |
|
319 |
Figure 134: SFF Thermal Test Fixture Preliminary Design – Cover Removed 221 |
318 |
Figure 134: SFF Card Thermal Test Fixture PCB 193 |
|
320 |
Figure 135: SFF Card Thermal Test Fixture PCB 221 |
319 |
Figure 135: LFF Card Thermal Test Fixture Design 194 |
|
321 |
Figure 136: LFF Card Thermal Test Fixture Design 222 |
320 |
Figure 136: LFF Card Thermal Test Fixture Design – Cover Removed 194 |
|
322 |
Figure 137: LFF Card Thermal Test Fixture Design – Cover Removed 222 |
321 |
Figure 137: LFF Card Thermal Test Fixture PCB 195 |
|
323 |
Figure 138: LFF Card Thermal Test Fixture PCB 223 |
322 |
Figure 138: Thermal Test Fixture Airflow Direction 196 |
|
324 |
Figure 139: Thermal Test Fixture Airflow Direction 224 |
|
|
|
325 |
Figure 140: External Thermocouple Placement for Cold Aisle Inlet Temperature Measurement 225 |
323 |
Figure 139: SFF Fixture, Hot Aisle Flow – Candlestick Air Velocity vs. Volume Flow 197 |
|
326 |
Figure 140: SFF Fixture, Hot Aisle Flow – Candlestick Air Velocity vs. Volume Flow 226 |
324 |
Figure 140: LFF Fixture, Hot Aisle Flow – Candlestick Air Velocity vs. Volume Flow 197 |
|
327 |
Figure 141: LFF Fixture, Hot Aisle Flow – Candlestick Air Velocity vs. Volume Flow 226 |
325 |
Figure 141: Graphical View of Card Cooling Tiers 199 |
|
328 |
Figure 142: Graphical View of Card Cooling Tiers 228 |
326 |
Figure 142: Typical Operating Range for Hot Aisle Configurations 199 |
|
329 |
Figure 143: Typical Operating Range for Hot Aisle Configurations 228 |
327 |
Figure 143: Typical Operating Range for Cold Aisle Configurations 200 |
|
330 |
Figure 144: Typical Operating Range for Cold Aisle Configurations 229 |
328 |
Figure 144: SFF Shock and Vibe Fixture 201 |
|
331 |
Figure 145: SFF Shock and Vibe Fixture 230 |
329 |
Figure 145: LFF Shock and Vibe Fixture 201 |
|
332 |
Figure 146: LFF Shock and Vibe Fixture 230 |
330 |
Figure 146: Dye and Pull Type Locations 204 |
|
333 |
Figure 147: Dye and Pull Type Locations 233 |
331 |
Figure 147: Dye Coverage Percentage 204 |
|
334 |
Figure 148: Dye Coverage Percentage 233 |
|
333 |
Table 1: Acknowledgements – By Company 11 |
<> |
336 |
Table 1: Acknowledgements – Current Contributors – By Company 11 |
|
338 |
Table 6: OCP NIC 3.0 Card Definitions 24 |
<> |
341 |
Table 6: OCP NIC 3.0 Card Definitions 25 |
339 |
Table 7: OCP NIC 3.0 Line Side I/O Implementations 32 |
|
342 |
Table 7: OCP NIC 3.0 Line Side I/O Implementations 33 |
340 |
Table 8: Line Side I/O Cross Reference to Industry Standards 32 |
|
343 |
Table 8: Line Side I/O Cross Reference to Industry Standards 33 |
341 |
Table 9: Bill of Materials for the SFF and LFF Faceplate Assemblies 35 |
|
344 |
Table 9: Bill of Materials for the SFF and LFF Faceplate Assemblies 36 |
342 |
Table 10: CTF Default Tolerances (SFF and LFF OCP NIC 3.0) 55 |
|
345 |
Table 10: CTF Default Tolerances (SFF and LFF OCP NIC 3.0) 60 |
343 |
Table 11: MAC Address Label Example 1 – Quad Port with Single Host, Single Managed Controller 68 |
|
346 |
Table 11: MAC Address Label Example 1 – Quad Port with Single Host, Single Managed Controller 81 |
344 |
Table 12: MAC Address Label Example 2 – Octal Port with Single Host, Dual Managed Controller 68 |
|
347 |
Table 12: MAC Address Label Example 2 – Octal Port with Single Host, Dual Managed Controller 81 |
345 |
Table 13: MAC Address Label Example 3 – Quad Port with Dual Hosts, Dual Managed Controller 69 |
|
348 |
Table 13: MAC Address Label Example 3 – Quad Port with Dual Hosts, Dual Managed Controller 82 |
346 |
Table 14: MAC Address Label Example 4 – Single Port with Quad Host, Single Managed Controller 70 |
|
349 |
Table 14: MAC Address Label Example 4 – Single Port with Quad Host, Single Managed Controller 83 |
347 |
Table 15: MAC Address Label Example 5 – Octal Port with Single Host, Octal Managed Controller 70 |
|
350 |
Table 15: MAC Address Label Example 5 – Octal Port with Single Host, Octal Managed Controller 83 |
348 |
Table 16: NIC Implementation Examples and 3D CAD 71 |
|
351 |
Table 16: NIC Implementation Examples and 3D CAD 84 |
349 |
Table 17: Contact Mating Positions for the Primary Connector 74 |
|
352 |
Table 17: Contact Mating Positions for the Primary Connector 87 |
350 |
Table 18: Contact Mating Positions for the Secondary Connector 76 |
|
353 |
Table 18: Contact Mating Positions for the Secondary Connector 89 |
351 |
Table 19: Right Angle Connector Options 78 |
|
354 |
Table 19: Right Angle Connector Options 91 |
352 |
Table 20: Straddle Mount Connector Options 79 |
|
355 |
Table 20: Straddle Mount Connector Options 92 |
353 |
Table 21: Primary Connector Pin Definition (x16) (4C+) 83 |
|
356 |
Table 21: Primary Connector Pin Definition (x16) (4C+) 96 |
354 |
Table 22: Secondary Connector Pin Definition (x16) (4C) 85 |
|
357 |
Table 22: Secondary Connector Pin Definition (x16) (4C) 98 |
355 |
Table 23: Pin Descriptions – PCIe 86 |
|
358 |
Table 23: Pin Descriptions – PCIe 100 |
356 |
Table 24: Pin Descriptions – PCIe Present and Bifurcation Control Pins 92 |
|
359 |
Table 24: Pin Descriptions – PCIe Present and Bifurcation Control Pins 105 |
357 |
Table 25: Pin Descriptions – SMBus 95 |
|
360 |
Table 25: Pin Descriptions – SMBus 108 |
358 |
Table 26: Pin Descriptions – NC-SI over RBT 96 |
|
361 |
Table 26: Pin Descriptions – NC-SI over RBT 109 |
359 |
Table 27: Pin Descriptions – Scan Chain 104 |
|
362 |
Table 27: Pin Descriptions – Scan Chain 117 |
360 |
Table 28: Scan Chain Timing Requirements – Baseboard Side 106 |
|
363 |
Table 28: Scan Chain Timing Requirements – Baseboard Side 119 |
361 |
Table 29: Scan Chain Timing Requirements – OCP NIC 3.0 Card Side 106 |
|
364 |
Table 29: Scan Chain Timing Requirements – OCP NIC 3.0 Card Side 119 |
362 |
Table 30: Pin Descriptions – Scan Chain DATA_OUT Bit Definition 106 |
|
365 |
Table 30: Pin Descriptions – Scan Chain DATA_OUT Bit Definition 120 |
363 |
Table 31: Pin Descriptions – Scan Chain DATA_IN Bit Definition 107 |
|
366 |
Table 31: Pin Descriptions – Scan Chain DATA_IN Bit Definition 121 |
364 |
Table 32: Pin Descriptions – Power 112 |
|
367 |
Table 32: Pin Descriptions – Power 126 |
365 |
Table 33: Pin Descriptions – USB 2.0 – Primary Connector only 117 |
|
368 |
Table 33: Pin Descriptions – USB 2.0 – Primary Connector only 131 |
366 |
Table 34: Pin Descriptions – UART – Secondary Connector Only 119 |
|
369 |
Table 34: Pin Descriptions – UART – Secondary Connector Only 133 |
367 |
Table 35: Pin Descriptions – RFU[1:4] 121 |
|
370 |
Table 35: Pin Descriptions – RFU[1:4] 135 |
368 |
Table 36: PCIe Bifurcation Decoder for x32, x16, x8, x4, x2 and x1 Card Widths 124 |
|
371 |
Table 36: PCIe Bifurcation Decoder for x32, x16, x8, x4, x2 and x1 Card Widths 138 |
369 |
Table 37: PCIe REFCLK and PERST Associations 131 |
|
372 |
Table 37: PCIe REFCLK and PERST Associations 145 |
370 |
Table 38: SFF PCIe Link / REFCLKn / PERSTn mapping for 1, 2 and 4 Links 131 |
|
373 |
Table 38: SFF PCIe Link / REFCLKn / PERSTn mapping for 1, 2 and 4 Links 145 |
371 |
Table 39: LFF PCIe Link / REFCLKn / PERSTn mapping for 1, 2, 4 and 8 Links 131 |
|
374 |
Table 39: LFF PCIe Link / REFCLKn / PERSTn mapping for 1, 2, 4 and 8 Links 145 |
372 |
Table 40: OCP NIC 3.0 Card LED Configuration with Two Physical LEDs per Port 139 |
|
375 |
Table 40: OCP NIC 3.0 Card LED Configuration with Two Physical LEDs per Port 153 |
373 |
Table 41: Available Card Functions per Power State 144 |
|
376 |
Table 41: Available Card Functions per Power State 160 |
374 |
Table 42: Baseboard Power Supply Rail Requirements – Slot Power Envelopes 146 |
|
377 |
Table 42: Baseboard Power Supply Rail Requirements – Slot Power Envelopes 163 |
375 |
Table 43: Power Sequencing Parameters 150 |
|
378 |
Table 43: Power Sequencing Parameters 174 |
376 |
Table 44: Digital I/O DC specifications 152 |
|
379 |
Table 44: Digital I/O DC specifications 176 |
377 |
Table 45: Digital I/O AC specifications 152 |
|
380 |
Table 45: Digital I/O AC specifications 176 |
378 |
Table 46: OCP NIC 3.0 Management Implementation Definitions 153 |
|
381 |
Table 46: OCP NIC 3.0 Management Implementation Definitions 177 |
379 |
Table 47: Sideband Management Interface and Transport Requirements 153 |
|
382 |
Table 47: Sideband Management Interface and Transport Requirements 177 |
380 |
Table 48: NC-SI Traffic Requirements 154 |
|
383 |
Table 48: NC-SI Traffic Requirements 178 |
381 |
Table 49: MC MAC Address Provisioning Requirements 154 |
|
384 |
Table 49: MC MAC Address Provisioning Requirements 178 |
|
|
|
385 |
Table 50: Threshold Severity Level vs Example Threshold Values 181 |
382 |
Table 50: Temperature Reporting Requirements 157 |
|
386 |
Table 51: Temperature Reporting Requirements 181 |
383 |
Table 51: Power Consumption Reporting Requirements 158 |
|
387 |
Table 52: Power Consumption Reporting Requirements 183 |
384 |
Table 52: Pluggable Module Status Reporting Requirements 159 |
|
388 |
Table 53: Pluggable Module Status Reporting Requirements 184 |
385 |
Table 53: Management and Pre-OS Firmware Inventory and Update Requirements 159 |
|
389 |
Table 54: Management and Pre-OS Firmware Inventory and Update Requirements 184 |
386 |
Table 54: Slot_ID[1:0] to Package ID[2:0] Mapping 161 |
|
390 |
Table 55: Slot_ID[1:0] to Package ID[2:0] Mapping 186 |
387 |
Table 55: FRU EEPROM Address Map 162 |
|
391 |
Table 56: FRU EEPROM Address Map 187 |
388 |
Table 56: FRU EEPROM Record – OEM Record 0xC0, Offset 0x00 165 |
|
392 |
Table 57: FRU EEPROM Record – OEM Record 0xC0, Offset 0x00 190 |
389 |
Table 57: NC-SI over RBT Timing Parameters 171 |
|
393 |
Table 58: NC-SI over RBT Timing Parameters 197 |
390 |
Table 58: PCIe Electrical Budgets 175 |
|
394 |
Table 59: PCIe Electrical Budgets 201 |
391 |
Table 59: PCIe Test Fixtures for OCP NIC 3.0 176 |
|
395 |
Table 60: PCIe Test Fixtures for OCP NIC 3.0 202 |
392 |
Table 60: Hot Aisle Air Temperature Boundary Conditions 179 |
|
396 |
Table 61: Hot Aisle Air Temperature Boundary Conditions 207 |
393 |
Table 61: Hot Aisle Airflow Boundary Conditions 179 |
|
397 |
Table 62: Hot Aisle Airflow Boundary Conditions 207 |
394 |
Table 62: Cold Aisle Air Temperature Boundary Conditions 179 |
|
398 |
Table 63: Cold Aisle Air Temperature Boundary Conditions 207 |
395 |
Table 63: Cold Aisle Airflow Boundary Conditions 180 |
|
399 |
Table 64: Cold Aisle Airflow Boundary Conditions 208 |
396 |
Table 64: Reference OCP NIC 3.0 SFF Card Geometry 181 |
|
400 |
Table 65: Reference OCP NIC 3.0 SFF Card Geometry 209 |
397 |
Table 65: Reference OCP NIC 3.0 LFF Card Geometry 185 |
|
401 |
Table 66: Reference OCP NIC 3.0 LFF Card Geometry 213 |
398 |
Table 66: Card Cooling Tier Definitions (LFM) 198 |
|
402 |
Table 67: Card Cooling Tier Definitions (LFM) 227 |
399 |
Table 67: Random Vibration Testing 1.88 GRMS Profile 202 |
|
403 |
Table 68: Random Vibration Testing 1.88 GRMS Profile 231 |
400 |
Table 68: FCC Class A Radiated and Conducted Emissions Requirements Based on Geographical Location 206 |
|
404 |
Table 69: FCC Class A Radiated and Conducted Emissions Requirements Based on Geographical Location 235 |
401 |
Table 69: Safety Requirements 207 |
|
405 |
Table 70: Safety Requirements 236 |
402 |
Table 70: Immunity (ESD) Requirements 207 |
|
406 |
Table 71: Immunity (ESD) Requirements 236 |
|
412 |
The OCP NIC Subgroup would like to acknowledge the following member companies for their contributions to the OCP NIC 3.0 specification: |
<> |
416 |
The OCP NIC Subgroup would like to acknowledge the following member companies for their current contributions to the OCP NIC 3.0 specification: |
413 |
Table 1: Acknowledgements – By Company |
|
417 |
Table 1: Acknowledgements – Current Contributors – By Company |
|
416 |
Broadcom Limited |
<> |
420 |
Broadcom Inc. |
|
419 |
Mellanox Technologies, Ltd |
<> |
423 |
Netronome Systems, Inc. |
|
421 |
Netronome Systems, Inc. |
<> |
425 |
NVIDIA |
|
|
|
-+ |
447 |
DMTF Standard. DSP2054, PLDM NIC Modeling. Distributed Management Task Force (DMTF), Rev 1.0.0, December 18th, 2019. |
|
|
|
-+ |
613 |
Conventions |
|
|
|
614 |
The OCP NIC 3.0 specification adopts the following convention for numerical representations: |
|
|
|
615 |
Hexadecimal numbers are written with a 0x prefix with the most significant byte first – such as 0xFFFF |
|
|
|
616 |
Binary numbers are written with a 0b prefix with the most significant bit first – such as 0b0101 |
|
|
|
617 |
Decimal numbers are indicated without any prefix (such as 25) |
|
|
|
618 |
The unit representations are implemented per the Bureau International des Poids et Mesures (BIPM). The value and unit are separated by a space. The SI symbol and appropriate SI prefix are used (such as 50 °C, 15 A and 200 kΩ). |
|
677 |
The Primary Connector provides all OCP specific management functions as well as up to 16 lanes of PCIe between the OCP NIC and the system motherboard. |
<> |
688 |
The Primary Connector provides all OCP specific management functions as well as up to 16 lanes of PCIe between the OCP NIC and the system motherboard. The Primary Connector is a 4C+ as defined in SFF-TA-1002 and consists of an OCP Bay for management and sideband signals, and a 4C region. |
|
692 |
Interface Overview (4C Connector): |
<> |
703 |
Interface Overview (4C region): |
|
709 |
The Secondary Connector provides an additional 16 lanes of PCIe and their respective control signals. |
<> |
720 |
The Secondary Connector provides an additional 16 lanes of PCIe and their respective control signals. The Secondary Connector is a 4C as defined in SFF-TA-1002. |
|
803 |
On the internal lock variation only, a 5.4 Kg force with a 1 second ramp may be applied to the heatsink during NIC ejection. The mechanical and thermal solution shall be implemented such that the thermal performance is maintained for 10 force cycles (i.e., the NIC still passes all functional tests). If there exists a minimum of (10 mm x 10 mm x 10 mm) of space behind the line side connectors, then each connector shall be able to sustain the same 5.4 Kg force with a 1 second ramp. |
<> |
814 |
On the internal lock variation only, a 5.4 kg force with a 1 second ramp may be applied to the heatsink during NIC ejection. The mechanical and thermal solution shall be implemented such that the thermal performance is maintained for 10 force cycles (i.e., the NIC still passes all functional tests). If there exists a minimum of (10 mm x 10 mm x 10 mm) of space behind the line side connectors, then each connector shall be able to sustain the same 5.4 kg force with a 1 second ramp. |
|
833 |
Figure 12 illustrates example LFF 3D views of the ejector latch assembly mounted in a chassis utilizing a straddle mount connector and a right angle connector. The baseboard connector options are discussed in Section 3.2. The LFF OCP NIC 3.0 card is identical for both chassis connector options. |
<> |
844 |
Figure 12 illustrates example LFF 3D views of the ejector latch assembly mounted in a chassis utilizing a straddle mount connector and a right-angle connector. The baseboard connector options are discussed in Section 3.2. The LFF OCP NIC 3.0 card is identical for both chassis connector options. |
|
884 |
The images in Figure 13 illustrate the exploded top level assemblies for both the SFF and the LFF. |
<> |
895 |
The images in Figure 13 illustrate the exploded top-level assemblies for both the SFF and the LFF. |
|
1007 |
Figure 15 shows the standard SFF I/O bracket with a thumbscrew and pull tab assembly. |
<> |
1018 |
Figure 15 shows the standard SFF I/O bracket with a thumbscrew and pull-tab assembly. |
|
1107 |
Some NIC vendor(s) may require serial number labels to be placed on the primary side of the PBA. This is permitted but it is up to the NIC vendor(s) to find the appropriate location(s) to affix the label. If a label is to be adhered to the PCB, then the label must be ESD safe as defined by ANSI/ESD S541-2008 (between 104 and 1011 Ohms). |
<> |
1118 |
Some NIC vendor(s) may require serial number labels to be placed on the primary side of the PBA. This is permitted but it is up to the NIC vendor(s) to find the appropriate location(s) to affix the label. If a label is to be adhered to the PCB, then the label must be ESD safe as defined by ANSI/ESD S541-2008 (between 104 Ω and 1011 Ω). |
|
2016 |
The following offset and height options are available for the right angle Primary and Secondary Connectors. |
<> |
2027 |
The following offset and height options are available for the right-angle Primary and Secondary Connectors. |
|
2718 |
Note: The OCP NIC 3.0 card shall implement protection methods to prevent leakage or low impedance paths between the VAUX and VMAIN power domains in the event that a powered-down NIC is physically present in a powered-up baseboard. This specification provides example isolation implementations in the signal description text and appropriate figures. OCP NIC 3.0 implementers may choose to do a different implementation as long as the isolation requirements are met and the same result is achieved. |
<> |
2729 |
Note 1: The OCP NIC 3.0 card shall implement protection methods to prevent leakage or low impedance paths between the VAUX and VMAIN power domains if a powered-down NIC is physically present in a powered-up baseboard. This specification provides example isolation implementations in the signal description text and appropriate figures. OCP NIC 3.0 implementers may choose to do a different implementation as long as the isolation requirements are met and the same result is achieved. |
|
|
|
2730 |
Note 2: The terms Aux Power Mode and Main Power Mode are used within this specification and define the corresponding ACPI power states of the system. |
|
|
|
2731 |
Aux Power Mode corresponds to the S5 ACPI power state and may also include ACPI power states S3 or S4 depending on the implementation. In Aux Power Mode, AUX_PWR_EN==1, and MAIN_PWR_EN==0. |
|
|
|
2732 |
Main Power Mode corresponds to the S0 ACPI power state on the system and may also correspond to ACPI power state S1 depending on the implementation. In Main Power Mode, AUX_PWR_EN==1, and MAIN_PWR_EN==1. |
|
2952 |
For baseboards, this signal shall be pulled up to +3.3V_EDGE on the baseboard with a 10 kOhm resistor. This signals shall be connected to the system WAKE# signal. |
<> |
2966 |
For baseboards, this signal shall be pulled up to +3.3V_EDGE on the baseboard with a 10 kΩ resistor. This signal shall be connected to the system WAKE# signal. |
2953 |
For OCP NIC 3.0 cards, this signal shall be connected between the endpoint silicon WAKE# pin(s) and the card edge through an isolation buffer. The WAKE# signal shall not assert until the PCIe card is in the D3 state according to the PCIe CEM specification to prevent false WAKE# events. For OCP NIC 3.0, the WAKE# pin shall be buffered or otherwise isolated from the host until the aux voltage source is present. Examples of this are shown in Section 3.5.5 by gating via an on-board “AUX_PWR_GOOD” signal to indicate all the NIC AUX power rails are stable. The PCIe CEM specification also shows an example in the WAKE# signal section. |
|
2967 |
For OCP NIC 3.0 cards, this signal shall be connected between the endpoint silicon WAKE# pin(s) and the card edge through an isolation buffer. The WAKE# signal shall not assert until the PCIe card is in the D3 state according to the PCIe CEM specification to prevent false WAKE# events. For OCP NIC 3.0, the WAKE# pin shall be buffered or otherwise isolated from the host until the aux voltage source is present. Examples of this are shown in Section 3.5.5 by gating via an on-board “AUX_PWR_GOOD” signal to indicate all the NIC Aux power rails are stable. The PCIe CEM specification also shows an example in the WAKE# signal section. |
|
2960 |
This signal shall be pulled up to +3.3V_EDGE on the OCP NIC 3.0 card with 95 kOhm or larger resistance. A baseboard that supports this function must provide a stronger pull up on PWRBRK#. A baseboard pull up value between 4.7 kOhm and 10 kOhm is recommended. The pull up shall meet the TPWRBRK timing parameter as shown in the PCIe CEM Specification. |
<> |
2974 |
This signal shall be pulled up to +3.3V_EDGE on the OCP NIC 3.0 card with 95 kΩ or larger resistance. A baseboard that supports this function must provide a stronger pull up on PWRBRK#. A baseboard pull up value between 4.7 kΩ and 10 kΩ is recommended. The pull up shall meet the TPWRBRK timing parameter as shown in the PCIe CEM Specification. |
|
2967 |
The PRSNTA#/PRSNTB[0:3]# state shall be used to determine if a card has been physically plugged in. The BIF[0:2]# pins shall be asserted by the baseboard along with the rising edge of AUX_PWR_EN. The BIF[0:2]# pins shall be latched by the OCP NIC 3.0 card when AUX_PWR_EN=1 and NIC_PWR_GOOD=1 to ensure the correct values are detected by the OCP NIC 3.0 card. Changing the pin states after this timing window is not allowed. Refer to the AC timing diagram in Section 3.11 for details. |
<> |
2981 |
The PRSNTA#/PRSNTB[3:0]# state shall be used to determine if a card has been physically plugged in. The BIF[2:0]# pins shall be asserted by the baseboard along with the rising edge of AUX_PWR_EN. The BIF[2:0]# pins shall be latched by the OCP NIC 3.0 card when AUX_PWR_EN=1 and NIC_PWR_GOOD=1 to ensure the correct values are detected by the OCP NIC 3.0 card. Changing the pin states after this timing window is not allowed. Refer to the AC timing diagram in Section 3.11 for details. |
2968 |
PRSNTB[0:3]# pins are available to each connector and are independent of each other. For the SFF, the baseboard shall only read the Primary Connector PRSNTB[0:3]# to determine the card type. For the LFF, the baseboard shall read both the Primary and Secondary connector PRSNTB[0:3]# pins to determine the card type. The card type matrix is discussed in Section 3.5. |
|
2982 |
PRSNTB[3:0]# pins are available to each connector and are independent of each other. For the SFF, the baseboard shall only read the Primary Connector PRSNTB[3:0]# to determine the card type. For the LFF, the baseboard shall read both the Primary and Secondary connector PRSNTB[3:0]# pins to determine the card type. The card type matrix is discussed in Section 3.5. |
|
2989 |
Present B [0:3]# are used for OCP NIC 3.0 card presence and PCIe capabilities detection. |
<> |
3003 |
Present B [3:0]# are used for OCP NIC 3.0 card presence and PCIe capabilities detection. |
2990 |
For baseboards, these pins shall be connected to the I/O hub and pulled up to +3.3V_EDGE using 1 kOhm resistors. |
|
3004 |
For baseboards, these pins shall be connected to the I/O hub and pulled up to +3.3V_EDGE using 1 kΩ resistors. |
2991 |
For OCP NIC 3.0 cards, these pins shall be strapped to PRSNTA# per the encoding definitions described in Section 3.5. |
|
3005 |
For OCP NIC 3.0 cards, these pins shall be strapped to PRSNTA# per the encoding definitions described in Section 3.5. The card series resistor values shall be in the range of 0 Ω to ~200 Ω to protect the baseboard logic. |
|
3000 |
Bifurcation [0:2]# pins allow the baseboard to force configure the OCP NIC 3.0 card bifurcation. |
<> |
3014 |
Bifurcation [2:0]# pins allow the baseboard to force configure the OCP NIC 3.0 card bifurcation. |
3001 |
For baseboards, the BIF[0:2]# these pins shall be driven from the baseboard I/O hub on the rising edge of AUX_PWR_EN. This allows the baseboard to force the OCP NIC 3.0 card bifurcation. The baseboard may optionally pull the BIF[0:2]# signals to AUX_PWR_EN or to ground per the definitions described in Section 3.5 if no dynamic bifurcation configuration is required. The BIF[0:2]# pins shall be low until AUX_PWR_EN is asserted. |
|
3015 |
For baseboards, the BIF[2:0]# pins shall be driven from the baseboard I/O hub on the rising edge of AUX_PWR_EN. This allows the baseboard to force the OCP NIC 3.0 card bifurcation. The baseboard may optionally pull the BIF[2:0]# signals to AUX_PWR_EN or to ground per the definitions described in Section 3.5 if no dynamic bifurcation configuration is required. The BIF[2:0]# pins shall be low until AUX_PWR_EN is asserted. |
3002 |
For baseboards that allow dynamic bifurcation, the BIF[0:2] pins are driven low prior to AUX_PWR_EN. The state of the BIF[0:2] pins are driven with the rising edge of AUX_PWR_EN when bifurcation is requested. Refer to Figure 82 for an example configuration. |
|
3016 |
For baseboards that allow dynamic bifurcation, the BIF[2:0] pins are driven low prior to AUX_PWR_EN. The state of the BIF[2:0] pins are driven with the rising edge of AUX_PWR_EN when bifurcation is requested. Refer to Figure 82 for an example configuration. |
|
3004 |
For OCP NIC 3.0 cards, these signals shall connect to the endpoint bifurcation pins if it is supported. The BIF[0:2]# signals shall be left as no connects if end point bifurcation is not supported. The value of the BIF[2:0]# pins are latched by the OCP NIC 3.0 card upon entering the AUX power mode state (when AUX_PWR_EN=1 and NIC_PWR_GOOD=1). |
<> |
3018 |
For OCP NIC 3.0 cards, these signals shall connect to the endpoint bifurcation pins if it is supported. The BIF[2:0]# signals shall be left as no connects if end point bifurcation is not supported. The value of the BIF[2:0]# pins are latched by the OCP NIC 3.0 card upon entering Aux Power Mode (when AUX_PWR_EN=1 and NIC_PWR_GOOD=1). |
|
3006 |
Figure 82: PCIe Present and Bifurcation Control Pins (Baseboard Controlled BIF[0:2]#) |
<> |
3020 |
Figure 82: PCIe Present and Bifurcation Control Pins (Baseboard Controlled BIF[2:0]#) |
3007 |
Figure 83: PCIe Present and Bifurcation Control Pins (Static BIF[0:2]#) |
|
3021 |
Figure 83: PCIe Present and Bifurcation Control Pins (Static BIF[2:0]#) |
|
3037 |
Note: The RBT pins must provide the ability to be isolated on the baseboard side when AUX_PWR_EN=0 or when (AUX_PWR_EN=1 and NIC_PWR_GOOD=0). The RBT pins shall remain isolated until the power state machine has transitioned to AUX power mode or to Main Power Mode along with a valid indication of NIC_PWR_GOOD. This prevents a leakage path through unpowered silicon. The RBT REF_CLK must also be disabled until AUX_PWR_EN=1 and NIC_PWR_GOOD=1. Example buffering implementations are shown in Figure 85 and Figure 86. The isolator shall be controlled on the baseboard with a signal called RBT_ISOLATE#. |
<> |
3051 |
Note: The RBT pins must provide the ability to be isolated on the baseboard side when AUX_PWR_EN=0 or when (AUX_PWR_EN=1 and NIC_PWR_GOOD=0). The RBT pins shall remain isolated until the power state machine has transitioned to Aux Power Mode or to Main Power Mode along with a valid indication of NIC_PWR_GOOD. This prevents a leakage path through unpowered silicon. The RBT REF_CLK must also be disabled until AUX_PWR_EN=1 and NIC_PWR_GOOD=1. Example buffering implementations are shown in Figure 85 and Figure 86. The isolator shall be controlled on the baseboard with a signal called RBT_ISOLATE#. |
|
3049 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the Primary Connector OCP bay. The RBT_REF_CLK shall not be driven until the card has transitioned into AUX Power Mode. The RBT_REF_CLK shall be continuous once it has started. |
<> |
3063 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the Primary Connector OCP bay. The RBT_REF_CLK shall not be driven until the card has transitioned into Aux Power Mode. The RBT_REF_CLK shall be continuous once it has started. |
3050 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to ground through a 100 kOhm pull down resistor. |
|
3064 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to ground through a 100 kΩ pull down resistor. |
|
3056 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the connector. This signal requires a 100 kOhm pull down resistor on the baseboard between the BMC and the RBT isolator to prevent the signal from floating when no card is installed. |
<> |
3070 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the connector. This signal requires a 100 kΩ pull down resistor on the baseboard between the BMC and the RBT isolator to prevent the signal from floating when no card is installed. |
3057 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to ground through a 100 kOhm pull down resistor. |
|
3071 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to ground through a 100 kΩ pull down resistor. |
|
3065 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the connector. This signal requires a 100 kOhm pull down resistor to GND on the baseboard between the BMC and the RBT isolator to prevent the signal from floating when no card is installed. |
<> |
3079 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the connector. This signal requires a 100 kΩ pull down resistor to GND on the baseboard between the BMC and the RBT isolator to prevent the signal from floating when no card is installed. |
3066 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to GND through a 100 kOhm pull down. |
|
3080 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to GND through a 100 kΩ pull down. |
|
3072 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the connector. This signal requires a 100 kOhm pull down resistor to ground on the baseboard between the RBT isolator and the OCP connector to prevent the card-side signals from floating when the RBT signals are isolated. |
<> |
3086 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the connector. This signal requires a 100 kΩ pull down resistor to ground on the baseboard between the RBT isolator and the OCP connector to prevent the card-side signals from floating when the RBT signals are isolated. |
3073 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to ground through a 100 kOhm pull down. |
|
3087 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to ground through a 100 kΩ pull down. |
|
3081 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the connector. This signal requires a 100 kOhm pull down resistor to GND on the baseboard between the RBT isolator and the OCP connector to prevent the card-side signals from floating when the RBT signals are isolated. |
<> |
3095 |
For baseboards, this pin shall be connected between the baseboard NC-SI over RBT PHY and the connector. This signal requires a 100 kΩ pull down resistor to GND on the baseboard between the RBT isolator and the OCP connector to prevent the card-side signals from floating when the RBT signals are isolated. |
3082 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to GND through a 100 kOhm pull down. |
|
3096 |
If the baseboard does not support NC-SI over RBT, then this pin shall be terminated to GND through a 100 kΩ pull down. |
3083 |
Note: Some BMC vendors use the RBT_TXD[0:1] pins as hardware configuration straps. A 4.7 kOhm to 10 kOhm pull up/pull down resistor is permitted between the BMC and the RBT isolator for this purpose. The resulting network will not violate the NC-SI VIHMIN of 2.0V. |
|
3097 |
Note: Some BMC vendors use the RBT_TXD[0:1] pins as hardware configuration straps. A 4.7 kΩ to 10 kΩ pull up/pull down resistor is permitted between the BMC and the RBT isolator for this purpose. The resulting network will not violate the NC-SI VIHMIN of 2.0V. |
|
3105 |
For baseboards, the SLOT_ID[1:0] pins shall be connected to GND through a 100 Ohm pull down or to +3.3V_EDGE through a 4.7 kOhm pull up. The SLOT[1:0] values are based on the following mapping on a per slot basis: |
<> |
3119 |
For baseboards, the SLOT_ID[1:0] pins shall be connected to GND through a 100 Ω pull down or to +3.3V_EDGE through a 4.7 kΩ pull up. The SLOT[1:0] values are based on the following mapping on a per slot basis: |
|
3122 |
For OCP NIC 3.0 cards, the SLOT_ID[1:0] pins shall be used to set the RBT Package ID and the FRU EEPROM address on the OCP NIC 3.0 card. The OCP NIC 3.0 card may optionally implement weak pull up or pull down resistors (>47 kOhm) to prevent the silicon pins from floating prior to the local silicon “Aux power good.” |
<> |
3136 |
For OCP NIC 3.0 cards, the SLOT_ID[1:0] pins shall be used to set the RBT Package ID and the FRU EEPROM address on the OCP NIC 3.0 card. The OCP NIC 3.0 card may optionally implement weak pull up or pull down resistors (>47 kΩ) to prevent the silicon pins from floating prior to the local silicon “Aux power good.” |
|
3138 |
This section provides the pin assignments for the Scan Chain interface signals on the Primary Connector OCP Bay. The scan chain is a point-to-point bus on a per OCP slot basis. The scan chain consists of two unidirectional busses, a common clock and a common load signal. The DATA_OUT signal serially shifts control signals from the baseboard to the OCP NIC 3.0 card. The DATA_IN signal serially shifts bits from the OCP NIC 3.0 card to the baseboard. The DATA_OUT and DATA_IN chains are independent of each other. The scan chain CLK is driven from the baseboard. The LD pin, when asserted by the baseboard, allows loading of the data on to the shift registers. An example timing diagram is shown in Figure 87. An example connection diagram is shown in Figure 88. |
<> |
3152 |
This section provides the pin assignments for the Scan Chain interface signals on the Primary Connector OCP Bay. The scan chain is a point-to-point bus on a per OCP slot basis. The scan chain consists of two unidirectional busses, a common clock and a common load signal. The DATA_OUT signal serially shifts control signals from the baseboard to the OCP NIC 3.0 card. The DATA_IN signal serially shifts bits from the OCP NIC 3.0 card to the baseboard. The DATA_OUT and DATA_IN chains are independent of each other. The scan chain CLK is driven from the baseboard. The LD pin, when asserted by the baseboard, allows loading of the data on to the shift registers. An example timing diagram is shown in Figure 87. An example connection diagram is shown in Figure 89. |
|
3150 |
For NIC implementations, the CLK pin shall be connected to Shift Registers 0 & 1, and optionally connected to Shift Registers 2 & 3 (if implemented) as defined in the text and Figure 88, below. The CLK pin shall be pulled up to +3.3V_EDGE through a 1 kOhm resistor. |
<> |
3164 |
For NIC implementations, the CLK pin shall be connected to Shift Registers 0 & 1, and optionally connected to Shift Registers 2 & 3 (if implemented) as defined in the text and Figure 89, below. The CLK pin shall be pulled up to +3.3V_EDGE through a 1 kΩ resistor. |
|
3155 |
For baseboard implementations, the DATA_OUT pin shall be connected to the Primary Connector. The DATA_OUT pin shall be pulled down to GND through a 1 kOhm resistor if the scan chain is not used. |
<> |
3169 |
For baseboard implementations, the DATA_OUT pin shall be connected to the Primary Connector. The DATA_OUT pin shall be pulled down to GND through a 1 kΩ resistor if the scan chain is not used. |
3156 |
For NIC implementations, the DATA_OUT pin shall be pulled down to GND on the OCP NIC 3.0 card through a 10 kOhm resistor. |
|
3170 |
For NIC implementations, the DATA_OUT pin shall be pulled down to GND on the OCP NIC 3.0 card through a 10 kΩ resistor. |
|
3161 |
For baseboard implementations, the DATA_IN pin shall be pulled up to +3.3V_EDGE through a 10 kOhm resistor to prevent the input signal from floating if a card is not installed. This pin may be left as a no connect if the scan chain is not used. |
<> |
3175 |
For baseboard implementations, the DATA_IN pin shall be pulled up to +3.3V_EDGE through a 10 kΩ resistor to prevent the input signal from floating if a card is not installed. This pin may be left as a no connect if the scan chain is not used. |
3162 |
For NIC implementations, the DATA_IN scan chain is required. The DATA_IN pin shall be connected to Shift Register 0, as defined in the text and Figure 88. |
|
3176 |
For NIC implementations, the DATA_IN scan chain is required. The DATA_IN pin shall be connected to Shift Register 0, as defined in the text and Figure 89. |
|
3167 |
For baseboard implementations, the LD# pin shall be pulled up to +3.3V_EDGE through a 1 kOhm resistor if the scan chain is not used to prevent the OCP NIC 3.0 card from erroneous data latching. |
<> |
3181 |
For baseboard implementations, the LD# pin shall be pulled up to +3.3V_EDGE through a 1 kΩ resistor if the scan chain is not used to prevent the OCP NIC 3.0 card from erroneous data latching. |
3168 |
For NIC implementations, the LD# pin implementation is required. The LD# pin shall be connected to Shift Registers 0 & 1, and optionally connected to Shift Registers 2 & 3 (if implemented) as defined in the text and Figure 88. The LD# pin shall be pulled up to +3.3V_EDGE through a 10 kOhm resistor. |
|
3182 |
For NIC implementations, the LD# pin implementation is required. The LD# pin shall be connected to Shift Registers 0 & 1, and optionally connected to Shift Registers 2 & 3 (if implemented) as defined in the text and Figure 89. The LD# pin shall be pulled up to +3.3V_EDGE through a 10 kΩ resistor. |
3169 |
An example Scan Chain timing diagram is shown in Figure 87. The specific timing parameters guaranteed by the Baseboard are shown in Table 28 and timing parameters guaranteed by the OCP NIC 3.0 card are shown in Table 29. The parameters assume operation with a 15pF load between 0°C and 85°C. The values are relaxed when compared to the 74LV165 datasheet and allows system implementers to use alternate implementations (such as a CPLD) instead of discrete logic parts. The data shall be latched by the baseboard on the falling edge of the clock. |
|
3183 |
Two possible examples for the Scan Chain timing diagram are shown in Figure 87 and Figure 88. The specific timing parameters guaranteed by the Baseboard are shown in Table 28 and timing parameters guaranteed by the OCP NIC 3.0 card are shown in Table 29. The parameters assume operation with a 15 pF load between 0 °C and 85 °C. The values are relaxed when compared to the 74LV165 datasheet and allows system implementers to use alternate implementations (such as a CPLD) instead of discrete logic parts. If the waveform in Figure 87 is implemented, the first DATA_IN bit (bit 7 on Byte 0) shall be sampled before the first rising edge of the clock that follows LD# signal rising edge. If the waveform in Figure 88 is implemented, the first DATA_IN bit shall be latched by the baseboard on the falling edge of the clock. For both examples, each subsequent DATA_IN bit shall be latched by the baseboard on the falling edge of the clock. DATA_OUT shall be driven by the baseboard such that that sufficient setup/hold time is assured to the OCP NIC 3.0 card. Note that the first bit that is shifted on DATA_IN is 0.7 (bit 7 on the least significant Byte) while the first bit that is shifted on DATA_OUT is 3.7 (bit 7 on the most significant Byte). |
3170 |
Figure 87: Example Scan Chain Timing Diagram |
|
3184 |
Figure 87: Scan Chain Timing Diagram Example 1 |
|
|
|
3185 |
Figure 88: Scan Chain Timing Diagram Example 2 |
|
3179 |
15 |
<> |
3194 |
151 |
|
|
|
-+ |
3202 |
DATA_OUT valid before CLK↑ |
|
|
|
-+ |
3208 |
LD# high after CLK↓ |
|
|
|
3209 |
DATA_OUT valid after CLK↑ |
|
3204 |
CLK |
<> |
3222 |
CLK2 |
|
3208 |
LD# |
<> |
3226 |
LD#3 |
|
|
|
<> |
3230 |
Note 1: When tw< tPD then DATA_IN may only be valid after LD# rising edge. |
|
|
|
3231 |
Note 2: Applies when LD# is high. |
|
|
|
3232 |
Note 3: When LD# is low, the CLK signal is ignored by the Scan Chain DATA_IN. |
3212 |
The scan chain provides sideband status indication between the OCP NIC 3.0 card and the baseboard. The scan chain bit definition is defined in the two tables below. The scan chain data stream is 32-bits in length for both the DATA_OUT and the DATA_IN streams. The scan chain implementation is optional on the host, but its implementation is mandatory per Table 30 and Table 31 on all OCP NIC 3.0 cards. The scan chain components operates on the +3.3V_EDGE power domain. |
|
3233 |
The Scan Chain provides sideband status indication between the OCP NIC 3.0 card and the baseboard. The Scan Chain bit definition is defined in the two tables below. The Scan Chain data stream is 32-bits in length for both the DATA_OUT and the DATA_IN streams. The Scan Chain implementation is optional on the host, but its implementation is mandatory per Table 30 and Table 31 on all OCP NIC 3.0 cards. The Scan Chain components operates on the +3.3V_EDGE power domain. |
3213 |
The DATA_OUT bus is an output from the host. The DATA_OUT bus provides initial configuration options to the OCP NIC 3.0 card. At the time of this writing, the DATA_OUT bus is not used. All baseboard systems that implement the Scan Chain shall connect DATA_OUT between the platform and the Primary Connector for subsequent revisions of this specification. The DATA_OUT data stream shall shift out all 0’s prior to AUX_PWR_EN assertion to prevent leakage paths into unpowered silicon. |
|
3234 |
The Scan Chain DATA_OUT bus is an output from the host. The Scan Chain DATA_OUT bus provides initial configuration options to the OCP NIC 3.0 card. At the time of this writing, the Scan Chain DATA_OUT bus is not used. All baseboard systems that implement the Scan Chain shall connect DATA_OUT between the platform and the Primary Connector for subsequent revisions of this specification. The DATA_OUT data stream shall shift out all 0’s prior to AUX_PWR_EN assertion to prevent leakage paths into unpowered silicon. |
|
3235 |
The DATA_IN bus is an input to the host and provides NIC status indication. The default implementation is completed with two 8-bit 74LV165 parallel in to serial out shift registers in a cascaded implementation. Up to four shift registers may be implemented to provide additional NIC status indication to the host platform. Alternatively, an OCP NIC 3.0 card vendor may choose to implement this chain using an active device (such as a microcontroller or CPLD). For active device implementations, there is an associated device start-up time. Refer to Section 3.11 for details on the +3.3V_EDGE stable to the first data valid read in ID Mode. |
<> |
3256 |
The Scan Chain DATA_IN bus is an input to the host and provides NIC status indication. The default implementation is completed with two 8-bit 74LV165 parallel into serial out shift registers in a cascaded implementation. Up to four shift registers may be implemented to provide additional NIC status indication to the host platform. Alternatively, an OCP NIC 3.0 card vendor may choose to implement this chain using an active device (such as a microcontroller or CPLD), as long as it implements the function of the 74LV165, supporting circuitry for the Scan Chain and meets all of the timing specifications given in this specification. For active device implementations, there is an associated device start-up time. Refer to Section 3.11 for details on the +3.3V_EDGE stable to the first data valid read in ID Mode. |
3236 |
DATA_IN shift register 0 shall be mandatory for scan chain implementations for the card present, WAKE_N and thermal threshold features. DATA_IN shift registers 1, 2 & 3 are optional depending on the line side I/O and LED fields being reported to the host. Dual port LED applications require shift register 1. Quad port LED applications require shift registers 1 & 2. Octal port applications require shift registers 1, 2 & 3. |
|
3257 |
The Scan Chain DATA_IN shift register 0 shall be mandatory for scan chain implementations for the card present, WAKE_N and thermal threshold features. Scan Chain DATA_IN shift registers 1, 2 & 3 are optional depending on the line side I/O and LED fields being reported to the host. Dual port LED applications require shift register 1. Quad port LED applications require shift registers 1 & 2. Octal port applications require shift registers 1, 2 & 3. |
3237 |
The host should read the DATA_IN bus multiple times to qualify the incoming data stream. The number of data qualification reads is dependent on the baseboard implementation. |
|
3258 |
The host should read the Scan Chain DATA_IN bus multiple times to qualify the incoming data stream. The number of data qualification reads is dependent on the baseboard implementation. |
3238 |
On the OCP NIC 3.0 card, a 1 kOhm pull up resistor shall be connected to the SER input of the last DATA_IN shift register. Doing so ensures the default bit value of 0b1 for implementations using less than four shift registers. |
|
3259 |
On the OCP NIC 3.0 card, a 1 kΩ pull up resistor shall be connected to the SER input of the last DATA_IN shift register. Doing so ensures the default bit value of 0b1 for implementations using less than four shift registers. |
|
3263 |
For LFF designs, this bit shall also serve as the PRSNTB[0]# signal from the Secondary Connector when the card is in ID Mode (AUX_PWR_EN==0). Multiplexing between the two functions shall be controlled via AUX_PWR_EN. Refer to Figure 88 for details. |
<> |
3284 |
For LFF designs, this bit shall also serve as the PRSNTB[0]# signal from the Secondary Connector when the card is in ID Mode (AUX_PWR_EN==0). Multiplexing between the two functions shall be controlled via AUX_PWR_EN. Refer to Figure 89 for details. |
|
3271 |
For LFF designs, this bit shall also serve as the PRSNTB[1]# signal from the Secondary Connector when the card is in ID Mode (AUX_PWR_EN==0). Multiplexing between the two functions shall be controlled via AUX_PWR_EN. Refer to Figure 88 for details. |
<> |
3292 |
For LFF designs, this bit shall also serve as the PRSNTB[1]# signal from the Secondary Connector when the card is in ID Mode (AUX_PWR_EN==0). Multiplexing between the two functions shall be controlled via AUX_PWR_EN. Refer to Figure 89 for details. |
|
3279 |
For LFF designs, this bit shall also serve as the PRSNTB[2]# signal from the Secondary Connector when the card is in ID Mode (AUX_PWR_EN==0). Multiplexing between the two functions shall be controlled via AUX_PWR_EN. Refer to Figure 88 for details. |
<> |
3300 |
For LFF designs, this bit shall also serve as the PRSNTB[2]# signal from the Secondary Connector when the card is in ID Mode (AUX_PWR_EN==0). Multiplexing between the two functions shall be controlled via AUX_PWR_EN. Refer to Figure 89 for details. |
|
3285 |
When high, FAN_ON_AUX shall request the system fan to be enabled for extra cooling in the S5 state. |
<> |
3306 |
When high, FAN_ON_AUX shall request the system fan to be enabled for extra cooling in Aux Power Mode. |
|
3287 |
The FAN_ON_AUX bit shall deassert when the network silicon or transceiver module temperature is at least 5°C below the assertion threshold. |
<> |
3308 |
The FAN_ON_AUX bit shall deassert when the network silicon or transceiver module temperature is at least 5 °C below the assertion threshold. |
3288 |
0b0 – The system fan is not requested/off in S5. |
|
3309 |
0b0 – The system fan is not requested/off in Aux Power Mode. |
3289 |
0b1 – The system fan is requested/on in S5. |
|
3310 |
0b1 – The system fan is requested/on in Aux Power Mode. |
|
3291 |
For LFF designs, this bit shall also serve as the PRSNTB[3]# signal from the Secondary Connector when the card is in ID Mode (AUX_PWR_EN==0). Multiplexing between the two functions shall be controlled via AUX_PWR_EN. Refer to Figure 88 for details. |
<> |
3312 |
For LFF designs, this bit shall also serve as the PRSNTB[3]# signal from the Secondary Connector when the card is in ID Mode (AUX_PWR_EN==0). Multiplexing between the two functions shall be controlled via AUX_PWR_EN. Refer to Figure 89 for details. |
|
3402 |
Figure 88: Scan Chain Connection Example |
<> |
3423 |
Figure 89: Scan Chain Connection Example |
|
3405 |
This section provides the pin assignments for the power supply interface signals. The AC/DC specifications are defined in the PCIe CEM Specification, Rev 4.0 and amended in Section 3.9. An example connection diagram is shown in Figure 89. |
<> |
3426 |
This section provides the pin assignments for the power supply interface signals. The AC/DC specifications are defined in the PCIe CEM Specification, Rev 4.0 and amended in Section 3.9. An example connection diagram is shown in Figure 90. |
|
3433 |
This signal shall be pulled down to GND through a 10 kOhm resistor on the baseboard. This ensures the OCP NIC 3.0 card power is disabled until instructed to turn on by the baseboard. |
<> |
3454 |
This signal shall be pulled down to GND through a 10 kΩ resistor on the baseboard. This ensures the OCP NIC 3.0 card power is disabled until instructed to turn on by the baseboard. |
|
3437 |
For OCP NIC 3.0 cards that support the Programming Mode power state, the condition AUX_PWR_EN==0 and MAIN_PWR_EN==1 shall prevent the aux power supplies from being enabled. An example of this logic is shown in Figure 89. |
<> |
3458 |
For OCP NIC 3.0 cards that support the Programming Mode power state, the condition AUX_PWR_EN==0 and MAIN_PWR_EN==1 shall prevent the aux power supplies from being enabled. An example of this logic is shown in Figure 90. |
|
3444 |
The MAIN_PWR_EN pin is driven by the baseboard and may only be asserted when AUX_PWR_EN is already asserted. The MAIN_PWR_EN pin must be implemented on baseboard systems, but may optionally be used to control main power rail power supplies by the OCP NIC 3.0 card depending on the end point silicon implementation. Depending on the silicon vendor, end point devices may be able to operate in a single power domain, or may require separate power domains to function. |
<> |
3465 |
The MAIN_PWR_EN pin is driven by the baseboard for normal operation and may only be asserted when AUX_PWR_EN is already asserted. The MAIN_PWR_EN pin must be implemented on baseboard systems, but may optionally be used to control main power rail power supplies by the OCP NIC 3.0 card depending on the end point silicon implementation. Depending on the silicon vendor, end point devices may be able to operate in a single power domain, or may require separate power domains to function. |
3445 |
For OCP NIC 3.0 cards that support the Programming Mode power state, the condition AUX_PWR_EN == 0 and MAIN_PWR_EN == 1 shall prevent the main power supplies from being enabled. An example of this gating logic is shown in Figure 89. |
|
3466 |
For OCP NIC 3.0 cards that support the Programming Mode power state, the condition AUX_PWR_EN == 0 and MAIN_PWR_EN == 1 shall prevent the main power supplies from being enabled. An example of this gating logic is shown in Figure 90. |
3446 |
For baseboard implementations, this signal shall be pulled down to GND through a 10 kOhm resistor on the baseboard. This ensures the OCP NIC 3.0 card power is disabled until instructed to turn on by the baseboard. |
|
3467 |
For baseboard implementations, this signal shall be pulled down to GND through a 10 kΩ resistor on the baseboard. This ensures the OCP NIC 3.0 card power is disabled until instructed to turn on by the baseboard. |
|
3455 |
The truth table shows the expected NIC_PWR_GOOD state for power up sequencing depending on the values of AUX_PWR_EN and MAIN_PWR_EN. |
<> |
3476 |
The truth table shows the expected NIC_PWR_GOOD state for power up sequencing. This is dependent on the values of AUX_PWR_EN, MAIN_PWR_EN and the enabled power domains operating within design tolerances. |
|
3458 |
NIC_PWR_GOOD Nominal Steady State Value |
<> |
3479 |
Enabled Power domains nominal |
|
|
|
3480 |
NIC_PWR_GOOD |
|
|
|
-+ |
3484 |
N/A |
|
|
|
-+ |
3489 |
Yes |
|
|
|
-+ |
3494 |
N/A |
|
|
|
-+ |
3499 |
Yes |
|
|
|
<> |
3502 |
1 |
|
|
|
3503 |
0 |
|
|
|
3504 |
No |
|
|
|
3505 |
0 |
|
|
|
3506 |
Transition state (non-operational) |
|
|
|
3507 |
1 |
|
|
|
3508 |
1 |
|
|
|
3509 |
No |
|
|
|
3510 |
0 |
|
|
|
3511 |
Transition state (non-operational) |
3476 |
Refer to the power up and power down sequencing diagrams (Figure 106 and Figure 107) for timing details. |
|
3512 |
Refer to the power up and power down sequencing diagrams (Figure 107 and Figure 108) for timing details. |
3477 |
Where appropriate, designs that have a separate Main Power domain should also connect to the main power good indication to the NIC_PWR_GOOD signal via a FET to isolate the domains. Refer to Figure 89 for an example implementation. |
|
3513 |
Where appropriate, designs that have a separate Main Power domain should also connect to the main power good indication to the NIC_PWR_GOOD signal via a FET to isolate the domains. Refer to Figure 90 for an example implementation. |
|
3480 |
For baseboards, this pin may be connected to the platform I/O hub as a NIC power health status indication. This signal shall be pulled down to ground with a 100 kOhm resistor on the baseboard to prevent a false power good indication if no OCP NIC 3.0 card is present. |
<> |
3516 |
For baseboards, this pin may be connected to the platform I/O hub as a NIC power health status indication. This signal shall be pulled down to ground with a 100 kΩ resistor on the baseboard to prevent a false power good indication if no OCP NIC 3.0 card is present. |
|
3483 |
Figure 89: Example Power Supply Topology |
<> |
3519 |
Figure 90: Example Power Supply Topology |
|
3485 |
This section provides the pin assignments for the USB 2.0 interface signals. USB 2.0 is only defined for operation on the Primary Connector. USB 2.0 may be used for applications with end point silicon that requires a USB connection to the baseboard. Implementations may also allow for a USB-Serial or USB-JTAG translator for serial or JTAG applications. If multiple USB devices are required, an optional USB hub may be implemented on the OCP NIC 3.0 card. Downstream device discovery is completed as part of the bus enumeration per the USB 2.0 specification. A basic example connection diagram is shown in Figure 90. An example depicting USB-Serial and USB-JTAG connectivity with an USB hub is shown in Figure 91. |
<> |
3521 |
This section provides the pin assignments for the USB 2.0 interface signals. USB 2.0 is only defined for operation on the Primary Connector. USB 2.0 may be used for applications with end point silicon that requires a USB connection to the baseboard. Implementations may also allow for a USB-Serial or USB-JTAG translator for serial or JTAG applications. If multiple USB devices are required, an optional USB hub may be implemented on the OCP NIC 3.0 card. Downstream device discovery is completed as part of the bus enumeration per the USB 2.0 specification. A basic example connection diagram is shown in Figure 91. An example depicting USB-Serial and USB-JTAG connectivity with an USB hub is shown in Figure 92. |
|
3503 |
Figure 90: USB 2.0 Connection Example – Basic Connectivity |
<> |
3539 |
Figure 91: USB 2.0 Connection Example – Basic Connectivity |
3504 |
Figure 91: USB 2.0 Connection Example – USB-Serial / USB-JTAG Connectivity |
|
3540 |
Figure 92: USB 2.0 Connection Example – USB-Serial / USB-JTAG Connectivity |
|
3506 |
This section provides the pin assignments for the UART interface signals. UART is only defined for operation on the Secondary Connector. The UART pins may be used with end point silicon that require console redirection over the baseboard – such as LFF SmartNICs. An example connection diagram is shown in Figure 92. |
<> |
3542 |
This section provides the pin assignments for the UART interface signals. UART is only defined for operation on the Secondary Connector. The UART pins may be used with end point silicon that require console redirection over the baseboard – such as LFF SmartNICs. An example connection diagram is shown in Figure 93. |
|
3526 |
Figure 92: UART Connection Example |
<> |
3562 |
Figure 93: UART Connection Example |
|
3544 |
BIF[3:0]#. The BIF# pin states shall be controlled by the baseboard to allow the baseboard to override the default end point bifurcation for silicon that support bifurcation. Additional combinatorial logic is required and is specific to the card silicon. The combinatorial logic is not covered in this specification. The BIF[3:0]# pins may optionally be hardcoded for baseboards that do not require a dynamic bifurcation override. BIF[2:0]# pins exist on each connector. |
<> |
3580 |
BIF[2:0]#. The BIF# pin states shall be controlled by the baseboard to allow the baseboard to override the default end point bifurcation for silicon that support bifurcation. Additional combinatorial logic is required and is specific to the card silicon. The combinatorial logic is not covered in this specification. The BIF[2:0]# pins may optionally be hardcoded for baseboards that do not require a dynamic bifurcation override. BIF[2:0]# pins exist on each connector. |
|
3563 |
For cases where the baseboard request a link count override (such as requesting a 4-host baseboard requesting 4 x4 operation on a supported card that would otherwise default to a 2 x8 case), the BIF[0:2]# pins shall be asserted as appropriate. Asserting the BIF[0:2]# pins assumes the OCP NIC 3.0 card supports the requested link override. |
<> |
3599 |
For cases where the baseboard request a link count override (such as requesting a 4-host baseboard requesting 4 x4 operation on a supported card that would otherwise default to a 2 x8 case), the BIF[2:0]# pins shall be asserted as appropriate. Asserting the BIF[2:0]# pins assumes the OCP NIC 3.0 card supports the requested link override. |
3564 |
Note: For cards that are already powered up, BIF[0:2]# reconfiguration requires a transition back to ID Mode. During this transition, the card power rails are inactive and manageability links may be briefly lost due to the RBT isolation state. |
|
3600 |
Note: For cards that are already powered up, BIF[2:0]# reconfiguration requires a transition back to ID Mode. During this transition, the card power rails are inactive and manageability links may be briefly lost due to the RBT isolation state. |
3565 |
The BIF[0:2]# pins must be in their valid states upon the assertion of AUX_PWR_EN. |
|
3601 |
The BIF[2:0]# pins must be in their valid states upon the assertion of AUX_PWR_EN. |
|
3567 |
MAIN_PWR_EN is asserted. An OP NIC 3.0 card is allowed a max ramp time TMPL between MAIN_PWR_EN assertion and NIC_PWR_GOOD reassertion. For cards that do not have a separate AUX and MAIN power domain, this state is an unconditional transition to NIC_PWR_GOOD. |
<> |
3603 |
MAIN_PWR_EN is asserted. An OP NIC 3.0 card is allowed a max ramp time TMPL between MAIN_PWR_EN assertion and NIC_PWR_GOOD reassertion. For cards that do not have a separate Aux and Main power domain, this state is an unconditional transition to NIC_PWR_GOOD. |
|
3569 |
PERST# shall be deasserted >1 s after NIC_PWR_GOOD assertion as defined in Figure 106. Refer to Section 3.11 for timing details. |
<> |
3605 |
PERST# shall be deasserted >1 s after NIC_PWR_GOOD assertion as defined in Figure 107. Refer to Section 3.11 for timing details. |
|
3573 |
Figure 93 illustrates a single host baseboard that supports x16 with a single controller OCP NIC 3.0 card that also supports x16. The PRSTNB[3:0]# state is 0b0111. The BIF[2:0]# state is 0b000 to set the card as a 1x16 for bifurcation capable controllers. For controllers without bifurcation support, the BIF[2:0] pin connections are not required on the card. The PRSNTB encoding notifies the baseboard that this card is only capable of 1 x16. The single host baseboard determines that it is also capable of supporting 1 x16. The resulting link width is 1 x16. |
<> |
3609 |
Figure 94 illustrates a single host baseboard that supports x16 with a single controller OCP NIC 3.0 card that also supports x16. The PRSTNB[3:0]# state is 0b0111. The BIF[2:0]# state is 0b000 to set the card as a 1x16 for bifurcation capable controllers. For controllers without bifurcation support, the BIF[2:0] pin connections are not required on the card. The PRSNTB encoding notifies the baseboard that this card is only capable of 1 x16. The single host baseboard determines that it is also capable of supporting 1 x16. The resulting link width is 1 x16. |
3574 |
Figure 93: Single Host (1 x16) and 1 x16 OCP NIC 3.0 Card (Single Controller) |
|
3610 |
Figure 94: Single Host (1 x16) and 1 x16 OCP NIC 3.0 Card (Single Controller) |
|
3577 |
Figure 94 illustrates a single host baseboard that supports 2 x8 with a dual controller OCP NIC 3.0 card that also supports 2 x8. The PRSTNB[3:0]# state is 0b0110. The BIF[2:0]# state is 0b000 in this example because the network card only supports a 2x8. The PRSNTB encoding notifies the baseboard that this card is only capable of 2 x8. The single host baseboard determines that it is also capable of supporting 2 x8. The resulting link width is 2 x8. |
<> |
3613 |
Figure 95 illustrates a single host baseboard that supports 2 x8 with a dual controller OCP NIC 3.0 card that also supports 2 x8. The PRSTNB[3:0]# state is 0b0110. The BIF[2:0]# state is 0b000 in this example because the network card only supports a 2x8. The PRSNTB encoding notifies the baseboard that this card is only capable of 2 x8. The single host baseboard determines that it is also capable of supporting 2 x8. The resulting link width is 2 x8. |
3578 |
Figure 94: Single Host (2 x8) and 2 x8 OCP NIC 3.0 Card (Dual Controllers) |
|
3614 |
Figure 95: Single Host (2 x8) and 2 x8 OCP NIC 3.0 Card (Dual Controllers) |
|
3580 |
Figure 95 illustrates a quad host baseboard that supports 4 x4 with a single controller OCP NIC 3.0 card that supports 1 x16, 2 x8 and 4 x4. The PRSTNB[3:0]# state is 0b0100. The BIF[2:0]# state in this example is 0b110 as the end point network controller is forced to bifurcate to 4 x4. The PRSNTB encoding notifies the baseboard that this card is only capable of 1 x16, 2 x8 and 4 x4. The quad host baseboard determines that it is also capable of supporting 4 x4. The resulting link width is 4 x4. |
<> |
3616 |
Figure 96 illustrates a quad host baseboard that supports 4 x4 with a single controller OCP NIC 3.0 card that supports 1 x16, 2 x8 and 4 x4. The PRSTNB[3:0]# state is 0b0100. The BIF[2:0]# state in this example is 0b110 as the end point network controller is forced to bifurcate to 4 x4. The PRSNTB encoding notifies the baseboard that this card is only capable of 1 x16, 2 x8 and 4 x4. The quad host baseboard determines that it is also capable of supporting 4 x4. The resulting link width is 4 x4. |
3581 |
Figure 95: Quad Hosts (4 x4) and 4 x4 OCP NIC 3.0 Card (Single Controller) |
|
3617 |
Figure 96: Quad Hosts (4 x4) and 4 x4 OCP NIC 3.0 Card (Single Controller) |
|
3583 |
Figure 96 illustrates a quad host baseboard that supports 4 x4 with a quad controller OCP NIC 3.0 card that supports 4 x4. The PRSTNB[3:0]# state is 0b0011. The BIF[2:0]# state is a don’t care value as there is no need to instruct the end-point network controllers to a specific bifurcation (each controller only supports 1x4 in this example). The PRSNTB encoding notifies the baseboard that this card is only capable of 4 x4. The quad host baseboard determines that it is also capable of supporting 4 x4. The resulting link width is 4 x4. |
<> |
3619 |
Figure 97 illustrates a quad host baseboard that supports 4 x4 with a quad controller OCP NIC 3.0 card that supports 4 x4. The PRSTNB[3:0]# state is 0b0011. The BIF[2:0]# state is a don’t care value as there is no need to instruct the end-point network controllers to a specific bifurcation (each controller only supports 1x4 in this example). The PRSNTB encoding notifies the baseboard that this card is only capable of 4 x4. The quad host baseboard determines that it is also capable of supporting 4 x4. The resulting link width is 4 x4. |
3584 |
Figure 96: Quad Hosts (4 x4) and 4 x4 OCP NIC 3.0 Card (Quad Controllers) |
|
3620 |
Figure 97: Quad Hosts (4 x4) and 4 x4 OCP NIC 3.0 Card (Quad Controllers) |
|
3586 |
Figure 97 illustrates a single host baseboard that supports 1 x16 with a dual controller OCP NIC 3.0 card that supports 2 x8. The PRSTNB[3:0]# state is 0b0110. The BIF[2:0]# state is 0b000 as each silicon instance only supports 1x8. The PRSNTB encoding notifies the baseboard that this card is only capable of 2 x8. The quad host baseboard determines that it is capable of 1x 16, but down shifts to 1 x8. The resulting link width is 1 x8 and only on endpoint 0. |
<> |
3622 |
Figure 98 illustrates a single host baseboard that supports 1 x16 with a dual controller OCP NIC 3.0 card that supports 2 x8. The PRSTNB[3:0]# state is 0b0110. The BIF[2:0]# state is 0b000 as each silicon instance only supports 1x8. The PRSNTB encoding notifies the baseboard that this card is only capable of 2 x8. The quad host baseboard determines that it is capable of 1x 16, but down shifts to 1 x8. The resulting link width is 1 x8 and only on endpoint 0. |
3587 |
Figure 97: Single Host with no Bifurcation (1 x16) and 2 x8 OCP NIC 3.0 Card (Dual Controllers) |
|
3623 |
Figure 98: Single Host with no Bifurcation (1 x16) and 2 x8 OCP NIC 3.0 Card (Dual Controllers) |
|
3662 |
Figure 98: SFF PCIe REFCLK Mapping – Single Host – 1, 2 and 4 links |
<> |
3698 |
Figure 99: SFF PCIe REFCLK Mapping – Single Host – 1, 2 and 4 links |
3663 |
Figure 99: SFF PCIe REFCLK Mapping – Dual Host – 2 and 4 links |
|
3699 |
Figure 100: SFF PCIe REFCLK Mapping – Dual Host – 2 and 4 links |
|
3665 |
Figure 100: SFF PCIe REFCLK Mapping – Quad Host – 4 Links |
<> |
3701 |
Figure 101: SFF PCIe REFCLK Mapping – Quad Host – 4 Links |
|
3669 |
Figure 101: LFF PCIe REFCLK Mapping – Single Host – 1, 2 and 4 links |
<> |
3705 |
Figure 102: LFF PCIe REFCLK Mapping – Single Host – 1, 2 and 4 links |
3670 |
Figure 102: LFF PCIe REFCLK Mapping – Dual Host – 2 and 4 links |
|
3706 |
Figure 103: LFF PCIe REFCLK Mapping – Dual Host – 2 and 4 links |
|
3672 |
Figure 103: LFF PCIe REFCLK Mapping – Quad Host – 4 Links |
<> |
3708 |
Figure 104: LFF PCIe REFCLK Mapping – Quad Host – 4 Links |
|
3682 |
The numbering of all OCP NIC 3.0 external ports shall start from Port 1. When oriented with the primary side components facing up and viewing directly into the port, Port 1 shall be located on the left hand side. The port numbers shall sequentially increase to the right. Refer to Figure 104 as an example implementation. |
<> |
3718 |
The numbering of all OCP NIC 3.0 external ports shall start from Port 1. When oriented with the primary side components facing up and viewing directly into the port, Port 1 shall be located on the left hand side. The port numbers shall sequentially increase to the right. Refer to Figure 105 as an example implementation. |
|
3709 |
The Link LED shall be located on the left hand side or located on the top for each port when the OCP NIC 3.0 card is viewed in the horizontal plane. |
<> |
3745 |
The Link LED shall be located on the left-hand side or located on the top for each port when the OCP NIC 3.0 card is viewed in the horizontal plane. |
|
3711 |
For uniformity across OCP NIC 3.0 products, all link LEDs should have their luminance across the total surface area measured in millicandelas (mcd) with an average value between 12 mcd to 18 mcd. |
<> |
3747 |
For uniformity across OCP NIC 3.0 products, all link LEDs should have their luminous intensity measured in millicandelas (mcd) with an average value between 12 mcd to 18 mcd. |
|
3724 |
The activity LED shall be located on the right hand side or located on the bottom for each port when the OCP NIC 3.0 card is viewed in the horizontal plane. |
<> |
3760 |
The activity LED shall be located on the right-hand side or located on the bottom for each port when the OCP NIC 3.0 card is viewed in the horizontal plane. |
|
3726 |
For uniformity across OCP NIC 3.0 products, all activity LEDs should have their luminance across the total surface area measured in millicandelas (mcd) with an average value between 12 mcd and 18 mcd. |
<> |
3762 |
For uniformity across OCP NIC 3.0 products, all activity LEDs should have their luminous intensity measured in millicandelas (mcd) with an average value between 12 mcd and 18 mcd. |
|
3734 |
Figure 104: Port and LED Ordering – Example SFF Link/Activity and Speed LED Placement |
<> |
3770 |
Figure 105: Port and LED Ordering – Example SFF Link/Activity and Speed LED Placement |
|
3736 |
Note 1: The example port and LED ordering diagrams shown in Figure 104 are viewed with the card in the horizontal position and the primary side is facing up. |
<> |
3772 |
Note 1: The example port and LED ordering diagrams shown in Figure 105 are viewed with the card in the horizontal position and the primary side is facing up. |
|
3745 |
There are four permissible power states for normal operation of the card: NIC Power Off, ID Mode, Aux Power Mode (S5), and Main Power Mode (S0). These four power states are mandatory for each OCP NIC 3.0 card. An optional fifth power state is Programming Mode and allows the FRU EEPROM to be updated in the field under the baseboard control. The normal transition order for these states is shown in Figure 105 and described in detail in the sections below. For simplicity, only the signal transitions resulting in a state change are shown. The available functions per power state are defined in Table 41. The minimum transition time between power states is defined in Section 3.11. |
<> |
3781 |
There are four permissible power states for normal operation of the card: NIC Power Off, ID Mode, Aux Power Mode, and Main Power Mode. These four power states are mandatory for each OCP NIC 3.0 card. An optional fifth power state is Programming Mode and allows the FRU EEPROM to be updated in the field under the baseboard control. The normal transition order for these states is shown in Figure 106 and described in detail in the sections below. For simplicity, only the signal transitions resulting in a state change are shown. The available functions per power state are defined in Table 41. The minimum transition time between power states is defined in Section 3.11. |
3746 |
Figure 105: Baseboard Power States |
|
3782 |
Figure 106: Baseboard Power States |
3747 |
|
|
3783 |
|
|
3779 |
Aux Power Mode (S5) |
<> |
3815 |
Aux Power Mode |
|
3789 |
Main Power Mode (S0) |
<> |
3825 |
Main Power Mode |
|
3800 |
Note 1: Only the PRSNTB[0:3]# scan chain signals are valid in ID mode as the OCP NIC 3.0 card power rails have not yet been enabled via the AUX_PWR_EN/MAIN_PWR_EN signals. |
<> |
3836 |
Note 1: Only the PRSNTB[3:0]# scan chain signals are valid in ID mode as the OCP NIC 3.0 card power rails have not yet been enabled via the AUX_PWR_EN/MAIN_PWR_EN signals. |
3801 |
Note 2: The +12V_EDGE rail is on, but the max permissible current draw is up to the ID Mode / Programming Mode current limit defined in Section 3.9. |
|
3837 |
Note 2: The +12V_EDGE rail may be disabled at this time, but the max permissible leakage is up to the ID Mode / Programming Mode current limit defined in Section 3.9. |
|
|
|
<> |
3843 |
In the ID Mode, only +3.3V_EDGE is available for powering up the FRU EEPROM and the Scan Chain devices. All OCP NIC 3.0 cards must enter the ID Mode state for FRU EEPROM and scan chain queries immediately following the NIC Power Off state. An OCP NIC 3.0 card shall transition to this mode when AUX_PWR_EN=0 and MAIN_PWR_EN=0. |
3807 |
In the ID Mode, only +3.3V_EDGE is available for powering up the FRU EEPROM and the Scan Chain devices. All OCP NIC 3.0 cards must enter the ID Mode state for FRU EEPROM and scan chain queries immediately following the NIC Power Off state. The baseboard queries the EEPROM and determines the OCP NIC 3.0 device capabilities. The FRU EEPROM content requirements are defined in Section 4.10.3. Only the card PRSNTB[0:3]# bits are valid on the scan chain in this mode as the OCP NIC 3.0 card power rails have not yet been enabled via the AUX_PWR_EN and MAIN_PWR_EN signals. The WAKE#, TEMP_WARN#, TEMP_CRIT#, Link and Activity bits are invalid and should be masked by the baseboard in ID Mode. |
|
3844 |
The baseboard queries the EEPROM and determines the OCP NIC 3.0 device capabilities. The FRU EEPROM content requirements are defined in Section 4.10.3. Only the card PRSNTB[3:0]# bits are valid on the scan chain in this mode as the OCP NIC 3.0 card power rails have not yet been enabled via the AUX_PWR_EN and MAIN_PWR_EN signals. The WAKE#, TEMP_WARN#, TEMP_CRIT#, Link and Activity bits are invalid and should be masked by the baseboard in ID Mode. |
3808 |
The +12V_EDGE rail is not intended to be used in ID Mode, however leakage current may be present. The max leakage is defined in Section 3.9. An OCP NIC 3.0 card shall transition to this mode when AUX_PWR_EN=0 and MAIN_PWR_EN=0. |
|
3845 |
Baseboards may disable +12V_EDGE in this power state. OCP NIC 3.0 cards are not intended to use +12V_EDGE in ID Mode, however leakage current may be present. If +12V_EDGE is not provided by the baseboard and leakage is present, the max voltage leakage from the OCP NIC 3.0 card to the baseboard shall be limited to 300 mV when a 1 kΩ bleed resistor is present on the baseboard. The baseboard bleed resistor is optional if the baseboard can tolerate leakage. If +12V_EDGE is present in ID Mode, the max current is defined in Section 3.9. An OCP NIC 3.0 card shall transition to this mode when AUX_PWR_EN=0 and MAIN_PWR_EN=0. |
3809 |
Aux Power Mode (S5) |
|
3846 |
Aux Power Mode |
3810 |
The Aux Power Mode provides both +3.3V_EDGE as well as +12V_EDGE is available. +12V_EDGE in Aux mode may be used to deliver power to the OCP NIC 3.0 card, but only up to the Aux mode budget as defined in Table 42. An OCP NIC 3.0 card shall transition to this mode when AUX_PWR_EN=1, MAIN_PWR_EN=0, NIC_PWR_GOOD=1 and the duration (TAPL) has passed for the ID-Aux Power Mode ramp. This guarantees the ID mode to Aux Power Mode transition (as shown in Figure 106) has completed and all Aux Power Mode rails are within operating tolerances. The WAKE#, TEMP_WARN#, and TEMP_CRIT# bits shall not sampled until these conditions are met. |
|
3847 |
The Aux Power Mode provides both +3.3V_EDGE as well as +12V_EDGE is available. +12V_EDGE in Aux mode may be used to deliver power to the OCP NIC 3.0 card, but only up to the Aux mode budget as defined in Table 42. An OCP NIC 3.0 card shall transition to this mode when AUX_PWR_EN=1, MAIN_PWR_EN=0, NIC_PWR_GOOD=1 and the duration (TAPL) has passed for the ID-Aux Power Mode ramp. This guarantees the ID mode to Aux Power Mode transition (as shown in Figure 107) has completed and all Aux Power Mode rails are within operating tolerances. The WAKE#, TEMP_WARN#, and TEMP_CRIT# bits shall not sampled until these conditions are met. |
|
|
|
3848 |
For OCP NIC 3.0, Aux Power Mode corresponds to ACPI power state S5 on the system. This could also correspond to ACPI power state S3 or S4 depending on the implementation. |
3811 |
Main Power Mode (S0) |
|
3849 |
Main Power Mode |
3812 |
The Main Power Mode provides both +3.3V_EDGE and +12V_EDGE across the OCP connector. The OCP NIC 3.0 card operates in full capacity. Up to 80 W may be delivered on +12V_EDGE for a SFF Card and up to 150 W for a LFF Card. Additionally, up to 3.63 W is delivered on each +3.3V_EDGE pin. An OCP NIC 3.0 card shall transition to this mode when AUX_PWR_EN=1, MAIN_PWR_EN=1, NIC_PWR_GOOD=1 and the duration (TMPL) has passed for the Aux-Main Power Mode ramp. This guarantees the Aux Power Mode to Main Power Mode transition (as shown in Figure 106) has completed and all Main Power Mode rails are within operating tolerances. The WAKE#, TEMP_WARN#, and TEMP_CRIT# bits shall not sampled until these conditions are met. |
|
3850 |
The Main Power Mode provides both +3.3V_EDGE and +12V_EDGE across the OCP connector. The OCP NIC 3.0 card operates in full capacity. Up to 80 W may be delivered on +12V_EDGE for a SFF Card and up to 150 W for a LFF Card. Additionally, up to 3.63 W is delivered on each +3.3V_EDGE pin. An OCP NIC 3.0 card shall transition to this mode when AUX_PWR_EN=1, MAIN_PWR_EN=1, NIC_PWR_GOOD=1 and the duration (TMPL) has passed for the Aux-Main Power Mode ramp. This guarantees the Aux Power Mode to Main Power Mode transition (as shown in Figure 107) has completed and all Main Power Mode rails are within operating tolerances. The WAKE#, TEMP_WARN#, and TEMP_CRIT# bits shall not sampled until these conditions are met. |
|
|
|
3851 |
For OCP NIC 3.0, Main Power Mode corresponds to ACPI power state S0 on the system. This could also correspond to ACPI power state S1 depending on the implementation. |
|
3814 |
The Programming Mode only provides +3.3V_EDGE for powering up the FRU EEPROM. This is an optional state that disables the FRU EEPROM write protection mechanism via combinatorial logic and allows the baseboard to reprogram the FRU EEPROM. This state shall only be entered from ID mode if the FRU EEPROM advertises support for this power state as defined in Section 4.10.3. |
<> |
3853 |
The Programming Mode provides +3.3V_EDGE for powering up the FRU EEPROM. This is an optional state that disables the FRU EEPROM write protection mechanism via combinatorial logic and allows the baseboard to reprogram the FRU EEPROM. This state shall only be entered from ID mode if the FRU EEPROM advertises support for this power state as defined in Section 4.10.3. |
|
|
|
3854 |
Baseboards may disable +12V_EDGE in this power state. OCP NIC 3.0 cards are not intended to use +12V_EDGE in Programming Mode, however leakage current may be present. If +12V_EDGE is not provided by the baseboard and leakage is present, the max voltage leakage from the OCP NIC 3.0 card to the baseboard shall be limited to 300 mV when a 1 kΩ bleed resistor is present on the baseboard. The baseboard bleed resistor is optional if the baseboard can tolerate leakage. If +12V_EDGE is present in Programming Mode, the max current is defined in Section 3.9. |
3815 |
Additionally, the Aux Power Mode and Main Power Mode SVRs need to remain disabled and NIC_PWR_GOOD shall remain low while the card is in this state. An example discrete logic circuit to accomplish this gating is shown in Figure 89. NIC vendors may implement their own gating circuitry as long as the same result is achieved. |
|
3855 |
Additionally, the Aux Power Mode and Main Power Mode SVRs need to remain disabled and NIC_PWR_GOOD shall remain low while the card is in this state. An example discrete logic circuit to accomplish this gating is shown in Figure 90. NIC vendors may implement their own gating circuitry if the same result is achieved. |
|
3818 |
The baseboard provides +3.3V_EDGE and +12V_EDGE to both the Primary and Secondary Connectors. The rail requirements are leveraged from the PCIe CEM 4.0 specification. For OCP NIC 3.0 implementations, there are five total power envelopes. Four are defined for SFF, and one is defined for LFF. The max current draw is defined in Table 42 for each state and power envelope and is inclusive of the line side transceivers installed on the card. |
<> |
3858 |
The baseboard provides +3.3V_EDGE and +12V_EDGE to both the Primary and Secondary Connectors. The rail requirements are leveraged from the PCIe CEM 4.0 specification. For OCP NIC 3.0 implementations, there are six total power envelopes. Five are defined for SFF, and one is defined for LFF. The max current draw is defined in Table 42 for each state and power envelope and is inclusive of the line side transceivers installed on the card. The slot power values are the max supportable power delivered to the card for each slot type. This is independent of the +3.3V_EDGE and +12V_EDGE rails deviating from their nominal values. |
3819 |
Table 42: Baseboard Power Supply Rail Requirements – Slot Power Envelopes |
|
3859 |
Table 42: Baseboard Power Supply Rail Requirements – Slot Power Envelopes |
|
3822 |
Hot Aisle |
+- |
|
|
|
3825 |
Hot Aisle |
+- |
|
|
|
3827 |
Hot Aisle |
<> |
3865 |
50 W Slot SFF |
|
3829 |
Cold Aisle |
+- |
|
|
|
3831 |
Cold Aisle |
+- |
|
|
|
3837 |
Aux Mode |
<> |
3873 |
Aux Power Mode |
3838 |
Main Mode |
|
3874 |
Main Power Mode |
|
|
|
-+ |
3876 |
±9% (max) |
|
|
|
3877 |
100 mA (max) 100 mA (max) |
|
|
|
3878 |
1.1 A (max) |
|
|
|
3879 |
1.1 A (max) |
|
|
|
3880 |
150 μF (max) |
|
3869 |
ID Mode |
<> |
3910 |
ID Mode5 |
3870 |
Programming Mode |
|
3911 |
Programming Mode5 |
3871 |
Aux Mode |
|
3912 |
Aux Power Mode |
3872 |
Main Mode |
|
3913 |
Main Power Mode |
|
|
|
-+ |
3936 |
2.1 A (max) |
|
|
|
3937 |
4.1 A (max) |
|
|
|
3938 |
1200 μF (max) |
|
|
|
3939 |
+8/-12% (max) |
|
|
|
3940 |
50 mA (max) |
|
|
|
3941 |
50 mA (max) |
|
3897 |
500 μF (max) |
<> |
3944 |
2000 μF (max) |
|
3903 |
1000 μF (max) |
<> |
3950 |
2000 μF (max) |
|
3906 |
Note 3: Each OCP NIC 3.0 card shall limit the bulk capacitance to the max values published (500 μF for a SFF card, 1000 μF for a LFF card). |
<> |
3953 |
Note 3: Each OCP NIC 3.0 card shall limit the bulk capacitance to the max published values. |
|
|
|
-+ |
3956 |
Note 5: +12V_EDGE may optionally be disabled during ID Mode and Programming mode. Refer to Section 3.8 for details. |
|
3910 |
Additionally, the baseboard shall advertise its slot power limits to aid in the overall board power budget allocation to prevent a high power card from being enabled in a lower power class slot. This is implemented via the Slot Power Limit Control mechanism as defined in the PCIe Base Specification. The end point silicon will power up in a low power state until power is negotiated. |
<> |
3958 |
Additionally, the baseboard shall advertise its slot power limits to aid in the overall board power budget allocation to prevent a high-power card from being enabled in a lower power class slot. This is implemented via the Slot Power Limit Control mechanism as defined in the PCIe Base Specification. The end point silicon will power up in a low power state until power is negotiated. |
|
3920 |
Figure 106: Power-Up Sequencing – Normal Operation |
<> |
3968 |
Figure 107: Power-Up Sequencing – Normal Operation |
|
|
|
3969 |
|
3921 |
Figure 107: Power-Down Sequencing – Normal Operation |
|
3970 |
Figure 108: Power-Down Sequencing – Normal Operation |
|
|
|
3971 |
|
3922 |
Figure 108: Programming Mode Sequencing |
|
3972 |
Figure 109: Programming Mode Sequencing |
|
|
|
3973 |
|
|
3940 |
Minimum guaranteed time per spec to spend in ID mode. |
<> |
3991 |
Minimum time per spec to spend in ID mode. |
|
4061 |
Optional |
<> |
4112 |
N/A |
|
4065 |
Optional |
<> |
4116 |
N/A |
|
4149 |
The temperature reporting interface shall be accessible in Aux Power Mode (S5), and Main Power Mode (S0). Table 50 summarizes temperature reporting requirements. These requirements improve the system thermal management and allow the baseboard management device to access key component temperatures on an OCP NIC 3.0 card. When the temperature reporting function is implemented, it is required that the temperature reporting accuracy is within ±3°C. |
<> |
4200 |
The temperature reporting interface shall be accessible in Aux Power Mode, and Main Power Mode. Table 51 summarizes temperature reporting requirements. These requirements improve the system thermal management and allow the baseboard management device to access key component temperatures on an OCP NIC 3.0 card. When the temperature reporting function is implemented, it is required that the temperature reporting accuracy is within ±3 °C. |
|
|
|
4201 |
As an example, the assumed hysteresis value for any threshold deassertion is 2 °C. For the three upper severity levels (Warning, Critical and Fatal), the thresholds shall be no less than the reporting accuracy of the temperature sensor (±3 °C) plus the hysteresis value. Therefore, the minimum temperature delta between thresholds should be 5 °C. Larger temperature deltas between severity levels are permitted. |
|
|
|
4202 |
The Fatal threshold should be set to the temperature at which the silicon may experience permanent failures. |
|
|
|
4203 |
The Critical threshold should be set to the temperature at which degraded performance or transient errors may occur for the silicon. The life span of the product may be impacted. At minimum, the Critical threshold shall be at least 5 °C below Fatal. |
|
|
|
4204 |
The Warning threshold should be set to at least 5 °C below Critical and set accordingly to the NIC vendor to give an early indication that the server needs to take remedial action to increase cooling capacity. |
|
|
|
4205 |
To illustrate this concept, the following example shows a silicon device with an operating Tj of 105 °C per the device datasheet and card temperature reporting accuracy of ±3 °C. The Upper Fatal threshold is fix to the upper device temperature before immediate physical damage is incurred. This threshold values can be adjusted when the card temperature sensor reporting accuracy is better than ±3 °C. |
|
|
|
4206 |
Table 50: Threshold Severity Level vs Example Threshold Values |
|
|
|
4207 |
Threshold Severity Level |
|
|
|
4208 |
Example Threshold Value (°C) |
|
|
|
4209 |
Upper Fatal |
|
|
|
4210 |
115 |
|
|
|
4211 |
Upper Critical |
|
|
|
4212 |
105 |
|
|
|
4213 |
Upper Warning |
|
|
|
4214 |
100 |
|
|
|
4215 |
For the severity levels above, each baseboard shall ensure the card fatal thermal limit is not exceeded. In ID Mode, baseboard shall determine if the card present in the OCP NIC 3.0 slot is thermally supportable for the thermal tier as defined in the FRU contents. |
4150 |
Table 50: Temperature Reporting Requirements |
|
4216 |
Table 51: Temperature Reporting Requirements |
|
4163 |
When the temperature sensor reporting function is implemented, the OCP NIC 3.0 card shall support PLDM for Platform Monitoring and Control (DSP0248 compliant) for temperature reporting. |
<> |
4229 |
When the temperature sensor reporting function is implemented, the OCP NIC 3.0 card shall support PLDM for Platform Monitoring and Control (DSP0248 compliant) for temperature reporting. Additionally, refer to DSP2054 for the PLDM NIC Modeling scheme. |
|
4168 |
Note: Refer to DSP0248 for definitions of the upper warning, upper critical, and upper fatal thresholds. |
<> |
4234 |
Note: Refer to DSP0248 for definitions of the upper warning, upper critical, and upper fatal thresholds. Additionally, refer to DSP2054 for the PLDM NIC Modeling scheme. |
|
4189 |
An OCP NIC 3.0 implementation may be able to report the power consumed at the board level. It is important for the system management that the information about the power consumption can be retrieved over sideband interfaces. Table 51 summarizes the power consumption reporting requirements. |
<> |
4255 |
An OCP NIC 3.0 implementation may be able to report the power consumed at the board level. It is important for the system management that the information about the power consumption can be retrieved over sideband interfaces. Table 52 summarizes the power consumption reporting requirements. |
4190 |
Table 51: Power Consumption Reporting Requirements |
|
4256 |
Table 52: Power Consumption Reporting Requirements |
|
4212 |
A pluggable transceiver module is a compact, hot-pluggable transceiver used to connect the OCP 3.0 NIC to an external physical medium. It is important for proper system operation to know the presence and temperature of pluggable transceiver modules. Table 52 summarizes pluggable module status reporting requirements. The transceiver temperature is always reported and is independent of the ASIC die temperature reporting requirements as discussed in Section 4.4. The temperature reporting interface shall be accessible in Aux Power Mode (S5), and Main Power Mode (S0). |
<> |
4278 |
A pluggable transceiver module is a compact, hot-pluggable transceiver used to connect the OCP 3.0 NIC to an external physical medium. It is important for proper system operation to know the presence and temperature of pluggable transceiver modules. Table 53 summarizes pluggable module status reporting requirements. The transceiver temperature is always reported and is independent of the ASIC die temperature reporting requirements as discussed in Section 4.4. The temperature reporting interface shall be accessible in Aux Power Mode, and Main Power Mode. |
4213 |
Table 52: Pluggable Module Status Reporting Requirements |
|
4279 |
Table 53: Pluggable Module Status Reporting Requirements |
|
4227 |
An OCP NIC 3.0 implementation can have different types of firmware components for data path, control path, and management path operations. It is desirable that OCP NIC 3.0 implementations support an OS-independent mechanism for the management firmware update. It is desirable that the management firmware update does not require a system reboot for the new firmware image to become active. Table 53 summarizes the firmware inventory and update requirements. |
<> |
4293 |
An OCP NIC 3.0 implementation can have different types of firmware components for data path, control path, and management path operations. It is desirable that OCP NIC 3.0 implementations support an OS-independent mechanism for the management firmware update. It is desirable that the management firmware update does not require a system reboot for the new firmware image to become active. Table 54 summarizes the firmware inventory and update requirements. |
4228 |
Table 53: Management and Pre-OS Firmware Inventory and Update Requirements |
|
4294 |
Table 54: Management and Pre-OS Firmware Inventory and Update Requirements |
|
4267 |
Baseboards use the Slot_ID[1:0] values on the Primary Connector for this identification. The value of Slot_ID[1:0] is determined by the encoding shown in Table 54. SLOT_ID[1:0] is statically set high or low on the baseboard and is available on the OCP Bay portion of the Primary Connector. |
<> |
4333 |
Baseboards use the Slot_ID[1:0] values on the Primary Connector for this identification. The value of Slot_ID[1:0] is determined by the encoding shown in Table 55. SLOT_ID[1:0] is statically set high or low on the baseboard and is available on the OCP Bay portion of the Primary Connector. |
4268 |
Table 54: Slot_ID[1:0] to Package ID[2:0] Mapping |
|
4334 |
Table 55: Slot_ID[1:0] to Package ID[2:0] Mapping |
|
4316 |
All predefined SMBus addresses for OCP NIC 3.0 are shown in Table 55. Baseboard and OCP NIC 3.0 card designers must ensure additional devices do not conflict. The addresses shown are in 8-bit format and represent the read/write address pair. |
<> |
4382 |
All predefined SMBus addresses for OCP NIC 3.0 are shown in Table 56. Baseboard and OCP NIC 3.0 card designers must ensure additional devices do not conflict. The addresses shown are in 8-bit format and represent the read/write address pair. |
4317 |
Table 55: FRU EEPROM Address Map |
|
4383 |
Table 56: FRU EEPROM Address Map |
|
4368 |
The FRU EEPROM is readable in all four power states: ID mode, Programming mode, Aux Power mode (S5), and Main Power mode (S0). |
<> |
4434 |
The FRU EEPROM is readable in all four power states: ID mode, Programming mode, Aux Power Mode, and Main Power Mode. |
4369 |
The permissible EEPROM addresses are indicated in Table 55. The write/read pair is presented in 8-bit format. The EEPROM shall use double byte addressing and, at minimum, shall be of sufficient size to hold the base FRU contents and any vendor specific information. The double byte write and read accesses are shown in 109 and Figure 110. Refer to the I2C specification for timing details. |
|
4435 |
The permissible EEPROM addresses are indicated in Table 56. The write/read pair is presented in 8-bit format. The EEPROM shall use double byte addressing and, at minimum, shall be of sufficient size to hold the base FRU contents and any vendor specific information. The double byte write and read accesses are shown in 110 and Figure 111. Refer to the I2C specification for timing details. |
4370 |
Figure 109: FRU EEPROM Writes with Double Byte Addressing |
|
4436 |
Figure 110: FRU EEPROM Writes with Double Byte Addressing |
4371 |
Figure 110: FRU EEPROM Reads with Double Byte Addressing |
|
4437 |
Figure 111: FRU EEPROM Reads with Double Byte Addressing |
|
4374 |
The FRU update flow is shown in Figure 111. |
<> |
4440 |
The FRU update flow is shown in Figure 112. |
4375 |
Figure 111: FRU Update Flow |
|
4441 |
Figure 112: FRU Update Flow |
|
4378 |
The OEM record 0xC0 is used to store specific records for the OCP NIC 3.0 and is stored in the MultiRecord area of the FRU layout. For an OCP NIC 3.0 card, the FRU EEPROM OEM record content based on the format defined in Table 56 shall be populated. |
<> |
4444 |
The OEM record 0xC0 is used to store specific records for the OCP NIC 3.0 and is stored in the MultiRecord area of the FRU layout. For an OCP NIC 3.0 card, the FRU EEPROM OEM record content based on the format defined in Table 57 shall be populated. |
4379 |
Note: Table 56 only shows a portion of the OEM record. The complete record includes a Common Header and valid record checksum as defined in the IPMI Platform Management FRU Information Storage Definition specification. |
|
4445 |
Note: Table 57 only shows a portion of the OEM record. The complete record includes a Common Header and valid record checksum as defined in the IPMI Platform Management FRU Information Storage Definition specification. |
4380 |
Table 56: FRU EEPROM Record – OEM Record 0xC0, Offset 0x00 |
|
4446 |
Table 57: FRU EEPROM Record – OEM Record 0xC0, Offset 0x00 |
|
4391 |
This field indicates the card OEM Record Version. Baseboards shall read this field to determine the OEM Record format. OCP NIC 3.0 cards compliant to this version of the specification shall be set the field to 0x01. Future changes to the OEM Record format will result in an additional record version value added to this list. |
<> |
4457 |
This field indicates the card OEM Record Version. Baseboards shall read this field to determine the OEM Record format. OCP NIC 3.0 cards compliant to this version of the specification shall be set the field to 0x01. Future changes to the OEM Record format will result in an additional record version value added to this list. |
|
|
|
4458 |
0x00 – Reserved0x01 – OCP NIC 3.0 card FRU record released with version 0.90 |
4392 |
0x00 – Reserved0x01 – OCP NIC 3.0 card FRU record released with version 0.900x02 – 0xFF – Reserved |
|
4459 |
0x02 – OCP NIC 3.0 card FRU record released with version 1.10x03 – 0xFF – Reserved |
|
4395 |
Card Max power (in Watts) in MAIN (S0) mode. |
<> |
4462 |
Card Max power (in Watts) in Main Power Mode. |
4396 |
The encoded value is the calculated max power of the OCP NIC 3.0 card in the Main Power (S0) mode only and does not include the consumed power by transceivers plugged into the line side receptacle(s). |
|
4463 |
The encoded value is the calculated max power of the OCP NIC 3.0 card in the Main Power Mode only and does not include the consumed power by transceivers plugged into the line side receptacle(s). |
|
4400 |
Card Max power (in Watts) in AUX (S5) mode. |
<> |
4467 |
Card Max power (in Watts) in Aux Power Mode. |
4401 |
The encoded value is the calculated max power of the OCP NIC 3.0 card in the Aux Power (S5) mode only and does not include the consumed power by transceivers plugged into the line side receptacle(s). |
|
4468 |
The encoded value is the calculated max power of the OCP NIC 3.0 card in the Aux Power Mode only and does not include the consumed power by transceivers plugged into the line side receptacle(s). |
|
4420 |
Hot aisle standby airflow requirement. |
<> |
4487 |
Hot aisle standby airflow requirement with Active Cables. |
4421 |
The encoded value represents the amount of airflow, in LFM, required to cool the card in AUX (S5) mode while operating in a hot aisle environment with an approach air temperature of 45°C. Refer to Section 6 for more information about the thermal and environmental requirements. |
|
4488 |
The encoded value represents the amount of airflow, in LFM, required to cool the card in Aux Power Mode with active cables while operating in a hot aisle environment with an approach air temperature of 45 °C. Refer to Section 6 for more information about the thermal and environmental requirements. |
|
4423 |
0x0000-0xFFFE – LFM required for cooling card in Hot Aisle Operation.0xFFFF – Unknown. |
<> |
4490 |
0x0000 – Card only supports passive cables (e.g., Direct Attached Cables or RJ45)0x0001 – 0xFFFE – LFM required for cooling card in Hot Aisle Operation.0xFFFF – Unknown. |
|
4426 |
Cold aisle standby airflow requirement. |
<> |
4493 |
Cold aisle standby airflow requirement with Active Cables. |
4427 |
The encoded value represents the amount of airflow, in LFM, required to cool the card in AUX (S5) mode while operating in a cold aisle environment with an approach air temperature of 35°C. Refer to Section 6 for more information about the thermal and environmental requirements. |
|
4494 |
The encoded value represents the amount of airflow, in LFM, required to cool the card in Aux Power Mode with active cables while operating in a cold aisle environment with an approach air temperature of 35 °C. Refer to Section 6 for more information about the thermal and environmental requirements. |
|
4429 |
0x0000-0xFFFE – LFM required for cooling card in Cold Aisle Operation.0xFFFF – Unknown. |
<> |
4496 |
0x0000 – Card only supports passive cables (e.g., Direct Attached Cables or RJ45)0x0001 – 0xFFFE – LFM required for cooling card in Cold Aisle Operation.0xFFFF – Unknown. |
|
4468 |
0x00 – Card only supports passive cables (e.g., RJ45)0x01 – Hot Aisle Cooling Tier 10x02 – Hot Aisle Cooling Tier 20x03 – Hot Aisle Cooling Tier 30x04 – Hot Aisle Cooling Tier 40x05 – Hot Aisle Cooling Tier 50x06 – Hot Aisle Cooling Tier 60x07 – Hot Aisle Cooling Tier 70x08 – Hot Aisle Cooling Tier 80x09 – Hot Aisle Cooling Tier 90x0A – Hot Aisle Cooling Tier 100x0B – Hot Aisle Cooling Tier 110x0C – Hot Aisle Cooling Tier 120x0D – 0xFE – Reserved 0xFF – Unknown |
<> |
4535 |
0x00 – Card only supports passive cables (e.g., Direct Attached Cables or RJ45)0x01 – Hot Aisle Cooling Tier 10x02 – Hot Aisle Cooling Tier 20x03 – Hot Aisle Cooling Tier 30x04 – Hot Aisle Cooling Tier 40x05 – Hot Aisle Cooling Tier 50x06 – Hot Aisle Cooling Tier 60x07 – Hot Aisle Cooling Tier 70x08 – Hot Aisle Cooling Tier 80x09 – Hot Aisle Cooling Tier 90x0A – Hot Aisle Cooling Tier 100x0B – Hot Aisle Cooling Tier 110x0C – Hot Aisle Cooling Tier 120x0D – 0xFE – Reserved 0xFF – Unknown |
|
4473 |
0x00 – Card only supports passive cables (e.g., RJ45)0x01 – Cold Aisle Cooling Tier 10x02 – Cold Aisle Cooling Tier 20x03 – Cold Aisle Cooling Tier 30x04 – Cold Aisle Cooling Tier 40x05 – Cold Aisle Cooling Tier 50x06 – Cold Aisle Cooling Tier 60x07 – Cold Aisle Cooling Tier 70x08 – Cold Aisle Cooling Tier 80x09 – Cold Aisle Cooling Tier 90x0A – Cold Aisle Cooling Tier 100x0B – Cold Aisle Cooling Tier 110x0C – Cold Aisle Cooling Tier 120x0D – 0xFE – Reserved 0xFF – Unknown |
<> |
4540 |
0x00 – Card only supports passive cables (e.g., Direct Attached Cables or RJ45)0x01 – Cold Aisle Cooling Tier 10x02 – Cold Aisle Cooling Tier 20x03 – Cold Aisle Cooling Tier 30x04 – Cold Aisle Cooling Tier 40x05 – Cold Aisle Cooling Tier 50x06 – Cold Aisle Cooling Tier 60x07 – Cold Aisle Cooling Tier 70x08 – Cold Aisle Cooling Tier 80x09 – Cold Aisle Cooling Tier 90x0A – Cold Aisle Cooling Tier 100x0B – Cold Aisle Cooling Tier 110x0C – Cold Aisle Cooling Tier 120x0D – 0xFE – Reserved 0xFF – Unknown |
|
4478 |
SFF-8472 for SFP modules – Power level 1 through 3SFF-8636 for QSFP modules – Power Classes 1 through 7. |
<> |
4545 |
SFF-8472 for SFP modules – Power level 1 through 3.SFF-8636 for QSFP modules – Power Classes 1 through 8. |
4479 |
0x00 – Passive Cable0x01 – QSFP Active cable Power Class 1 (1.5 W max) / SFP Level 1 (1.0 W max)0x02 – QSFP Active cable Power Class 2 (2.0 W max) / SFP Level 2 (1.5 W max)0x03 – QSFP Active cable Power Class 3 (2.5 W max) / SFP Level 3 (2.0 W max)0x04 – QSFP Active cable Power Class 4 (3.5 W max)0x05 – QSFP Active cable Power Class 5 (4.0 W max)0x06 – QSFP Active cable Power Class 6 (4.5 W max)0x07 – QSFP Active cable Power Class 7 (5.0 W max)0x08 – 0xFE – Reserved0xFF – Unknown |
|
4546 |
0x00 – Passive Cable0x01 – QSFP Active cable Power Class 1 (1.5 W max) / SFP Level 1 (1.0 W max)0x02 – QSFP Active cable Power Class 2 (2.0 W max) / SFP Level 2 (1.5 W max)0x03 – QSFP Active cable Power Class 3 (2.5 W max) / SFP Level 3 (2.0 W max)0x04 – QSFP Active cable Power Class 4 (3.5 W max)0x05 – QSFP Active cable Power Class 5 (4.0 W max)0x06 – QSFP Active cable Power Class 6 (4.5 W max)0x07 – QSFP Active cable Power Class 7 (5.0 W max)0x08 – QSFP Active cable Power Class 8 (10.0 W max)0x09 – 0xFE – Reserved0xFF – Unknown |
|
|
|
<> |
4557 |
24 |
|
|
|
4558 |
1 |
|
|
|
4559 |
Aux Power Supported Ports |
|
|
|
4560 |
Each bit indicates if the corresponding port can be active in Aux Power Mode. This is a bit map representation. The LSB represents Port 1, the MSB represents Port 8. Refer to Section 3.7.1 for the port numbering nomenclature. |
|
|
|
4561 |
Examples:0b00000000 – Configuration unknown.0b00000001 – Only Port 1 can be active in Aux Power Mode.0b00000010 – Only Port 2 can be active in Aux Power Mode.0b00000011 – Ports 1 and 2 can be active in Aux Power Mode.Etc. |
|
|
|
4562 |
25 |
|
|
|
4563 |
2 |
|
|
|
4564 |
Hot aisle standby airflow requirement with Passive Cables or RJ45. |
|
|
|
4565 |
The encoded value represents the amount of airflow, in LFM, required to cool the card in Aux Power Mode with passive cables or RJ45 while operating in a hot aisle environment with an approach air temperature of 45 °C. Refer to Section 6 for more information about the thermal and environmental requirements. |
|
|
|
4566 |
Byte 25 is the least significant byte, byte 26 is the most significant byte. |
|
|
|
4567 |
0x0000-0xFFFE – LFM required for cooling card in Hot Aisle Operation.0xFFFF – Unknown. |
|
|
|
4568 |
27 |
|
|
|
4569 |
2 |
|
|
|
4570 |
Cold aisle standby airflow requirement with Passive Cables or RJ45. |
|
|
|
4571 |
The encoded value represents the amount of airflow, in LFM, required to cool the card in Aux Power Mode with passive cables or RJ45 while operating in a cold aisle environment with an approach air temperature of 35 °C. Refer to Section 6 for more information about the thermal and environmental requirements. |
|
|
|
4572 |
Byte 27 is the least significant byte, byte 28 is the most significant byte. |
|
|
|
4573 |
0x0000-0xFFFE – LFM required for cooling card in Cold Aisle Operation.0xFFFF – Unknown. |
4490 |
24:30 |
|
4574 |
29:30 |
4491 |
7 |
|
4575 |
2 |
|
4526 |
The overall end-to-end timing budget is computed by the formula below. The values of each parameter are shown in Table 57 and in DSP0222. The overall BMC pad to ASIC pad timing budget is 3 ns assuming the values shown. This value is inclusive of the RBT isolation buffer on the baseboard, propagation delay through the OCP connector, clock jitter or any clock buffers that may be implemented on the OCP NIC 3.0 card. The addition of these components subtract from the total available budget. |
<> |
4610 |
The overall end-to-end timing budget is computed by the formula below. The values of each parameter are shown in Table 58 and in DSP0222. The overall BMC pad to ASIC pad timing budget is 3 ns assuming the values shown. This value is inclusive of the RBT isolation buffer on the baseboard, propagation delay through the OCP connector, clock jitter or any clock buffers that may be implemented on the OCP NIC 3.0 card. The addition of these components subtracts from the total available budget. |
|
4531 |
Table 57: NC-SI over RBT Timing Parameters |
<> |
4615 |
Table 58: NC-SI over RBT Timing Parameters |
|
4580 |
Figure 112: NC-SI over RBT Timing Budget Topology |
<> |
4664 |
Figure 113: NC-SI over RBT Timing Budget Topology |
|
4582 |
The traces shall be implemented as 50 Ohm ±15% impedance controlled nets. Baseboard and NIC designers are encouraged to follow the guidelines defined in the RMII and NC-SI specifications for physical routing. Refer to Section 3.4.4 and the DSP0222 specification for example interconnect topologies. |
<> |
4666 |
The traces shall be implemented as 50 Ω ±15% impedance-controlled nets. Baseboard and NIC designers are encouraged to follow the guidelines defined in the RMII and NC-SI specifications for physical routing. Refer to Section 3.4.4 and the DSP0222 specification for example interconnect topologies. |
|
4586 |
The skew requirement defines the max permissible clock skew (TSKEW) between any two system devices. The TSKEW calculation is computed by the formula below. This applies to both the devices on the baseboard and the NIC. L1 is the REF_CLK segment from the baseboard 50 MHz reference clock generator to the BMC. L2 is the REF_CLK segment between the baseboard clock generator to the OCP NIC 3.0 connector and L3 is the segment between the SFF OCP NIC 3.0 card gold fingers and the target ASIC. Refer to Figure 112 for details. The max permissible value of L3 is TNIC,SFF = 900 ps as discussed in Section 5.1.3. Baseboard vendors shall take this value into consideration when analyzing the available timing budget. |
<> |
4670 |
The skew requirement defines the max permissible clock skew (TSKEW) between any two system devices. The TSKEW calculation is computed by the formula below. This applies to both the devices on the baseboard and the NIC. L1 is the REF_CLK segment from the baseboard 50 MHz reference clock generator to the BMC. L2 is the REF_CLK segment between the baseboard clock generator to the OCP NIC 3.0 connector and L3 is the segment between the SFF OCP NIC 3.0 card gold fingers and the target ASIC. Refer to Figure 113 for details. The max permissible value of L3 is TNIC,SFF = 900 ps as discussed in Section 5.1.3. Baseboard vendors shall take this value into consideration when analyzing the available timing budget. |
|
4594 |
This propagation delay is equivalent to a max length of 5.1 inches assuming standard FR4 material with a propagation delay of 175 ps/in. Additional trace length may be achieved with the use of a higher propagation velocity material (e.g., material with a lower dielectric constant) on the baseboard and OCP NIC 3.0 card or simultaneously using both BMC and ASIC devices with an improved timing from Clock-to-Out (TCO,MAX) value compared to the published value of 12.5 ns in DSP0222. For NIC implementations with clock buffers, the propagation delay of the buffer needs to be included in this timing budget (i.e., L3 + TCLK_BUF + L3’ + TCO,MAX + L5 shall be less than 14.3 ns) as shown in Figure 114. |
<> |
4678 |
This propagation delay is equivalent to a max length of 5.1 inches assuming standard FR4 material with a propagation delay of 175 ps/in. Additional trace length may be achieved with the use of a higher propagation velocity material (e.g., material with a lower dielectric constant) on the baseboard and OCP NIC 3.0 card or simultaneously using both BMC and ASIC devices with an improved timing from Clock-to-Out (TCO,MAX) value compared to the published value of 12.5 ns in DSP0222. For NIC implementations with clock buffers, the propagation delay of the buffer needs to be included in this timing budget (i.e., L3 + TCLK_BUF + L3’ + TCO,MAX + L5 shall be less than 14.3 ns) as shown in Figure 115. |
4595 |
If multiple ASICs are utilized, the RBT_CLK_IN signal may be routed with a T-topology as shown in Figure 113. The trace length would be calculated as the delay summation of segment L3 + L3’ for ASIC #0 and L3 + L3” for ASIC #1. The data path delay to the ASIC is L5. |
|
4679 |
If multiple ASICs are utilized, the RBT_CLK_IN signal may be routed with a T-topology as shown in Figure 114. The trace length would be calculated as the delay summation of segment L3 + L3’ for ASIC #0 and L3 + L3” for ASIC #1. The data path delay to the ASIC is L5. |
4596 |
Figure 113: NC-SI over RBT Propagation Delay Matching for Two Target ASICs – No Clock Buffer |
|
4680 |
Figure 114: NC-SI over RBT Propagation Delay Matching for Two Target ASICs – No Clock Buffer |
4597 |
A clock buffer is optionally permitted if the NIC timing budget is not violated. This is shown in Figure 114. In this case, the trace length would be calculated as the delay summation of trace segment L3 + TCLK_BUF + L3’ for ASIC #0, and L3 + TCLK_BUF + L3’ for ASIC #1. |
|
4681 |
A clock buffer is optionally permitted if the NIC timing budget is not violated. This is shown in Figure 115. In this case, the trace length would be calculated as the delay summation of trace segment L3 + TCLK_BUF + L3’ for ASIC #0, and L3 + TCLK_BUF + L3’ for ASIC #1. |
4598 |
Figure 114: NC-SI over RBT Propagation Delay Matching for Two Target ASICs – Clock Buffer |
|
4682 |
Figure 115: NC-SI over RBT Propagation Delay Matching for Two Target ASICs – Clock Buffer |
|
4606 |
The OCP NIC 3.0 PCIe channel requirements align with the electrical budget and constraints as detailed in the PCI Express® CEM 4.0 Rev 1.0 and PCI Express Base Specification Rev 4.0. Exceptions or clarifications to the referenced specifications are noted in the sections below. |
<> |
4690 |
The OCP NIC 3.0 PCIe channel requirements for PCI Express® Gen 4.0 align with the electrical budget and constraints as detailed in the PCI Express® CEM 4.0 Rev 1.0 and PCI Express Base Specification Rev 4.0. Exceptions or clarifications to the referenced specifications are noted in the sections below. The OCP NIC 3.0 PCIe channel requirements for PCI Express® Gen 5.0 differ from the PCI Express® CEM 5.0 Rev 0.7 for Insertion Loss Values as the loss was reduced on the OCP NIC 3.0 to allow the baseboard additional margin for SFF implementations. The OCP NIC 3.0 LFF aligns with the specification. Refer to Section 5.3.1.2 for details. |
|
4608 |
REFCLK requirements are detailed in the PCI Express CEM 4.0 Rev 1.0 Section 2.1. |
<> |
4692 |
REFCLK requirements are detailed in the PCI Express CEM 5.0 Rev 0.7 Section 2.1. |
|
4611 |
Table 58: PCIe Electrical Budgets |
<> |
4695 |
Table 59: PCIe Electrical Budgets |
|
|
|
-+ |
4698 |
PCIe CEM 5.0 Rev 0.7 Specification Section |
|
|
|
-+ |
4701 |
PCIe Base Specification 5.0 Section 8.3.9 Symbol CTX |
|
|
|
-+ |
4705 |
Section 4.7.2 and Appendix A. |
|
|
|
4706 |
-7.0 dB at 16 GHz for SFF1 |
|
|
|
4707 |
Section 4.7.11 for LFF |
|
4621 |
Also refer to the PCIe Base Specification Section 8.3.5 |
<> |
4710 |
Also refer to the PCIe Base Specification 4.0 Section 8.3.5 |
|
|
|
4711 |
Section 4.7.3 for 8 GT/s, 16 GT/s and 32 GT/s. |
|
|
|
4712 |
Also refer to the PCIe Base Specification 5.0 Section 8.3.5 |
|
|
|
-+ |
4715 |
Section 4.7.4 |
|
|
|
-+ |
4718 |
Section 4.7.5 |
|
|
|
-+ |
4721 |
Section 4.7.6 and PCIe Base Spec Chapter 9 |
|
|
|
-+ |
4724 |
Section 4.7.7 |
|
|
|
-+ |
4727 |
Section 4.7.8 |
|
|
|
-+ |
4730 |
Section 4.7.9 |
|
|
|
4731 |
Note 1: OCP NIC 3.0 SFF deviates from the PCIe CEM specification on Insertion Loss Values at PCIe Gen5 speeds (32GT/s only). |
|
4639 |
For PCIe transmit and receive differential pairs, the target impedance is 85 Ohms ±10%. |
<> |
4737 |
For PCIe transmit and receive differential pairs, the target impedance is 85 Ω ±10%. |
4640 |
For the PCIe REFCLKs, the target impedance is 100 Ohms ±10%. |
|
4738 |
For the PCIe REFCLKs, the target impedance is 100 Ω ±10%. |
|
4642 |
Test Fixtures are designed using the PCIe CEM 4.0 CLB and CBB. The fixtures host interface has been modified to the OCP connector standard and there are two version of the fixtures, one for Gen 3 PCIe and one for Gen 4 PCIe. Careful attention has been placed on these fixtures to help insure that standard test equipment automation should work without significant modification. |
<> |
4740 |
Test Fixtures are designed using the PCIe CEM CLB and CBB. The fixtures host interface has been modified to the OCP connector standard and there are three versions of the fixtures for both the SFF and LFF OCP NIC 3.0 cards for Gen 3, Gen 4 and Gen 5 PCIe rates. Careful attention has been placed on these fixtures to help ensure that standard test equipment automation should work without significant modification. PCIe Gen 5 automation scripts may need to be modified as the OCP NIC 3.0 insertion loss budget differs from the PCIe CEM 5.0 32GT/s values. |
4643 |
Table 59: PCIe Test Fixtures for OCP NIC 3.0 |
|
4741 |
Table 60: PCIe Test Fixtures for OCP NIC 3.0 |
|
|
|
-+ |
4750 |
Gen 5 |
|
|
|
4751 |
TBD |
|
|
|
-+ |
4757 |
Gen 5 |
|
|
|
4758 |
TBD |
|
4658 |
Figure 115: PCIe Load Board Test Fixture for OCP NIC 3.0 SFF |
<> |
4760 |
Figure 116: PCIe Load Board Test Fixture for OCP NIC 3.0 SFF |
|
4660 |
Figure 116: PCIe Base Board Test Fixture for OCP NIC 3.0 SFF |
<> |
4762 |
Figure 117: PCIe Base Board Test Fixture for OCP NIC 3.0 SFF |
|
|
|
-+ |
4765 |
For PCIe Gen 5.0, OCP NIC 3.0 modifies the insertion loss budget on the SFF as shown in Table 59 and the test methodology may need to be adjusted to compensate for this difference. The electrical interface may be tested against the PCI Express® Architecture PHY Test Specification Revision 5.0, providing that the appropriate test fixtures from Section 5.3.2 are used and the insertion loss difference is compensated. |
|
4673 |
The airflow in typical server systems will approach from the card edge or heatsink side of the card. This airflow direction is referred to as Hot Aisle cooling and is illustrated below in Figure 117. The term Hot Aisle refers to the card being located at the rear of the system where the local inlet airflow is preheated by the upstream system components (e.g., HDD, CPU, DIMM, etc.). |
<> |
4776 |
The airflow in typical server systems will approach from the card edge or heatsink side of the card. This airflow direction is referred to as Hot Aisle cooling and is illustrated below in Figure 118. The term Hot Aisle refers to the card being located at the rear of the system where the local inlet airflow is preheated by the upstream system components (e.g., HDD, CPU, DIMM, etc.). |
4674 |
Figure 117: Airflow Direction for Hot Aisle Cooling (SFF and LFF) |
|
4777 |
Figure 118: Airflow Direction for Hot Aisle Cooling (SFF and LFF) |
4675 |
The boundary conditions for Hot Aisle cooling are shown below in Table 60 and Table 61. The low temperature is listed at 5°C and assumes fresh air could be ducted to the back of the system from the front. More typically the inlet temperature to the OCP NIC 3.0 card will be in the same range as PCIe cards located at the back of the system (55°C local inlet temperature). Depending on the system design, power density, and airflow the inlet temperature to the OCP NIC 3.0 card may be as high as 60°C or 65°C. The airflow velocities listed in Table 61 represent the airflow velocities typical in mainstream servers. Higher airflow velocities are available within the Hot Aisle cooling tiers listed in Table 66 but card designers must be sure to understand the system level implications of such high card LFM requirements. |
|
4778 |
The boundary conditions for Hot Aisle cooling are shown below in Table 61 and Table 62. The low temperature is listed at 5 °C and assumes fresh air could be ducted to the back of the system from the front. More typically the inlet temperature to the OCP NIC 3.0 card will be in the same range as PCIe cards located at the back of the system (55 °C local inlet temperature). Depending on the system design, power density, and airflow the inlet temperature to the OCP NIC 3.0 card may be as high as 60 °C or 65 °C. The airflow velocities listed in Table 62 represent the airflow velocities typical in mainstream servers. Higher airflow velocities are available within the Hot Aisle cooling tiers listed in Table 67 but card designers must be sure to understand the system level implications of such high card LFM requirements. |
|
4677 |
Table 60: Hot Aisle Air Temperature Boundary Conditions |
<> |
4780 |
Table 61: Hot Aisle Air Temperature Boundary Conditions |
|
4683 |
5ׄ°C |
<> |
4786 |
5 °C |
|
4685 |
55°C |
<> |
4788 |
55 °C |
4686 |
60°C |
|
4789 |
60 °C |
4687 |
65°C |
|
4790 |
65 °C |
|
4689 |
Table 61: Hot Aisle Airflow Boundary Conditions |
<> |
4792 |
Table 62: Hot Aisle Airflow Boundary Conditions |
|
4700 |
When installed in the front of a server the airflow will approach from the I/O connector (e.g., SFP, QSFP or RJ45) side of the card. This airflow direction is referred to as Cold Aisle cooling and is illustrated below in Figure 118. The term Cold Aisle refers to the card being located at the front of the system where the local inlet airflow is assumed to be the same temperature as the system inlet airflow. |
<> |
4803 |
When installed in the front of a server the airflow will approach from the I/O connector (e.g., SFP, QSFP or RJ45) side of the card. This airflow direction is referred to as Cold Aisle cooling and is illustrated below in Figure 119. The term Cold Aisle refers to the card being located at the front of the system where the local inlet airflow is assumed to be the same temperature as the system inlet airflow. |
4701 |
Figure 118: Airflow Direction for Cold Aisle Cooling (SFF and LFF) |
|
4804 |
Figure 119: Airflow Direction for Cold Aisle Cooling (SFF and LFF) |
4702 |
The boundary conditions for Cold Aisle cooling are shown below in Table 62 and Table 63. The temperature values listed in Table 62 assume the inlet temperature to the OCP NIC 3.0 card to be the same as the system inlet. The low, typical, high, and max temperatures listed align with the ASHRAE A1, A2, A3, and A4 environmental classes. Depending on the system, the supported ASHRAE class may limit the maximum temperature to the OCP 3.0 NIC card. However, for more broad industry support, cards should be designed to the upper end of the ASHRAE classes (e.g., class A4). |
|
4805 |
The boundary conditions for Cold Aisle cooling are shown below in Table 63 and Table 64. The temperature values listed in Table 63 assume the inlet temperature to the OCP NIC 3.0 card to be the same as the system inlet. The low, typical, high, and max temperatures listed align with the ASHRAE A1, A2, A3, and A4 environmental classes. Depending on the system, the supported ASHRAE class may limit the maximum temperature to the OCP 3.0 NIC card. However, for more broad industry support, cards should be designed to the upper end of the ASHRAE classes (e.g., class A4). |
4703 |
Table 62: Cold Aisle Air Temperature Boundary Conditions |
|
4806 |
Table 63: Cold Aisle Air Temperature Boundary Conditions |
|
4709 |
5°C |
<> |
4812 |
5 °C |
4710 |
25-35°C |
|
4813 |
25-35 °C |
|
4712 |
40°C |
<> |
4815 |
40 °C |
|
4714 |
45°C |
<> |
4817 |
45 °C |
|
4716 |
Table 63: Cold Aisle Airflow Boundary Conditions |
<> |
4819 |
Table 64: Cold Aisle Airflow Boundary Conditions |
|
4729 |
The ASIC or controller chip is typically the highest power component on the card. Thus, as OCP NIC 3.0 cards are developed it is important to understand the ASIC cooling capability. Figure 119 below provides an estimate of the maximum ASIC power that can be supported as a function of the local inlet velocity for the SFF card in a hot aisle cooling configuration. Each curve in Figure 119 represents a different local inlet air temperature from 45°C to 65°C. |
<> |
4832 |
The ASIC or controller chip is typically the highest power component on the card. Thus, as OCP NIC 3.0 cards are developed it is important to understand the ASIC cooling capability. Figure 120 below provides an estimate of the maximum ASIC power that can be supported as a function of the local inlet velocity for the SFF card in a hot aisle cooling configuration. Each curve in Figure 120 represents a different local inlet air temperature from 45 °C to 65 °C. |
4730 |
Figure 119: ASIC Supportable Power for Hot Aisle Cooling – SFF |
|
4833 |
Figure 120: ASIC Supportable Power for Hot Aisle Cooling – SFF |
4731 |
The curves shown in Figure 119 were obtained using CFD analysis of a reference OCP NIC 3.0 SFF card. The reference card has a 20 mm x 20 mm ASIC with two QSFP connectors. Figure 120 shows a comparison of the 3D CAD and CFD model geometry for the reference OCP NIC 3.0 card. Additional card geometry parameters and boundary conditions used in the reference CFD analysis are summarized in Table 64. The OCP NIC 3.0 simulation was conducted within a virtual version of the test fixture defined in Section 6.4. |
|
4834 |
The curves shown in Figure 120 were obtained using CFD analysis of a reference OCP NIC 3.0 SFF card. The reference card has a 20 mm x 20 mm ASIC with two QSFP connectors. Figure 121 shows a comparison of the 3D CAD and CFD model geometry for the reference OCP NIC 3.0 card. Additional card geometry parameters and boundary conditions used in the reference CFD analysis are summarized in Table 65. The OCP NIC 3.0 simulation was conducted within a virtual version of the test fixture defined in Section 6.4. |
4732 |
Figure 120: OCP NIC 3.0 SFF Reference Design and CFD Geometry |
|
4835 |
Figure 121: OCP NIC 3.0 SFF Reference Design and CFD Geometry |
4733 |
Table 64: Reference OCP NIC 3.0 SFF Card Geometry |
|
4836 |
Table 65: Reference OCP NIC 3.0 SFF Card Geometry |
|
4763 |
95°C |
<> |
4866 |
95 °C |
|
4766 |
An increase in the supported ASIC power or a decrease in the required airflow velocity may be achieved through heatsink size and material changes. For example, a larger heatsink or a heatsink made out of copper could improve ASIC cooling and effectively shift up the supportable power curves shown in Figure 119. |
<> |
4869 |
An increase in the supported ASIC power or a decrease in the required airflow velocity may be achieved through heatsink size and material changes. For example, a larger heatsink or a heatsink made out of copper could improve ASIC cooling and effectively shift up the supportable power curves shown in Figure 120. |
4767 |
It is important to point out that the curves shown in Figure 119 represent only the maximum ASIC power that can be supported vs. the supplied inlet velocity. Other heat loads on the card may require airflow velocities above and beyond that required to cool the ASIC. SFP or QSFP optical transceivers located downstream of the AISC will in many cases pose a greater cooling challenge than the ASIC cooling. Cooling the optical transceivers becomes even more difficult as the ASIC power is increased due to additional preheating of the air as it moves through the ASIC heatsink. OCP NIC 3.0 designers must consider all heat sources early in the design process to ensure the card thermal solution is sufficient for the feature set. In addition, OCP NIC 3.0 designers must consider all power modes in the design process – including S0 (Main Power Mode) and S5 (Aux Power Mode). For both modes, the card designer must provide the airflow requirements in the OEM FRU record as described in Section 4.10.3. |
|
4870 |
It is important to point out that the curves shown in Figure 120 represent only the maximum ASIC power that can be supported vs. the supplied inlet velocity. Other heat loads on the card may require airflow velocities above and beyond that required to cool the ASIC. SFP or QSFP optical transceivers located downstream of the AISC will in many cases pose a greater cooling challenge than the ASIC cooling. Cooling the optical transceivers becomes even more difficult as the ASIC power is increased due to additional preheating of the air as it moves through the ASIC heatsink. OCP NIC 3.0 designers must consider all heat sources early in the design process to ensure the card thermal solution is sufficient for the feature set. In addition, OCP NIC 3.0 designers must consider all power modes in the design process – including Main Power Mode and Aux Power Mode. For both modes, the card designer must provide the airflow requirements in the OEM FRU record as described in Section 4.10.3. |
4768 |
Card designers must also consider the airflow capability of the server systems that the cards are targeted for use within. Figure 121 below shows the SFF ASIC supportable power curves with an overlay of three server airflow capability ranges. Designers must ensure that their thermal solutions and resulting card airflow requirements fall within the range of supportable system airflow velocity. Cards that are under-designed (e.g., require airflow greater than the system capability) will have thermal issues when deployed into the server system. Card designers are advised to work closely with system vendors to ensure they target the appropriate airflow and temperature boundary conditions. |
|
4871 |
Card designers must also consider the airflow capability of the server systems that the cards are targeted for use within. Figure 122 below shows the SFF ASIC supportable power curves with an overlay of three server airflow capability ranges. Designers must ensure that their thermal solutions and resulting card airflow requirements fall within the range of supportable system airflow velocity. Cards that are under-designed (e.g., require airflow greater than the system capability) will have thermal issues when deployed into the server system. Card designers are advised to work closely with system vendors to ensure they target the appropriate airflow and temperature boundary conditions. |
4769 |
Figure 121: Server System Airflow Capability – SFF Card Hot Aisle Cooling |
|
4872 |
Figure 122: Server System Airflow Capability – SFF Card Hot Aisle Cooling |
4770 |
The server airflow capability is typically more restrictive when the OCP card is operating in standby mode (S5). The airflow available from the system cooling solution is often more restrictive due to limited power budget available in an S5 state. The graph below emphasizes that though the local OCP NIC 3.0 air temperature is typically lower than in S0 (since preheating from upstream components should be greatly reduced while in standby), the upper bound of local air velocity is a fraction of what can be generated when the system is in main power mode (S0). Card vendors must test for these conditions, making sure that the provided cooling is sufficient for both the ASIC and any installed transceivers (which will still be receiving preheat from the ASIC in S5 mode). |
|
4873 |
The server airflow capability is typically more restrictive when the OCP card is operating in Aux Power Mode. The airflow available from the system cooling solution is often more restrictive due to limited power budget available in Aux Power Mode. The graph below emphasizes that though the local OCP NIC 3.0 air temperature is typically lower in Main Power Mode (since preheating from upstream components should be greatly reduced while in standby), the upper bound of local air velocity is a fraction of what can be generated when the system is in Main Power Mode. Card vendors must test for these conditions, making sure that the provided cooling is sufficient for both the ASIC and any installed transceivers (which will still be receiving preheat from the ASIC in Aux Power Mode). |
4771 |
The NIC vendor shall provide the required LFM during S5 state in the FRU EEPROM (see Section 4.10.3). The cold aisle should be tested at 35°C; the hot aisle should be tested at 45°C. |
|
4874 |
The NIC vendor shall provide the required LFM during for Aux Power Mode in the FRU EEPROM (see Section 4.10.3). The cold aisle should be tested at 35 °C; the hot aisle should be tested at 45 °C. |
4772 |
Figure 122: Server System Airflow Capability – SFF Card Hot Aisle Cooling in standby (S5) mode |
|
4875 |
Figure 123: Server System Airflow Capability – SFF Card Hot Aisle Cooling in Aux Power Mode |
|
4774 |
Figure 123 below provides an estimate of the maximum ASIC power that can be supported as a function of the local inlet velocity for the LFF card in a hot aisle cooling configuration. Each curve in Figure 123 represents a different local inlet air temperature from 45°C to 65°C. |
<> |
4877 |
Figure 124 below provides an estimate of the maximum ASIC power that can be supported as a function of the local inlet velocity for the LFF card in a hot aisle cooling configuration. Each curve in Figure 124 represents a different local inlet air temperature from 45 °C to 65 °C. |
4775 |
Figure 123: ASIC Supportable Power for Hot Aisle Cooling – LFF Card |
|
4878 |
Figure 124: ASIC Supportable Power for Hot Aisle Cooling – LFF Card |
4776 |
The curves shown in Figure 123 were obtained using CFD analysis of the reference OCP NIC 3.0 LFF card. The reference card has a 45 mm x 45 mm ASIC with two QSFP connectors. Additional card geometry parameters and boundary conditions used in the reference CFD analysis are summarized in Table 65. Figure 124 shows a comparison of the 3D CAD and CFD model geometry for the reference OCP NIC 3.0 card. |
|
4879 |
The curves shown in Figure 124 were obtained using CFD analysis of the reference OCP NIC 3.0 LFF card. The reference card has a 45 mm x 45 mm ASIC with two QSFP connectors. Additional card geometry parameters and boundary conditions used in the reference CFD analysis are summarized in Table 66. Figure 125 shows a comparison of the 3D CAD and CFD model geometry for the reference OCP NIC 3.0 card. |
4777 |
Figure 124: OCP NIC 3.0 LFF Reference Design and CFD Geometry |
|
4880 |
Figure 125: OCP NIC 3.0 LFF Reference Design and CFD Geometry |
4778 |
Table 65: Reference OCP NIC 3.0 LFF Card Geometry |
|
4881 |
Table 66: Reference OCP NIC 3.0 LFF Card Geometry |
|
4808 |
95°C |
<> |
4911 |
95 °C |
|
4811 |
It is important to note that the supportable power for the LFF card is considerably higher than for the SFF card due to the increased size of the ASIC heatsink. In addition, optics module cooling on the LFF card will also be considerably improved due to the arrangement of the optics in parallel to the ASIC heatsink rather than in series. These thermal advantages are key drivers for the LFF card geometry. The OCP NIC 3.0 simulation was conducted within a virtual version of the LFF card test fixture defined in Section 6.4. In addition, OCP NIC 3.0 designers must consider all power modes in the design process – including S0 (Main Power Mode) and S5 (Aux Power Mode). For both modes, the card designer must provide the airflow requirements in the OEM FRU record as described in Section 4.10.3. |
<> |
4914 |
It is important to note that the supportable power for the LFF card is considerably higher than for the SFF card due to the increased size of the ASIC heatsink. In addition, optics module cooling on the LFF card will also be considerably improved due to the arrangement of the optics in parallel to the ASIC heatsink rather than in series. These thermal advantages are key drivers for the LFF card geometry. The OCP NIC 3.0 simulation was conducted within a virtual version of the LFF card test fixture defined in Section 6.4. In addition, OCP NIC 3.0 designers must consider all power modes in the design process – including Main Power Mode and Aux Power Mode. For both modes, the card designer must provide the airflow requirements in the OEM FRU record as described in Section 4.10.3. |
4812 |
Figure 125 below shows the LFF ASIC supportable power curves with an overlay of three server airflow capability ranges. Designers must ensure that their thermal solutions and resulting card airflow requirements fall within the range of supportable system airflow velocity. Cards that are under-designed (e.g., require airflow greater than the system capability) will have thermal issues when deployed into the server system. Card designers are advised to work closely with system vendors to ensure they target the appropriate airflow and temperature boundary conditions. |
|
4915 |
Figure 126 below shows the LFF ASIC supportable power curves with an overlay of three server airflow capability ranges. Designers must ensure that their thermal solutions and resulting card airflow requirements fall within the range of supportable system airflow velocity. Cards that are under-designed (e.g., require airflow greater than the system capability) will have thermal issues when deployed into the server system. Card designers are advised to work closely with system vendors to ensure they target the appropriate airflow and temperature boundary conditions. |
4813 |
Figure 125: Server System Airflow Capability – LFF Card Hot Aisle Cooling |
|
4916 |
Figure 126: Server System Airflow Capability – LFF Card Hot Aisle Cooling |
|
4816 |
The ASIC cooling analysis for the SFF Card in the Cold Aisle configuration was conducted utilizing the same geometry and boundary conditions described in Figure 120 and Table 64 with airflow moving from I/O connector to ASIC (opposite to the Hot Aisle analysis). Figure 126 below shows the results of this analysis for the Cold Aisle cooling configuration. Each curve in Figure 126 represents a different system inlet air temperature from 25°C to 45°C. |
<> |
4919 |
The ASIC cooling analysis for the SFF Card in the Cold Aisle configuration was conducted utilizing the same geometry and boundary conditions described in Figure 121 and Table 65 with airflow moving from I/O connector to ASIC (opposite to the Hot Aisle analysis). Figure 127 below shows the results of this analysis for the Cold Aisle cooling configuration. Each curve in Figure 127 represents a different system inlet air temperature from 25 °C to 45 °C. |
|
4818 |
Figure 126: ASIC Supportable Power for Cold Aisle Cooling – SFF Card |
<> |
4921 |
Figure 127: ASIC Supportable Power for Cold Aisle Cooling – SFF Card |
4819 |
Similar to Figure 121 for Hot Aisle cooling, Figure 127 below shows the ASIC supportable power curves with an overlay of three Cold Aisle server airflow capability ranges. Designers must ensure that their thermal solutions and resulting card airflow requirements fall within the range of supportable Cold Aisle system airflow velocity. Cards that are under-designed (e.g., require airflow greater than the system capability) will have thermal issues when deployed into the server system. Similar to the Hot Aisle cases, cooling of the optical transceivers need to be taken into consideration even though they are not preheated by the ASIC in the Cold Aisle case. OCP NIC 3.0 designers must consider all power modes in the design process – including S0 (Main Power Mode) and S5 (Aux Power Mode). For both modes, the card designer must provide the airflow requirements in the OEM FRU record as described in Section 4.10.3. Card designers are advised to work closely with system vendors to ensure they target the appropriate airflow and temperature boundary conditions for both Hot and Cold Aisle cooling. |
|
4922 |
Similar to Figure 122 for Hot Aisle cooling, Figure 128 below shows the ASIC supportable power curves with an overlay of three Cold Aisle server airflow capability ranges. Designers must ensure that their thermal solutions and resulting card airflow requirements fall within the range of supportable Cold Aisle system airflow velocity. Cards that are under-designed (e.g., require airflow greater than the system capability) will have thermal issues when deployed into the server system. Similar to the Hot Aisle cases, cooling of the optical transceivers need to be taken into consideration even though they are not preheated by the ASIC in the Cold Aisle case. OCP NIC 3.0 designers must consider all power modes in the design process – including Main Power Mode and Aux Power Mode. For both modes, the card designer must provide the airflow requirements in the OEM FRU record as described in Section 4.10.3. Card designers are advised to work closely with system vendors to ensure they target the appropriate airflow and temperature boundary conditions for both Hot and Cold Aisle cooling. |
4820 |
Figure 127: Server System Airflow Capability – SFF Cold Aisle Cooling |
|
4923 |
Figure 128: Server System Airflow Capability – SFF Cold Aisle Cooling |
4821 |
A comparison of Hot Aisle (55°C) and Cold Aisle (35°C) SFF ASIC cooling capability curves is shown below in Figure 128. The comparison shows the Hot Aisle ASIC cooling capability at 12 W at 150 LFM while the cold Aisle cooling capability shows support for 19 W at 150 LFM. In general, based on the reference geometry, the Cold Aisle cooling configuration allows for higher supported ASIC power at lower velocities due primarily to the lower inlet temperatures local to the OCP NIC 3.0 card when in the Cold Aisle cooling configuration. |
|
4924 |
A comparison of Hot Aisle (55 °C) and Cold Aisle (35 °C) SFF ASIC cooling capability curves is shown below in Figure 129. The comparison shows the Hot Aisle ASIC cooling capability at 12 W at 150 LFM while the cold Aisle cooling capability shows support for 19 W at 150 LFM. In general, based on the reference geometry, the Cold Aisle cooling configuration allows for higher supported ASIC power at lower velocities due primarily to the lower inlet temperatures local to the OCP NIC 3.0 card when in the Cold Aisle cooling configuration. |
4822 |
Figure 128: ASIC Supportable Power Comparison – SFF Card |
|
4925 |
Figure 129: ASIC Supportable Power Comparison – SFF Card |
|
4824 |
The ASIC cooling analysis for the LFF card in Cold Aisle configuration was conducted utilizing the same geometry and boundary conditions described in Figure 124 and Table 65 with airflow moving from I/O connector to ASIC (opposite to the Hot Aisle analysis). Figure 129 below shows the results of this analysis for the Cold Aisle cooling configuration. Each curve in Figure 129 represents a different system inlet air temperature from 25°C to 45°C. |
<> |
4927 |
The ASIC cooling analysis for the LFF card in Cold Aisle configuration was conducted utilizing the same geometry and boundary conditions described in Figure 125 and Table 66 with airflow moving from I/O connector to ASIC (opposite to the Hot Aisle analysis). Figure 130 below shows the results of this analysis for the Cold Aisle cooling configuration. Each curve in Figure 130 represents a different system inlet air temperature from 25 °C to 45 °C. |
4825 |
Figure 129: ASIC Supportable Power for Cold Aisle Cooling – LFF Card |
|
4928 |
Figure 130: ASIC Supportable Power for Cold Aisle Cooling – LFF Card |
4826 |
Similar to Figure 127 for LFF Hot Aisle cooling, Figure 130 below shows the LFF ASIC supportable power curves with an overlay of three Cold Aisle server airflow capability ranges. Designers must ensure that their thermal solutions and resulting card airflow requirements fall within the range of supportable Cold Aisle system airflow velocity. Cards that are under-designed (e.g., require airflow greater than the system capability) will have thermal issues when deployed into the server system. Similar to the Hot Aisle cases, cooling of the optical transceivers need to be taken into consideration even though they are not preheated by the ASIC in the Cold Aisle case. OCP NIC 3.0 designers must consider all power modes in the design process – including S0 (Main Power Mode) and S5 (Aux Power Mode). For both modes, the card designer must provide the airflow requirements in the OEM FRU record as described in Section 4.10.3. Card designers are advised to work closely with system vendors to ensure they target the appropriate airflow and temperature boundary conditions for both Hot and Cold Aisle cooling. |
|
4929 |
Similar to Figure 128 for LFF Hot Aisle cooling, Figure 131 below shows the LFF ASIC supportable power curves with an overlay of three Cold Aisle server airflow capability ranges. Designers must ensure that their thermal solutions and resulting card airflow requirements fall within the range of supportable Cold Aisle system airflow velocity. Cards that are under-designed (e.g., require airflow greater than the system capability) will have thermal issues when deployed into the server system. Similar to the Hot Aisle cases, cooling of the optical transceivers need to be taken into consideration even though they are not preheated by the ASIC in the Cold Aisle case. OCP NIC 3.0 designers must consider all power modes in the design process – including Main Power Mode and Aux Power Mode. For both modes, the card designer must provide the airflow requirements in the OEM FRU record as described in Section 4.10.3. Card designers are advised to work closely with system vendors to ensure they target the appropriate airflow and temperature boundary conditions for both Hot and Cold Aisle cooling. |
4827 |
Figure 130: Server System Airflow Capability – LFF Cold Aisle Cooling |
|
4930 |
Figure 131: Server System Airflow Capability – LFF Cold Aisle Cooling |
4828 |
A comparison of Hot Aisle (55°C) and Cold Aisle (35°C) LFF ASIC cooling capability curves is shown below in Figure 131. The comparison shows the Hot Aisle ASIC cooling capability at 19 W at 150 LFM while the cold Aisle cooling capability shows support for 42 W at 150 LFM. In general, based on the reference geometry, the Cold Aisle cooling configuration allows for higher supported ASIC power at lower velocities due primarily to the lower inlet temperatures local to the OCP NIC 3.0 card when in the Cold Aisle cooling configuration. |
|
4931 |
A comparison of Hot Aisle (55 °C) and Cold Aisle (35 °C) LFF ASIC cooling capability curves is shown below in Figure 132. The comparison shows the Hot Aisle ASIC cooling capability at 19 W at 150 LFM while the cold Aisle cooling capability shows support for 42 W at 150 LFM. In general, based on the reference geometry, the Cold Aisle cooling configuration allows for higher supported ASIC power at lower velocities due primarily to the lower inlet temperatures local to the OCP NIC 3.0 card when in the Cold Aisle cooling configuration. |
4829 |
Figure 131: ASIC Supportable Power Comparison – LFF Card |
|
4932 |
Figure 132: ASIC Supportable Power Comparison – LFF Card |
|
4849 |
Predefined locations for fixture airflow/temperature sensors on fixture PCB silkscreen. Quantity 3x per SFF board and quantity 4x for LFF – see Figure 137 |
<> |
4952 |
Predefined locations for fixture airflow/temperature sensors on fixture PCB silkscreen. Quantity 3x per SFF board and quantity 4x for LFF – see Figure 138 |
|
4856 |
Images of the SFF thermal test fixture are shown in Figure 132 and Figure 133. The SFF fixture PCB is shown in Figure 134. Note the three candlestick sensor locations directly next to the OCP NIC 3.0 connectors. |
<> |
4959 |
Images of the SFF thermal test fixture are shown in Figure 133 and Figure 134. The SFF fixture PCB is shown in Figure 135. Note the three candlestick sensor locations directly next to the OCP NIC 3.0 connectors. |
4857 |
Figure 132: SFF Thermal Test Fixture Preliminary Design |
|
4960 |
Figure 133: SFF Thermal Test Fixture Preliminary Design |
4858 |
Figure 133: SFF Thermal Test Fixture Preliminary Design – Cover Removed |
|
4961 |
Figure 134: SFF Thermal Test Fixture Preliminary Design – Cover Removed |
4859 |
Figure 134: SFF Card Thermal Test Fixture PCB |
|
4962 |
Figure 135: SFF Card Thermal Test Fixture PCB |
|
4861 |
Images of the LFF thermal test fixture are shown in Figure 135 and Figure 136. The LFF fixture PCB is shown in Figure 137. Note the three candlestick sensor locations directly next to the OCP NIC 3.0 connectors. |
<> |
4964 |
Images of the LFF thermal test fixture are shown in Figure 136 and Figure 137. The LFF fixture PCB is shown in Figure 138. Note the three candlestick sensor locations directly next to the OCP NIC 3.0 connectors. |
4862 |
Figure 135: LFF Card Thermal Test Fixture Design |
|
4965 |
Figure 136: LFF Card Thermal Test Fixture Design |
|
4864 |
Figure 136: LFF Card Thermal Test Fixture Design – Cover Removed |
<> |
4967 |
Figure 137: LFF Card Thermal Test Fixture Design – Cover Removed |
4865 |
Figure 137: LFF Card Thermal Test Fixture PCB |
|
4968 |
Figure 138: LFF Card Thermal Test Fixture PCB |
|
4867 |
When utilizing the OCP NIC 3.0 thermal test fixture, the wind tunnel or flow bench must be configured to push airflow for Hot Aisle cooling or to pull airflow for Cold Aisle cooling as shown in Figure 138. |
<> |
4970 |
When utilizing the OCP NIC 3.0 thermal test fixture, the wind tunnel or flow bench must be configured to push airflow for Hot Aisle cooling or to pull airflow for Cold Aisle cooling as shown in Figure 139. |
4868 |
Figure 138: Thermal Test Fixture Airflow Direction |
|
4971 |
Figure 139: Thermal Test Fixture Airflow Direction |
|
|
|
<> |
4974 |
When measuring the cold aisle inlet temperature, a separate thermocouple in front of the faceplate should be used instead of using the candlestick sensors on-board the thermal test fixture. The thermocouple should be centered on the faceplate area and placed 25 ±2 mm away from the surface. This method is more representative of the cold aisle inlet temperature compared to using the on-board thermal-test fixture candlestick sensors which may be affected by the heat dissipated from the ASIC. |
|
|
|
4975 |
Figure 140: External Thermocouple Placement for Cold Aisle Inlet Temperature Measurement |
4871 |
Figure 139 and Figure 140 below show the air velocity at each sensor location vs. the total fixture flow rate in CFM. The curves shown in these figures are based on the data collected from the CFD models discussed in Section 6.3. Note the error between the velocities obtained from the sensor locations vs. the velocity based on the duct cross-sectional area. |
|
4976 |
Figure 141 and Figure 142 below show the air velocity at each sensor location vs. the total fixture flow rate in CFM. The curves shown in these figures are based on the data collected from the CFD models discussed in Section 6.3. Note the error between the velocities obtained from the sensor locations vs. the velocity based on the duct cross-sectional area. |
4872 |
Figure 139: SFF Fixture, Hot Aisle Flow – Candlestick Air Velocity vs. Volume Flow |
|
4977 |
Figure 141: SFF Fixture, Hot Aisle Flow – Candlestick Air Velocity vs. Volume Flow |
4873 |
Figure 140: LFF Fixture, Hot Aisle Flow – Candlestick Air Velocity vs. Volume Flow |
|
4978 |
Figure 142: LFF Fixture, Hot Aisle Flow – Candlestick Air Velocity vs. Volume Flow |
|
4879 |
Card Cooling Tiers for Hot and Cold Aisle Cooling configurations are defined in Table 66. The values in the table are listed with units shown in LFM. Future releases of this specification will provide more detail to the Card Cooling Tier curve definition. |
<> |
4984 |
Card Cooling Tiers for Hot and Cold Aisle Cooling configurations are defined in Table 67. The values in the table are listed with units shown in LFM. Future releases of this specification will provide more detail to the Card Cooling Tier curve definition. |
4880 |
Table 66: Card Cooling Tier Definitions (LFM) |
|
4985 |
Table 67: Card Cooling Tier Definitions (LFM) |
4881 |
A graphical view of the Card Cooling Tiers is shown in Figure 141. The Tiers range from 0 LFM to as high as 1000 LFM at 55°C local inlet temperature. It is important to understand that the cooling tiers extend well beyond the airflow range of most server systems. As noted in Section 6.2, card designers must consider the airflow capability of the systems that the cards are to be used in when designing the card thermal solution and component placement. Figure 142 and Figure 143 below show the range of typical system capability for Hot Aisle and Cold Aisle configurations. Cards designed to these typical ranges (Tiers 1-6) will be low risk to support in most if not all server systems. Alternatively, cards that require Tier 7 or greater may still work in many server systems but may require extra validation testing, specific system slot location requirements, and potentially ambient temperature and hardware restrictions. |
|
4986 |
A graphical view of the Card Cooling Tiers is shown in Figure 143. The Tiers range from 0 LFM to as high as 1000 LFM at 55 °C local inlet temperature. It is important to understand that the cooling tiers extend well beyond the airflow range of most server systems. As noted in Section 6.2, card designers must consider the airflow capability of the systems that the cards are to be used in when designing the card thermal solution and component placement. Figure 144 and Figure 145 below show the range of typical system capability for Hot Aisle and Cold Aisle configurations. Cards designed to these typical ranges (Tiers 1-6) will be low risk to support in most if not all server systems. Alternatively, cards that require Tier 7 or greater may still work in many server systems but may require extra validation testing, specific system slot location requirements, and potentially ambient temperature and hardware restrictions. |
4882 |
Figure 141: Graphical View of Card Cooling Tiers |
|
4987 |
Figure 143: Graphical View of Card Cooling Tiers |
4883 |
Figure 142: Typical Operating Range for Hot Aisle Configurations |
|
4988 |
Figure 144: Typical Operating Range for Hot Aisle Configurations |
4884 |
Figure 143: Typical Operating Range for Cold Aisle Configurations |
|
4989 |
Figure 145: Typical Operating Range for Cold Aisle Configurations |
|
4890 |
The fixture is comprised of a universal baseplate that allows for attaching SFF or LFF rail guides and simulated chassis faceplates. The baseplate includes an industry standard vibration table hole pattern for securing the UUT for test. Figure 144 and Figure 145 show the SFF and LFF fixtures, respectively. |
<> |
4995 |
The fixture is comprised of a universal baseplate that allows for attaching SFF or LFF rail guides and simulated chassis faceplates. The baseplate includes an industry standard vibration table hole pattern for securing the UUT for test. Figure 146 and Figure 147 show the SFF and LFF fixtures, respectively. |
|
4892 |
Figure 144: SFF Shock and Vibe Fixture |
<> |
4997 |
Figure 146: SFF Shock and Vibe Fixture |
4893 |
Figure 145: LFF Shock and Vibe Fixture |
|
4998 |
Figure 147: LFF Shock and Vibe Fixture |
|
4900 |
Non-operational vibration testing is performed at 1.88 GRMS for a duration of 15 minutes per side per Table 67. |
<> |
5005 |
Non-operational vibration testing is performed at 1.88 GRMS for a duration of 15 minutes per side per Table 68. |
4901 |
Table 67: Random Vibration Testing 1.88 GRMS Profile |
|
5006 |
Table 68: Random Vibration Testing 1.88 GRMS Profile |
|
4930 |
Figure 146: Dye and Pull Type Locations |
<> |
5035 |
Figure 148: Dye and Pull Type Locations |
|
4932 |
Dye coverage of >50% (“D” and “E” in Figure 147) of any Type 2 or Type 3 BGA cracks are present in the test sample. |
<> |
5037 |
Dye coverage of >50% (“D” and “E” in Figure 149) of any Type 2 or Type 3 BGA cracks are present in the test sample. |
|
4934 |
Figure 147: Dye Coverage Percentage |
<> |
5039 |
Figure 149: Dye Coverage Percentage |
|
4961 |
Radiated and Conducted Emissions requirements are based on deployed geographical locations. Refer to Table 68 for details. |
<> |
5066 |
Radiated and Conducted Emissions requirements are based on deployed geographical locations. Refer to Table 69 for details. |
4962 |
Table 68: FCC Class A Radiated and Conducted Emissions Requirements Based on Geographical Location |
|
5067 |
Table 69: FCC Class A Radiated and Conducted Emissions Requirements Based on Geographical Location |
|
4987 |
Safety – requirements are listed in Table 69. |
<> |
5092 |
Safety – requirements are listed in Table 70. |
4988 |
Table 69: Safety Requirements |
|
5093 |
Table 70: Safety Requirements |
|
4997 |
The OCP NIC 3.0 card shall meet or exceed the following ESD immunity requirements listed in Table 70. |
<> |
5102 |
The OCP NIC 3.0 card shall meet or exceed the following ESD immunity requirements listed in Table 71. |
4998 |
Table 70: Immunity (ESD) Requirements |
|
5103 |
Table 71: Immunity (ESD) Requirements |
|
5003 |
EN 55024 may alternatively be reported. Required ±4 kV contact charge and ±8 kV air discharge. |
<> |
5108 |
EN 55024 may alternatively be reported. Required ±4 kV contact discharge and ±8 kV air discharge. |
|
5007 |
Required ±8 kV contact charge and ±15 kV air discharge with interruptions not greater than 2 seconds. The device shall self-recover without operator intervention. |
<> |
5112 |
Required ±8 kV contact discharge and ±15 kV air discharge with interruptions not greater than 2 seconds. The device shall self-recover without operator intervention. |
|
5037 |
- Change NC-SI over RBT RXD/TXD pins to a pull-up instead of a pull down.- Update power sequencing diagram. REFCLK is disabled before silicon transitions to AUX Power Mode. |
<> |
5142 |
- Change NC-SI over RBT RXD/TXD pins to a pull-up instead of a pull down.- Update power sequencing diagram. REFCLK is disabled before silicon transitions to Aux Power Mode. |
|
5077 |
- Section 3.9.x – Clarified ID-Aux and Aux-Main Power Mode transition requirements to prevent sampling health status pins until cards have fully entered into Aux and Main modes to prevent false indication. |
<> |
5182 |
- Section 3.9.x – Clarified ID-Aux and Aux-Main Power Mode transition requirements to prevent sampling health status pins until cards have fully entered into Aux and Main Power Modes to prevent false indication. |
|
5106 |
- Section 3.4.2 – Clarified BIF[0:2]# assertion timing. |
<> |
5211 |
- Section 3.4.2 – Clarified BIF[2:0]# assertion timing. |
|
5152 |
- Sections 6.2.x – Add notes to consider airflow requirements in Aux and Main power modes for SFF & LFF in Hot & Cold Aisle implementations. |
<> |
5257 |
- Sections 6.2.x – Add notes to consider airflow requirements in Aux and Main Power Modes for SFF & LFF in Hot & Cold Aisle implementations. |
|
5164 |
- Section 3.4.1 – Clarify PWRBRK[0:1]# card pull up resistor value as 95kOhm or larger and must meet the TPWRBRK timing parameter per PCIe CEM. Provided recommended Baseboard value between 4.7 kOhm and 10 kOhm. |
<> |
5269 |
- Section 3.4.1 – Clarify PWRBRK[0:1]# card pull up resistor value as 95kΩ or larger and must meet the TPWRBRK timing parameter per PCIe CEM. Provided recommended Baseboard value between 4.7 kΩ and 10 kΩ. |
|
|
|
-+ |
5339 |
OCP NIC 3.0 Subgroup |
|
|
|
5340 |
- General – Fixed Power Sequence Timing Requirements as Heading 2 (was incorrectly changed to Heading 3). Fixed index order for BIF pins as [2:0]. Previous versions of this document had mixed indexes represented as BIF[0:2], and incorrectly as BIF[3:0] in some instances. Fixed index order for PRSNTB pins as [3:0]. |
|
|
|
5341 |
- General – Uniformly changed references for Aux Power Mode and Main Power Mode. Removed references to ACPI power states S5 and S0. Added additional text to Section 3.8.3 and 3.8.4 for the included ACPI power states. |
|
|
|
5342 |
- Section 1.2 – Acknowledgements section updated. Company name updates. |
|
|
|
5343 |
- Section 1.5 – Add Conventions section to define numerical representation in binary and hexadecimal radix. Standardized unit representations per the Bureau International des Poids et Mesures (BIPM). The number and unit are always separated with a space (example: for temperature “5 °C.” Units, where applicable, have been changed to their SI symbol. Most notably, “Ohm” is now represented with the uppercase letter omega “Ω”. |
|
|
|
5344 |
- Section 1.7.2.1, 1.7.2.2 – Minor update to clarify Primary connector is a 4C+ as defined in SFF-TA-1002 and consists of an “OCP Bay” and a “4C” region. |
|
|
|
5345 |
- Section 2.5.1, 2.5.2 – Figure 24 & 29 - Update PCB break off note #3 to include feature max tolerances.- Section 2.8.2 – Figure 40 – Updated dimension notation with parenthesis and add center line labeled as CL DATUM H for consistency across form-factor figures. |
|
|
|
5346 |
- Section 2.8.3 – Figure 43 – Add center line labeled as CL DATUM H for consistency across form-factor figures. |
|
|
|
5347 |
- Section 2.8.4 – Figure 46 – Add center line labeled as CL DATUM H for consistency across form-factor figures. |
|
|
|
5348 |
- Section 3. 4 – Add clarification statement for Aux Power Mode and Main Power Mode in relation to ACPI power states. |
|
|
|
5349 |
- Section 3.4.2 – Add recommendation on the PRSNTB{0:3] strapping resistors values as 0 Ω to 200 Ω. |
|
|
|
5350 |
- Section 3.4.5 – Scan Chain text clarification and diagram updates. |
|
|
|
5351 |
- Section 3.4.6 – Clarified the state of NIC_PWR_GOOD in relation to AUX_PWR_EN, MAIN_PWR_EN and the enabled power domain signals within operational tolerances in the truth table. |
|
|
|
5352 |
- Section 3.8 – Power state machine diagram updated - +12V_EDGE in ID Mode and Programming Mode marked as optional. |
|
|
|
5353 |
- Section 3.8.3 – Clarified that Aux Power Mode includes ACPI power states S3, S4 and S5 as they are equivalent from a power delivery and sequencing perspective. |
|
|
|
5354 |
- Section 3.8.2, 3.8.5 – Clarifications to +12V_EDGE in ID/Programming mode. +12V_EDGE is now marked as optional in these two states. A max permissible leakage voltage is stated and the baseboard has an optional a bleed resistor. |
|
|
|
5355 |
- Section 3.9 – Clarification on the slot power envelope definition (assuming that is the same path the PCI SIG is going). Add 50W power class. Increased +12V_EDGE capacitance limits on 50W, 80W and 150W power class cards. |
|
|
|
5356 |
- Section 3.10.1 – Changed +12V_EDGE on normal power up sequence and programming mode power sequence diagrams to optional. |
|
|
|
5357 |
- Section 4.1 – Change PCIe VDM and MCTP Base over MCTP/PCIe VDM to N/A for RBT Type cards. |
|
|
|
5358 |
- Section 4.4 – Add Warning/Critical/Fatal temperature threshold example text as discussed in the June NIC 3.0 monthly meeting. Define Warning, Critical and Fatal criteria. |
|
|
|
5359 |
- Section 4.10.3 – Modify FRU OEM Record. |
|
|
|
5360 |
Offset 3 - Add new FRU record version for spec version 1.1. |
|
|
|
5361 |
Offset 9 – Clarified this is the Hot aisle standby air flow requirements when using active cables. Defined value 0x0000 for card only supporting passive cables - similar to offset 19. |
|
|
|
5362 |
Offset 11 – Clarified this is the Cold aisle standby air flow requirements when using active cables. Defined value 0x0000 for card only supporting passive cables - similar to offset 19. |
|
|
|
5363 |
Offset 21 – Add QSFP Power Class 8 (10.0 W transceivers). |
|
|
|
5364 |
Offset 24 – Add definition on which ports are supported in Aux Power Mode. |
|
|
|
5365 |
Offset 25 – Add definition for Hot aisle standby air flow requirements when using passive cables or RJ45. |
|
|
|
5366 |
Offset 27 – Add definition for Cold aisle standby air flow requirements when using passive cables or RJ45. |
|
|
|
5367 |
- Section 5.3.x – Add PCIe Gen5 text/fixture/test methodology updates. PCIe Gen5 for SFF uses a max -7.0 dB insertion loss at 16 GHz. |
|
|
|
5368 |
- Section 6.4.4 – Add thermocouple notes for cold-aisle inlet temperature measurements. |
|
|
|
5369 |
1.0.9 |
|
|
|
5370 |
10/28/2020 |
|
|
|
5371 |
OCP NIC 3.0 Subgroup |
|
|
|
5372 |
Document release - version R1.1.0 |
|
|
|
5373 |
1.1.0 |
|
|
|
5374 |
10/xx/2020 |
|
5243 |
- Offset 4, 5 – Clarified that the Card Max Power in Main mode and the Card Max Power in Aux Mode do not include the power consumed by transceivers plugged into the line side receptacle(s). |
<> |
5384 |
- Offset 4, 5 – Clarified that the Card Max Power in Main Power Mode and the Card Max Power in Aux Power Mode do not include the power consumed by transceivers plugged into the line side receptacle(s). |
|
5266 |
- Offset 9, 10 – Clarified hot aisle standby airflow requirement with an approach air temperature of 45°C. |
<> |
5407 |
- Offset 9, 10 – Clarified hot aisle standby airflow requirement with an approach air temperature of 45 °C. |
5267 |
- Offset 11, 12 – Clarified cold aisle standby airflow requirement with an approach air temperature of 35°C. |
|
5408 |
- Offset 11, 12 – Clarified cold aisle standby airflow requirement with an approach air temperature of 35 °C. |
|
|
|
-+ |
5426 |
9/xx/2020 |
|
|
|
5427 |
- Offset 3 - Add new FRU record version for spec version 1.1. |
|
|
|
5428 |
- Offset 9 – Clarified this is the Hot aisle standby air flow requirements when using active cables. Defined value 0x0000 for card only supporting passive cables - similar to offset 19. |
|
|
|
5429 |
- Offset 11 – Clarified this is the Cold aisle standby air flow requirements when using active cables. Defined value 0x0000 for card only supporting passive cables - similar to offset 19. |
|
|
|
5430 |
- Offset 21 – Add QSFP Power Class 8 (10.0 W transceivers). |
|
|
|
5431 |
- Offset 24 – Add definition on which ports are supported in Aux Power Mode. |
|
|
|
5432 |
- Offset 25 – Add definition for Hot aisle standby air flow requirements when using passive cables or RJ45. |
|
|
|
5433 |
- Offset 27 – Add definition for Cold aisle standby air flow requirements when using passive cables or RJ45. |
|
|
|
5434 |
1.1.0 |